6 Wire Bonding Jobs

As the Director of Manufacturing Engineering at Micron Technology, you will be leading the engineering organization responsible for semiconductor backend assembly processes. This includes overseeing a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to meet quality output targets while striving for best-in-class engineering KPIs. Your key responsibilities will include: - Providing leadership and strategy for the manufacturing engineering team supporting backend assembly operations across multiple product lines. - Defining a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. - Driving cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. - Overseeing the development, qualification, optimization, and sustaining of backend assembly processes. - Implementing best-known methods (BKMs) and process control strategies to ensure process stability and high yield. - Collaborating with package development and NPI teams to ensure successful transition of new products from development to mass production. - Leading automation and smart factory initiatives to improve throughput, reduce manual handling, and enhance process control. - Leading structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time. - Building, mentoring, and retaining a high-performing team of engineers and developing career progression and succession planning for key engineering roles. Qualifications: - Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - 20+ years of experience in semiconductor backend manufacturing with deep expertise in assembly engineering. - Strong knowledge of backend assembly processes and experience with advanced packaging technologies. - Proficiency in engineering methodologies such as Six Sigma, Lean, SPC, FMEA, and DOE. - Strategic thinker with strong project management, communication, and stakeholder engagement abilities. If you are looking for an opportunity to lead a dynamic engineering organization in the semiconductor industry, drive innovation, and make a significant impact on high-volume manufacturing processes, then this role at Micron Technology might be the perfect fit for you. For more information about Micron Technology, Inc. and to explore career opportunities, please visit micron.com/careers.,

As the Director of Manufacturing Engineering at Micron Technology, you will lead the semiconductor backend assembly processes, including backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve overseeing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial role in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching best-in-class engineering KPIs. Your key responsibilities will include: 1. **Engineering Leadership & Strategy:** Lead and manage the manufacturing engineering team supporting backend assembly operations across multiple product lines. Define a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. Drive cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. 2. **Process Development & Optimization:** Oversee the development, qualification, optimization, and sustaining of backend assembly processes. Implement best-known methods and process control strategies to ensure process stability and high yield. Apply engineering methodologies like DOE, SPC, FMEA, and root cause analysis for continuous improvement. 3. **New Product Introduction (NPI):** Collaborate with package development and NPI teams to ensure successful transition of new products into mass production. Drive Design for Manufacturability and Design for Assembly initiatives. Own process readiness, capability demonstration, and yield ramp targets during pilot and production ramp-up. 4. **Automation & Digital Transformation:** Drive automation roadmap and smart factory initiatives to improve throughput and enhance process control. Leverage data analytics and equipment data integration for process monitoring and predictive maintenance. Champion Industry 4.0 and AI-driven process optimization. 5. **Cost, Yield & Quality Improvements:** Lead structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time. Collaborate with operations and quality teams to meet customer quality standards. Drive cost reduction programs through material substitution and productivity improvements. 6. **Talent Development & Team Management:** Build, mentor, and retain a high-performing team of engineers. Develop career progression and succession planning for key engineering roles. Foster a culture of accountability, innovation, and continuous learning. **Qualifications:** - Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - 20+ years of experience in semiconductor backend manufacturing with expertise in assembly engineering. - Strong knowledge of backend assembly processes and engineering methodologies. - Leadership skills with a strategic mindset, project management abilities, and strong analytical decision-making. **Key Performance Indicators (KPIs):** - Assembly process yield and in-line scrap rate - NPI cycle time and time-to-production readiness - Engineering issue closure rate - Process CPK > 2.0 - Equipment uptime and OEE - Engineering team retention and engagement **Work Environment & Travel:** Primarily site-based in a high-volume manufacturing environment. Some travel may be required for corporate meetings, customer audits, vendor development, or multi-site alignment. Micron Technology, Inc. is an industry leader in innovative memory and storage solutions, driving advancements in artificial intelligence and 5G applications. If you are ready to lead engineering initiatives in semiconductor backend assembly, visit micron.com/careers for more information.,

As a Process Engineer at A Sahasra Group Company located in Bhiwadi, you will be responsible for process optimization in Die attach, wire bonding, molding, and Sawing processes within the Semiconductor/Electronics industry. With a minimum of 8 years of experience, you will utilize your expertise to optimize critical parameters, standardize processes, and ensure maximum product yield. Your role will involve optimizing and standardizing critical parameters in various processes such as Die attach, wire bonding, molding, and Saw machine. You will collaborate with equipment suppliers, raw material suppliers, and quality teams to achieve process optimization and yield improvement. Additionally, your responsibilities will include preparing yield reports, analyzing rejection rates, monitoring yield trends, and implementing necessary corrective and preventive actions. To qualify for this position, you must hold a B.E/B.Tech or Diploma in Electronics & Communication, Electrical & Electronics, or Mechanical, along with relevant experience in ASM die bonder, wire bonder, molding machines, and Saw machines. Experience with Process Parameter Optimization through Design of Experiments (DOE), Six Sigma certification, FMEA, and SPC knowledge will be advantageous. The ideal candidate will possess excellent communication skills, organizational abilities, and self-motivation. You should be capable of training others, collaborating across disciplines, and maintaining line discipline and work culture. If you are enthusiastic, creative, and dedicated to process engineering, we encourage you to apply by sending your CV to Mehnaz@sahasraelectronics.com. This is a full-time position with a salary as per industry trends, offering an exciting opportunity for a skilled and ambitious Process Engineer to contribute to the optimization and standardization of critical processes in the Semiconductor/Electronics industry.,

