Director, Manufacturing Engineering

As the Director of Manufacturing Engineering at Micron Technology, you will be leading the engineering organization responsible for semiconductor backend assembly processes. This includes overseeing a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to meet quality output targets while striving for best-in-class engineering KPIs. Your key responsibilities will include: - Providing leadership and strategy for the manufacturing engineering team supporting backend assembly operations across multiple product lines. - Defining a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. - Driving cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. - Overseeing the development, qualification, optimization, and sustaining of backend assembly processes. - Implementing best-known methods (BKMs) and process control strategies to ensure process stability and high yield. - Collaborating with package development and NPI teams to ensure successful transition of new products from development to mass production. - Leading automation and smart factory initiatives to improve throughput, reduce manual handling, and enhance process control. - Leading structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time. - Building, mentoring, and retaining a high-performing team of engineers and developing career progression and succession planning for key engineering roles. Qualifications: - Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - 20+ years of experience in semiconductor backend manufacturing with deep expertise in assembly engineering. - Strong knowledge of backend assembly processes and experience with advanced packaging technologies. - Proficiency in engineering methodologies such as Six Sigma, Lean, SPC, FMEA, and DOE. - Strategic thinker with strong project management, communication, and stakeholder engagement abilities. If you are looking for an opportunity to lead a dynamic engineering organization in the semiconductor industry, drive innovation, and make a significant impact on high-volume manufacturing processes, then this role at Micron Technology might be the perfect fit for you. For more information about Micron Technology, Inc. and to explore career opportunities, please visit micron.com/careers.,