29 Power Integrity Jobs

Key Responsibilities: Actively gather the necessary models and input to run the simulation from datasheets, supplier contacts, and websites. Perform PCB level SI and PI (DC & AC Drop) analysis and provide layout optimization recommendations based on the results. Perform S-parameter simulation and bench verification to verify and control matched impedances. Perform high-frequency Signal Integrity testing, including compliance and debugging required for product development. Needs to be detail-oriented, be able to document test plans, execute test procedures, and generate reports. Job Requirements and Skills Experience in the PCB design process: schematic capture, layout, generation of design files, BOMs, and release. Worked with schematic capture tools like OrCAD & Allegro PCB. Experience in the generation of Gerber files and PCB fabrication processes. Expert in the PCB layout process conforming to IPC standards and electrical and mechanical constraints of printed circuit board design, fabrication, and assembly. Componenet footprint/library creation. Experience in reading component datasheets. Experience in PCB stack-up analysis Hands-on experience in PCB modeling and Package modeling. Working knowledge of High-Speed design and RF principles (S-parameters, Impedance, etc.). Strong Signal/Power Integrity fundamentals Experience in simulating (FD/TD) memory interfaces for Board and Package is required (DDR3/DDR4, LPDDR3/4) Experience in simulating (FD/TD) High-Speed Serial IO interfaces for Board and Package is required (PCIe Gen3/4, RGMII...etc) Simultaneous switching output analysis Simulations of device I/O to reduce overshoot and undershoot (which can cause increased noise on power planes due to return currents). Crosstalk analysis of signals to reduce noise Good knowledge of Power Delivery Network, impedance profile analysis, IR Drop Analysis, modeling of PCB and Package Shapes, and time- domain Analysis. Experience 3 - 6 Years . Industry Engineering / Engineering Design / R&D / Quality Qualification B.E Key Skills PCB Designing PCB Designer Simulation Process

About Euler : Euler Motors is an automotive OEM focused on transforming transportation in the country with Indias most powerful commercial electric vehicles. Today, Euler Motors stands as the front runner in the commercial EV space, building industry-leading EV technology for India, from India. We work towards building the best commercial EVs and a robust EV ecosystem to encourage faster EV adoption in India. Role: Hardware Design Engineers Location: Mohan Estate, Delhi Working - Monday to Saturday Technical Skills Required: Requirements 4-8 years of experience in hardware design or related fields. Strong knowledge of analog, digital & power electronics circuit design principles. Proficiency in ECAD software for schematic creation, PCB designing, and BOM management. Experience with hardware testing, debugging, and validation. Knowhow to use lab equipments like bench supplies, oscilloscopes, multimeters, logic analyzers etc Strong understanding of SI(signal integrity)/PI(power integrity), power distribution & thermal impacts, and EMI/EMC considerations. - Go to have Excellent problem-solving skills and attention to detail. Strong communication and collaboration abilities. Roles and Responsibilities : Design complex digital, analog & power circuits using ECAD tools. Extensive experience with Altium net classes, high voltage rules, variants and rooms Familiarity with Altium Designer PCB layout tools and schematic capture A good understanding of the PCB layout process and IPC Standards. Familiarity with PCB fabrication, design for manufacturing techniques for high volume designs Collaborate with cross-functional teams to ensure successful product development. Conduct EMI/EMC testing and analysis to meet industry standards. Ensure signal integrity through simulation-based design verification. Perform simulations and analyses to ensure design robustness. Familiarity with high voltage circuit board creepage and clearance requirements, with voltages up to 1500V Mentor junior engineers and provide technical guidance Regards Jerrin Jacob Assistant Manager-HR Euler Motors jerrin.jacob@eulermotors.com +91 9654358259

