3 Die Attach Jobs

As the Director of Manufacturing Engineering at Micron Technology, you will lead the semiconductor backend assembly processes, including backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve overseeing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial role in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching best-in-class engineering KPIs. Your key responsibilities will include: 1. **Engineering Leadership & Strategy:** Lead and manage the manufacturing engineering team supporting backend assembly operations across multiple product lines. Define a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. Drive cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. 2. **Process Development & Optimization:** Oversee the development, qualification, optimization, and sustaining of backend assembly processes. Implement best-known methods and process control strategies to ensure process stability and high yield. Apply engineering methodologies like DOE, SPC, FMEA, and root cause analysis for continuous improvement. 3. **New Product Introduction (NPI):** Collaborate with package development and NPI teams to ensure successful transition of new products into mass production. Drive Design for Manufacturability and Design for Assembly initiatives. Own process readiness, capability demonstration, and yield ramp targets during pilot and production ramp-up. 4. **Automation & Digital Transformation:** Drive automation roadmap and smart factory initiatives to improve throughput and enhance process control. Leverage data analytics and equipment data integration for process monitoring and predictive maintenance. Champion Industry 4.0 and AI-driven process optimization. 5. **Cost, Yield & Quality Improvements:** Lead structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time. Collaborate with operations and quality teams to meet customer quality standards. Drive cost reduction programs through material substitution and productivity improvements. 6. **Talent Development & Team Management:** Build, mentor, and retain a high-performing team of engineers. Develop career progression and succession planning for key engineering roles. Foster a culture of accountability, innovation, and continuous learning. **Qualifications:** - Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - 20+ years of experience in semiconductor backend manufacturing with expertise in assembly engineering. - Strong knowledge of backend assembly processes and engineering methodologies. - Leadership skills with a strategic mindset, project management abilities, and strong analytical decision-making. **Key Performance Indicators (KPIs):** - Assembly process yield and in-line scrap rate - NPI cycle time and time-to-production readiness - Engineering issue closure rate - Process CPK > 2.0 - Equipment uptime and OEE - Engineering team retention and engagement **Work Environment & Travel:** Primarily site-based in a high-volume manufacturing environment. Some travel may be required for corporate meetings, customer audits, vendor development, or multi-site alignment. Micron Technology, Inc. is an industry leader in innovative memory and storage solutions, driving advancements in artificial intelligence and 5G applications. If you are ready to lead engineering initiatives in semiconductor backend assembly, visit micron.com/careers for more information.,

As a Process Engineer at A Sahasra Group Company located in Bhiwadi, you will be responsible for process optimization in Die attach, wire bonding, molding, and Sawing processes within the Semiconductor/Electronics industry. With a minimum of 8 years of experience, you will utilize your expertise to optimize critical parameters, standardize processes, and ensure maximum product yield. Your role will involve optimizing and standardizing critical parameters in various processes such as Die attach, wire bonding, molding, and Saw machine. You will collaborate with equipment suppliers, raw material suppliers, and quality teams to achieve process optimization and yield improvement. Additionally, your responsibilities will include preparing yield reports, analyzing rejection rates, monitoring yield trends, and implementing necessary corrective and preventive actions. To qualify for this position, you must hold a B.E/B.Tech or Diploma in Electronics & Communication, Electrical & Electronics, or Mechanical, along with relevant experience in ASM die bonder, wire bonder, molding machines, and Saw machines. Experience with Process Parameter Optimization through Design of Experiments (DOE), Six Sigma certification, FMEA, and SPC knowledge will be advantageous. The ideal candidate will possess excellent communication skills, organizational abilities, and self-motivation. You should be capable of training others, collaborating across disciplines, and maintaining line discipline and work culture. If you are enthusiastic, creative, and dedicated to process engineering, we encourage you to apply by sending your CV to Mehnaz@sahasraelectronics.com. This is a full-time position with a salary as per industry trends, offering an exciting opportunity for a skilled and ambitious Process Engineer to contribute to the optimization and standardization of critical processes in the Semiconductor/Electronics industry.,

As the Director of Manufacturing Engineering at Micron Technology, you will play a crucial role in leading the engineering organization responsible for semiconductor backend assembly processes. Your responsibilities will include overseeing various processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your key focus areas will be process development, sustaining engineering, automation, yield enhancement, cost reduction, and successful new package launches into high-volume production. Your role will be instrumental in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching engineering KPIs. Your primary responsibilities will include: 1. **Engineering Leadership & Strategy**: - Lead and manage the manufacturing engineering team supporting backend assembly operations. - Define a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. - Foster cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. 2. **Process Development & Optimization**: - Oversee the development, qualification, optimization, and sustaining of backend assembly processes. - Implement best-known methods and process control strategies to ensure process stability. - Utilize tools like DOE, SPC, FMEA, and RCA to drive process robustness and continuous improvement. 3. **New Product Introduction (NPI)**: - Collaborate with package development and NPI teams for the successful transition of new products to mass production. - Drive Design for Manufacturability (DfM) and Design for Assembly (DfA) initiatives. - Ensure process readiness, capability demonstration, and yield ramp targets during pilot and production ramp-up. 4. **Automation & Digital Transformation**: - Develop automation roadmap and smart factory initiatives to enhance throughput and process control. - Leverage data analytics and MES for process monitoring and predictive maintenance. - Champion Industry 4.0 and AI-driven process optimization. 5. **Cost, Yield & Quality Improvements**: - Lead structured problem-solving to reduce scrap, improve yield, and lower cycle time. - Collaborate with operations and quality teams to meet customer quality standards. - Drive cost reduction programs through material substitution, process simplification, and productivity improvements. 6. **Talent Development & Team Management**: - Build and mentor a high-performing team of engineers. - Develop career progression and succession planning for key engineering roles. - Foster a culture of accountability, innovation, and continuous learning. **Qualifications**: - Education: Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - Experience: 20+ years in semiconductor backend manufacturing, with at least 10 years in a senior engineering management role. - Technical Skills: Strong knowledge of backend assembly processes, experience with advanced packaging technologies, and proficiency in engineering methodologies. - Leadership Skills: Strategic thinker with strong project management and communication abilities. If you are looking to contribute to cutting-edge technology and drive innovation in the semiconductor industry, this role offers a unique opportunity to lead a team of engineers and shape the future of manufacturing at Micron Technology. Note: To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com. Micron Technology prohibits the use of child labor and complies with all applicable labor standards. Candidates are encouraged to use AI tools for resume enhancement, ensuring all information provided is accurate.,