RDC FTE Sr Engg

Job Description

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Function Qualcomm seeks candidates to help design reference designs and solutions for customers using Qualcomm hardware and software. The role involves working with the Customer Engineering team on product designs, supporting Qualcomm's platforms and applications, and collaborating with internal stakeholders. Responsibilities include creating reference designs, supporting hardware design sign-offs, system/PCB/chip-level debugging, and managing design collaterals to accelerate product development for customers. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Preferred Qualifications A strong understanding of Digital/baseband HW design and PCB design is required. Good troubleshooting skills with the ability to analyze and debug during board bring up (boot-up) are essential. An understanding of LDO/SMPS is essential, along with experience in power management for portable devices being advantageous. Solid knowledge in High-Speed digital interfaces, such as memory Bus I/F (UFS, eMMC, LPDDR, NAND), Display interfaces (parallel and serial, preferably MIPI DSI), Camera interfaces (parallel and serial, preferably MIPI CSI), High Speed peripherals (USB, SDC, PCIe, Ethernet), and Standard Peripheral interfaces (UART, SPI, I2C, JTAG, HDMI) are necessary. Experience with Digital HW/baseband systems and board-level design, as well as familiarity with Digital ASICs and system design, is important. Understanding of system-level clocking schemes, interface-level handshakes are necessary A strong understanding of mobile and consumer electronics products is needed. Hands-on experience with oscilloscopes, logic analyzers, test and measurement tools are required. Basic knowledge of ARM processors and experience with JTAG emulators, display drivers, and memory is preferable. Knowledge of multi-core system/inter-chip system design is advantageous. A strong understanding of PCB signal/power integrity is necessary Reviewing schematics and suggesting improvements is required. Experience with schematic entry is necessary; must have knowledge to review PCB layout in various CAD tools like Cadence Allegro, Siemens Mentor Graphics suite. Hands-on with PCB layout edit tools is advantageous Knowledge of multi-layer PCB designs, vias, and stack-up configuration is essential. The ability to interact with multi-geography customers and stakeholders is desired. Knowledge of prototyping platforms like Arduino and Raspberry Pi is beneficial. Coding skills with Python or C is advantageous. As a member of Qualcomm's Customer Engineering team, responsibilities include creating reference designs, chip and chipset documentation, reference schematics, and training materials for global customer support. Candidate will assist with hardware design reviews, respond to technical queries, and troubleshoot designs at the system, SoC, and PCB levels. A minimum of 3 years' relevant experience is required, along with skills in hardware, digital/high speed/power management, and Silicon validation. Keywords Board Design, Board bring up, UFS, LPDDR, NAND, eMMC, MIPI, USB, UART, SPI, I2C, Logic Analyzer, PADS, Allegro, LDO, SMPS, Clocks, Crystal, ARM processor, JTAG Job Function Qualcomm seeks candidates to help design reference designs and solutions for customers using Qualcomm hardware and software. The role involves working with the Customer Engineering team on product designs, supporting Qualcomm's platforms and applications, and collaborating with internal stakeholders. Responsibilities include creating reference designs, supporting hardware design sign-offs, system/PCB/chip-level debugging, and managing design collaterals to accelerate product development for customers.