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Function Qualcomm seeks candidates to help design reference designs and solutions for customers using Qualcomm hardware and software. The role involves working with the Customer Engineering team on product designs, supporting Qualcomm's platforms and applications, and collaborating with internal stakeholders. Responsibilities include creating reference designs, supporting hardware design sign-offs, system/PCB/chip-level debugging, and managing design collaterals to accelerate product development for customers. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Preferred Qualifications A strong understanding of Digital/baseband HW design and PCB design is required. Good troubleshooting skills with the ability to analyze and debug during board bring up (boot-up) are essential. An understanding of LDO/SMPS is essential, along with experience in power management for portable devices being advantageous. Solid knowledge in High-Speed digital interfaces, such as memory Bus I/F (UFS, eMMC, LPDDR, NAND), Display interfaces (parallel and serial, preferably MIPI DSI), Camera interfaces (parallel and serial, preferably MIPI CSI), High Speed peripherals (USB, SDC, PCIe, Ethernet), and Standard Peripheral interfaces (UART, SPI, I2C, JTAG, HDMI) are necessary. Experience with Digital HW/baseband systems and board-level design, as well as familiarity with Digital ASICs and system design, is important. Understanding of system-level clocking schemes, interface-level handshakes are necessary A strong understanding of mobile and consumer electronics products is needed. Hands-on experience with oscilloscopes, logic analyzers, test and measurement tools are required. Basic knowledge of ARM processors and experience with JTAG emulators, display drivers, and memory is preferable. Knowledge of multi-core system/inter-chip system design is advantageous. A strong understanding of PCB signal/power integrity is necessary Reviewing schematics and suggesting improvements is required. Experience with schematic entry is necessary; must have knowledge to review PCB layout in various CAD tools like Cadence Allegro, Siemens Mentor Graphics suite. Hands-on with PCB layout edit tools is advantageous Knowledge of multi-layer PCB designs, vias, and stack-up configuration is essential. The ability to interact with multi-geography customers and stakeholders is desired. Knowledge of prototyping platforms like Arduino and Raspberry Pi is beneficial. Coding skills with Python or C is advantageous. As a member of Qualcomm's Customer Engineering team, responsibilities include creating reference designs, chip and chipset documentation, reference schematics, and training materials for global customer support. Candidate will assist with hardware design reviews, respond to technical queries, and troubleshoot designs at the system, SoC, and PCB levels. A minimum of 3 years' relevant experience is required, along with skills in hardware, digital/high speed/power management, and Silicon validation. Keywords Board Design, Board bring up, UFS, LPDDR, NAND, eMMC, MIPI, USB, UART, SPI, I2C, Logic Analyzer, PADS, Allegro, LDO, SMPS, Clocks, Crystal, ARM processor, JTAG Job Function Qualcomm seeks candidates to help design reference designs and solutions for customers using Qualcomm hardware and software. The role involves working with the Customer Engineering team on product designs, supporting Qualcomm's platforms and applications, and collaborating with internal stakeholders. Responsibilities include creating reference designs, supporting hardware design sign-offs, system/PCB/chip-level debugging, and managing design collaterals to accelerate product development for customers.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Title: PMIC Reference Board Design Engineer Location: Bangalore, India : The QCT PMIC Systems group has an opening for a PMIC Reference Board Design Engineer. This group owns PMIC PCB design guidelines for Qualcomm chipset-based phone design. This includes design and optimization of PMIC PCB Floorplan, Schematic, Layout, phone thermal solution and eBOM selection for test platforms and customer reference design and evaluation kits. Qualcomm PMIC hardware design typically consists of modules such as switch-mode power supplies and linear voltage regulators for a variety of cores and peripherals, battery chargers, low noise clocks, ADCs, user interfaces such as display, camera flash and haptics, Power-on and Reset hardware. Responsibilities: ** NOT A LAYOUT POSITION** Job responsibilities for this position include design of Qualcomm PMIC Reference Board design and evaluation kits and working closely with PMIC IC designers and Test HW platform teams for optimizing performance and cost on test hardware platforms. The engineer will develop PMIC PCB reference design consisting of schematics, PCB layout, eBOM selection, layout guidelines and specs (by working closely with CAD engineer) based on interaction with chipset architecture, chip design and test teams. Experience in Mentor PADs Logic and PADs Layout, DxDesigner and Expedition is desirable but not essential. The engineer is required to perform the required board level simulations (based on Power Integrity and Signal Integrity tools) to review and sign off on hardware designs developed by various test teams. The engineer will be responsible for characterizing and publishing performance and cost optimized reference BOM lists (power inductors, capacitors, third party components etc) based on component characterization and BOM reduction and optimization tests in lab. Skills/Experience: ** NOT A LAYOUT POSITION** Understanding and ability to apply electrical engineering concepts and circuit solving skills. Able to work with common lab test equipments (oscilloscope, spectrum analyzer, logic analyzer, network and impedance analyzer, etc.). Experience in Power Management (SMPS, LDO, battery chargers, Clocks, ADC) PCB design and component selection including CAD interface. Experience in high layer count multilayer boards (6/8/10 layers) preferred. Good understanding of common Signal and Power Integrity issues on test hardware and ability to identify and provide alternate solutions using Signal and Power Integrity simulators (eg. powerSI, SIWave, Ansys) is also a plus. It is important the candidate has ability to communicate technical understandings and project status clearly. Also important is the ability to organize effectively and document work thoroughly and follow required procedures and methodologies . Ability to contribute seamlessly as a member of the reference HW design team across multiple chipsets. Education: RequiredB.E/ M.Tech /MS with 1 to 7 years of relevant experience. Keywords PMIC Reference Board Design, Power Electronics, PCB Design, Power Delivery, Power Integrity

