Head of NPI (New Product Introduction) / Integration

Key Responsibilities:

NPI Project Management & Execution

• Lead end-to-end NPI programs, from customer engagement to mass production ramp.

• Define NPI project milestones, timelines, and deliverables in alignment with customer expectations.

• Ensure DFM (Design for Manufacturability) and DFx (Design for Excellence) principles are applied early in the development phase.

• Manage multiple concurrent product qualifications and engineering builds (EVT, DVT, PVT) across OSAT sites.

Cross-Functional Coordination

• Serve as the primary interface between customers and OSAT manufacturing teams for NPI activities.

• Work closely with R&D, process engineering, quality, planning, and procurement teams to resolve technical and operational challenges.

• Align with test engineering and assembly engineering teams to optimize test flow, package assembly processes, and yield improvement strategies.

• Ensure smooth handover from NPI to volume production with stable yields and optimized cost.

3. Product & Process Qualification

• Drive product and package qualification (JEDEC, AEC-Q100 for automotive, etc.) in collaboration with quality and reliability teams.

• Review FA (Failure Analysis), DOE (Design of Experiments), and yield analysis results to optimize process windows.

• Ensure compliance with customer and industry standards (e.g., IPC, ISO9001, IATF 16949 for automotive applications).

4. Manufacturing Readiness & Yield Optimization

• Oversee the first article builds, engineering samples, and production ramp readiness.

• Work with industrial engineering and operations to ensure factory capacity, tool readiness, and process stability.

• Identify and mitigate risks related to yield excursions, process variation, and supply chain disruptions.

5. Cost & Efficiency Improvement

• Drive cost-effective NPI execution, ensuring BOM (Bill of Materials), cycle time, and process costs are optimized before volume production.

• Identify opportunities for cycle time reduction, material cost savings, and process automation.

• Ensure smooth transition from NPI to high-volume manufacturing with minimal yield loss and rework.

Qualifications & Skills:

Education:

• Minimum of Bachelor’s or Master’s degree in Engineering (Electronics, Mechanical, Industrial, or Manufacturing) or a related technical field.

Experience:

• Minimum of 10+ years of experience in semiconductor packaging, assembly, or test, with at least 3 years in an NPI leadership role.

• Experience in OSAT, IDM, or semiconductor supply chain environments.

• Strong understanding of advanced packaging technologies (FCBGA, WLCSP, SiP, 2.5D/3D ICs, automotive, or high-reliability applications).

Technical Skills:

• Project Management: Expertise in Agile, PMP, or Six Sigma methodologies for NPI execution.

• Manufacturing & Process Engineering:

• Experience with flip-chip, wire bonding, die attach, molding, and test process flows.

• Knowledge of DFM, SPC (Statistical Process Control), DOE (Design of Experiments), and FA (Failure Analysis).

• Reliability & Qualification Standards: Familiarity with JEDEC, AEC-Q100, MIL-STD, and IPC requirements.

• Data Analytics & Yield Analysis: Proficiency in JMP, Minitab, Python, SQL, or other statistical tools.

Soft Skills:

• Strong leadership and communication skills to manage cross-functional teams and customer interactions.

• Problem-solving mindset with the ability to manage multiple projects under tight deadlines.

• Customer-focused approach to ensure seamless collaboration between OSAT and semiconductor clients.

Preferred Experience (Bonus):

• Experience in high-reliability or automotive semiconductor manufacturing (SEMI standards, IATF 16949, ISO 26262, ASPICE).

• Working knowledge of SAP, MES, and smart factory tools for NPI tracking and production scaling.

• Experience in both PCBA/SMT and IC packaging preferred
• Knowledge in IATF and APQP process
• Exposure to AS9100 with electronics manufacturing preferred