Exide Energy Solutions Limited (EESL) is a rapidly growing company with a vision to address social issues related to energy, environment, and resources by producing lithium-ion battery products. We are in the process of establishing India's first Giga plant for manufacturing Lithium Ion Cells in Bengaluru. Currently, we are seeking a Senior Manager Process Engineering to join our manufacturing organization and play a key role in achieving the company's objectives at the Battery Pack Manufacturing Location in Prantij, Gujarat. As a Senior Manager - Process & New Product Development, you will be responsible for Cell Module development (prismatic & cylindrical) and HV/LV Pack line. Your primary focus will be on overseeing the Process Engineering Department and ensuring the successful execution of new programs. Key responsibilities include developing new programs in collaboration with cross-functional teams, ensuring line readiness, creating recipes, developing tooling, and overseeing in-process quality metrics. Additionally, you will be involved in reviewing and implementing process documentation, assessing manufacturing feasibility of new products, and coordinating project updates with relevant stakeholders. The ideal candidate should possess a B.Tech degree with 10-20 years of experience in Process Engineering. You should have a strong background in assembly lines, line development, tooling & fixture development, and a sound understanding of APQP, PPAP, PFMEA, Control plan, Process documentation, and Product life cycle. Experience in Continuous Improvement, Lean Manufacturing, process mapping (VSM), manpower management, and cost reduction strategies is essential for this role. Desired skills for this position include working experience in Electronics part assembly lines, proficiency in Laser welding, Spot welding, leak testing, EOL testing, Wire bonding, Resistance welding, and Project Management. Strong capabilities in Time Management, Cross-Functional Collaboration, Strategic Thinking, and Negotiation Skills will be advantageous in this role. In summary, as a Senior Manager Process Engineering at Exide Energy Solutions Limited, you will play a critical role in driving new product development, optimizing manufacturing processes, and ensuring the successful launch of new products. If you are a dynamic individual with a passion for innovation and a proven track record in Process Engineering, we invite you to join our team and contribute to our mission of creating sustainable energy solutions for a better future.,

Role & responsibilities JD- Subject Matter Expert (SME) Qualification: Bachelors degree in mechanical engineering Experience: Serve as the go-to expert in a specific semiconductor domain (e.g., front-end fab processes, back-end packaging, lithography, metrology, materials, or EDA tools). Guide technical direction for projects, tools, and systems based on industry best practices and innovation. Lead or consult in process development, yield improvement, defect reduction, or technology transfers. Evaluate new technologies and provide feasibility assessments and technical risk analysis. Support cross-functional teams during new product introductions to ensure manufacturability, scalability, and reliability. Define technical specifications and process control parameters Support complex issue resolution using structured root cause analysis (RCA), FMEA, or DOE approaches. Analyze test data and drive corrective and preventive actions. Develop and review technical documents, specifications, design guides, qualification protocols, and best practices. Ensure compliance with industry standards (SEMI, JEDEC, ISO, etc.). Collaborate with design, process, reliability, sourcing, and quality teams. Mentor engineers and conduct internal technical training sessions. Technical Skillset Front-end: Lithography, etch, deposition, CMP, ion implantation Back-end: Assembly, packaging, wire bonding, WLP, bumping, test Device: CMOS, memory, RF, analog/mixed-signal, SiC/GaN Tools: EDA, CAD, DFM, TCAD Materials: Wafers, photoresist, gas/chemicals, substrates Reliability and failure analysis Preferred candidate profile

As the Director of Manufacturing Engineering at Micron Technology, you will play a crucial role in leading the engineering organization responsible for semiconductor backend assembly processes. Your responsibilities will include overseeing various processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your key focus areas will be process development, sustaining engineering, automation, yield enhancement, cost reduction, and successful new package launches into high-volume production. Your role will be instrumental in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching engineering KPIs. Your primary responsibilities will include: 1. **Engineering Leadership & Strategy**: - Lead and manage the manufacturing engineering team supporting backend assembly operations. - Define a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. - Foster cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. 2. **Process Development & Optimization**: - Oversee the development, qualification, optimization, and sustaining of backend assembly processes. - Implement best-known methods and process control strategies to ensure process stability. - Utilize tools like DOE, SPC, FMEA, and RCA to drive process robustness and continuous improvement. 3. **New Product Introduction (NPI)**: - Collaborate with package development and NPI teams for the successful transition of new products to mass production. - Drive Design for Manufacturability (DfM) and Design for Assembly (DfA) initiatives. - Ensure process readiness, capability demonstration, and yield ramp targets during pilot and production ramp-up. 4. **Automation & Digital Transformation**: - Develop automation roadmap and smart factory initiatives to enhance throughput and process control. - Leverage data analytics and MES for process monitoring and predictive maintenance. - Champion Industry 4.0 and AI-driven process optimization. 5. **Cost, Yield & Quality Improvements**: - Lead structured problem-solving to reduce scrap, improve yield, and lower cycle time. - Collaborate with operations and quality teams to meet customer quality standards. - Drive cost reduction programs through material substitution, process simplification, and productivity improvements. 6. **Talent Development & Team Management**: - Build and mentor a high-performing team of engineers. - Develop career progression and succession planning for key engineering roles. - Foster a culture of accountability, innovation, and continuous learning. **Qualifications**: - Education: Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - Experience: 20+ years in semiconductor backend manufacturing, with at least 10 years in a senior engineering management role. - Technical Skills: Strong knowledge of backend assembly processes, experience with advanced packaging technologies, and proficiency in engineering methodologies. - Leadership Skills: Strategic thinker with strong project management and communication abilities. If you are looking to contribute to cutting-edge technology and drive innovation in the semiconductor industry, this role offers a unique opportunity to lead a team of engineers and shape the future of manufacturing at Micron Technology. Note: To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com. Micron Technology prohibits the use of child labor and complies with all applicable labor standards. Candidates are encouraged to use AI tools for resume enhancement, ensuring all information provided is accurate.,