About the Role: We're looking for an experienced PCB Design Engineer Module Lead to lead innovative projects in high-speed digital and RF PCB layouts for advanced electronic systems, including radar and electronic warfare systems. As a Module Lead, you will: Oversee the design, development, and implementation of RF and digital PCB layouts. Lead end-to-end design processes, ensuring technical excellence and quality standards. Mentor and guide a dynamic team of engineers to deliver outstanding results. Key Responsibilities Design and develop RF and digital PCB layouts from concept to production. Collaborate with cross-functional teams to gather and evaluate design requirements. Optimize PCB designs for signal integrity, power integrity, and thermal performance. Ensure adherence to industry standards (IPC, MIL-STD) and organizational guidelines. Guide component selection, ensuring compatibility and cost-effectiveness. Perform DFM (Design for Manufacturability), DFT (Design for Testability), and EMI/EMC compliance checks. Conduct simulations and testing to validate PCB performance. Mentor junior engineers and drive team success. Maintain project timelines, allocate resources, and ensure on-time delivery.

Physical Deisgn Lea LocationBangalore / Hyderabad / Pune Experience - 8+ YoE In-depth knowledge and hands-on experience on Netlist2GDSII Implementation i.e. Floor planning, Placement, CTS, Routing, STA, Power Integrity Analysis, Physical Verification. Should have experienceon Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl. Must have hands-on experience on Synopsys/Cadence tools. (Innovus, ICC2, Primetime, PT-PX, Calibre). Well versed with timing constraints, STA and timing closure. Should have experience on Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl Well versed with timing constraints, STA and timing closure. Do 1. Lead end to end VLSI components & hardware systems a. Design, analyze, develop, modify and evaluate the VLSI components and hardware systems b. Determine architecture and logic design verification through software developed for component and system simulation c. Analyze designs to establish operating data, conducts experimental tests and evaluates results to enable prototype and production VLSI solutions d. Conduct system evaluations and make appropriate recommendations to modify designs or repair equipment as needed e. Allocates modules for testing and verification and reviews data and project documentation f. Provides guidance on technical escalations and review regression testing data g. Prepares documentation containing information such as test case and product scripts for IP and publishes it to the client for feedback and review h. Ensures all project documentation is complete and uploaded as per technical specifications required by the client 2. Provide customer support & governance of VLSI components & hardware systems a. Identify and recommend system improvements to improve technical performance b. Inspect VLSI components & hardware systems to ensure compliance with all applicable regulations and safety standards c. Be the first point of contact to provide technical support to client and help debug specific, difficult in-service engineering problems d. Evaluate operational systems, prototypes and proposals and recommend repair or design modifications based on factors such as environment, service, cost, and system capabilities 3. Team Management a. Resourcing i. Forecast talent requirements as per the current and future business needs ii. Hire adequate and right resources for the team iii. Train direct reportees to make right recruitment and selection decisions b. Talent Management i. Ensure 100% compliance to Wipros standards of adequate onboarding and training for team members to enhance capability & effectiveness ii. Build an internal talent pool of HiPos and ensure their career progression within the organization iii. Promote diversity in leadership positions c. Performance Management i. Set goals for direct reportees, conduct timely performance reviews and appraisals, and give constructive feedback to direct reports. ii. Incase of performance issues, take necessary action with zero tolerance for will based performance issues iii. Ensure that organizational programs like Performance Nxt are well understood and that the team is taking the opportunities presented by such programs to their and their levels below d. Employee Satisfaction and Engagement i. Lead and drive engagement initiatives for the team ii. Track team satisfaction scores and identify initiatives to build engagement within the team iii. Proactively challenge the team with larger and enriching projects/ initiatives for the organization or team iv. Exercise employee recognition and appreciation Deliver No. Performance Parameter Measure 1. Verification Timeliness, Quality and coverage of verification, Compliance to UVM standards, Customer responsiveness 2. Project documentation and MIS 100% on time MIS & report generation Complete Project documentation (including scripts and test cases) 3. Team % trained on new skills, Team attrition %, Employee satisfaction score (ESAT) Mandatory Skills: VLSI Physical Place and Route. Experience5-8 Years.

Key Responsibilities Schematic Capture & PCB Layout Design and optimize complex multi-layer PCBs for high-speed digital and RF applications using tools such as Altium Designer, Cadence Allegro, or OrCAD. Implement controlled-impedance routing, differential-pair tuning, power-integrity planes, and RF transmission lines. High-Speed Signal Integrity Perform SI analysis (eye-diagram, timing, crosstalk) and apply best practices for DDR, PCIe, USB3, Ethernet, HDMI, etc. Collaborate with SI/PI engineers to define stack-ups, copper pours, via types, and decoupling strategies. RF/Microwave Design – Layout antennas, filters, matching networks, baluns, and mixers for frequencies from VHF through UHF (e.g. 13.56 MHz NFC to several GHz Wi-Fi/Bluetooth/GPS). – Ensure low-loss RF paths, minimal parasitics, and effective grounding/EMI shielding. Prototype Validation & Debug – Coordinate board spins, oversee fabrication files (Gerbers, ODB++), and work with board houses on stack-up definitions. – Lead bench-level bring-up, signal probing, VNA/oscilloscope measurements, and cross-section analysis to troubleshoot issues. Documentation & Process Improvement – Produce clear build packages, assembly drawings, and manufacturing notes. – Maintain design libraries, enforce DFM rules, and drive continuous improvement for faster turnaround and higher yield. Cross-Functional Collaboration – Partner with analog/digital/RF hardware engineers, mechanical designers, firmware teams, and test engineers to ensure seamless product development. – Mentor junior designers and share best practices in layout, routing, and design for manufacturability. Required Skills & Qualifications Bachelor’s or Master’s degree in Electrical/Electronics Engineering or related field. 4+ years of hands-on PCB design experience in high-speed digital and RF domains. Proficiency in industry-standard ECAD tools (Altium, Cadence Allegro, OrCAD). Deep understanding of controlled-impedance calculations, SI/PI fundamentals, and RF layout techniques. Experience defining and validating PCB stack-ups, dielectric materials, and copper weights. Skilled in RF test equipment: network/analyzer, spectrum analyzer, VNA, and high-speed oscilloscopes. Strong documentation skills and familiarity with IPC standards (IPC-2221, IPC-7351). Preferred Qualifications Experience in wireless communications (BLE, LTE, GPS, NFC) or aerospace/defense electronics. Familiarity with thermal management, EMI/EMC mitigation, and HDI/microvia technologies. Working knowledge of DFM/DFT principles and vendor-specific fabrication processes. Previous involvement in certification processes (CE, FCC, MIL-STD).

Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelors degree in electrical or electronicsengineering, masters degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIRs, CTLEs) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies

Job Overview As Signal Integrity Manager in TE Connectivity you will play a key role in the design of products for high-speed products in the connector, cable assembly, and/or radio system industry targeting high-speed communications and connectivity within datacenters and wireless infrastructure. As a manager of Product Development Engineering in Signal Integrity (SI), you will lead a team of SI engineers in all aspects of electrical design, simulation, and verification-validation testing. You will be responsible for leading your team to successfully achieve business objectives in a dynamic business environment while fostering a culture of high performance, innovation, and employee wellbeing. Responsibilities: Manage and lead a team of regional/global signal integrity engineers in establishing signal integrity design performance and functional requirements for new products Lead the team to perform signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. Guide the team in connector design and qualifications from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement. Create actionable recommendations based upon design reviews and simulation results. Lead the team in communicating actions and impacts clearly to stakeholders including management, customers, and the technical community. Align the technology roadmap with the market trends, customer needs, and implement accordingly. Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions. Effectively lead a regional/global team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures. Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability. Manage employee wellbeing by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives. Skills/Experience: Bachelors degree in Electrical Engineering or equivalent work experience; Master's Degree preferred Generally requires 10 years of relevant work experience in electrical Design, RF design or PCB design Generally requires a minimum of 3 years of progressive leadership and people management experience in a regional environment A solid understanding of electromagnetic theory and electrical circuit behavior Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent) Proficient with high-speed test equipment (VNA, TDR, BERT) Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration. Proficient with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification. Practiced analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Exposure to physical layer communications systems and architectures. Fluent in English (both verbal and written) Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies. Expert problem solver – able to solve high complexity situations with little to no direction. Proactive in identifying complex issues, providing solutions, and driving improvements to evolve procedures Proficient in presenting technical solutions to customers and upper management Demonstrated experience leading/developing a team of 5+ experienced professionals who exercise latitude and independence in their assignments with accountability for team performance, project delivery, and resource allocation. Proficient in building and leading a solid team - assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, and taking actions necessary to maintain solid team performance. Demonstrated experience establishing and ensuring adherence to budgets, schedules, and work plans. Proficient at leading cross-functional new product development projects which require strong collaboration and influencing skills to achieve the right outcome for the business. Proficient in driving a data analytics mindset across the team – identifying the most meaningful data to collect, analyzing it, drawing conclusions, and presenting those conclusions as data intelligence to provide insight and drive innovative solutions for the business. Proficient in leading change in a high-paced and dynamic environment with an understanding of common barriers to effectively managing change. Proficient at driving continuous improvement with demonstrated experience implementing best practices to enhance engineering efficiency

Greetings from Thales India Pvt Ltd.....! We are hiring for Technical Lead - Digital Circuit design for our Engineering competency center for Bangalore Richmond Road location. JOB Details: Thales India Engineering Competency Center in Bangalore is seeking a Technical Lead engineer role to be part of Hardware engineering team. In this role you will be responsible for design and development of reliable, cost effective, customized products for Defense & avionics applications. Electronics systems design, Obsolescence redesign for Defense / avionics products to meet the customer requirements as well as governing regulatory standards (DO-160, DO-254, MIL-STD, etc.). You also perform trade analysis of design approaches, engineering simulations & modeling, derating analysis before finalizing the design. Qualifications: B.Tech in Electronics & Communication or Electrical engineering or equivalent with 10 to 16 years of relevant experience. Higher qualifications of Post-graduation and PhD are desirable. Working experience in Defense / Avionics domain is desirable Technical Skills and Competencies: Must have strong experience in Electronic design and development from requirements to Conceptual design to architectural design to detailed design and analysis Must have strong experience in the hardware design, development and testing of high speed digital electronic circuits including microprocessors, microcontrollers, FPGA and embedded firmware. Must have hands on experience in product design, board level testing, integration and validation testing including development of test plans and Pass/fail criteria. Must have strong knowledge of using Design and simulation tools Must have working experience of product performance evaluation (Hardware Verification) to comply to DO-160 or MIL-STD standards Must have excellent troubleshooting skills on Electrical / Electronic boards to find the root cause and to propose the best solution Should have experience of working with multi-disciplinary team ( Mechanical, PCB layout, Systems engineering and suppliers) Should have an understanding and use of DFMEA, DFT and DFM tools Definition and choice of components (including derating) Definition of electrical schematics and building blocks Boards place&route (including signal integrity) Manufacturing failures analysis / Root cause analysis Test procedures definition and execution Component obsolescence treatment : alternative solution identification, definition/design of the solution, verification Profile/Skills Digital Electronic Engineering Skills and ability. VHDL coding, Timing analysis Mastering of electronic simulation and design software (Cadence, Allegro, ANSYS, PSPICE/LTSPICE) Knowledge or Defense & aeronautics constraints (MIL-STD, DO160, DO254) General understanding of Engineering Development lifecycles including design, development, testing, verification and validation phases

Job Details: : Performs physical design implementation of custom CPU designs from RTL to GDS to create a design database that is ready for manufacturing. Conducts all aspects of the CPU physical design flow including synthesis, place and route, clock tree synthesis, floor planning, static timing analysis, power/clock distribution, reliability, and power and noise analysis. Conducts verification and signoff including formal equivalence verification, static timing analysis, reliability verification, static and dynamic power integrity, layout verification, electrical rule checking, and structural design checking. Analyzes results and makes recommendations to improve current and future CPU microarchitectures closely collaborating with logic, circuit, architecture, and design automation teams. Possesses CPU specific expertise in various aspects of structural and physical design, including physical clock design, timing closure, coverage analysis, multiple power domain analysis, structured placement, routing, synthesis, and DFT. Works intimately with industry EDA vendors to build and enhance tool capabilities to design a highspeed, low power synthesizable CPU. Optimizes CPU design to improve product level parameters such as power, frequency, and area. Participates in the development and improvement of physical design methodologies and flow automation. Qualifications: Qualifications: B.Tech with 3+ years or M.Tech with 2+ Years of hands-on experience with end-to-end SD flow - synthesis to GDS using industry standard EDA tool, with a proven track record of successful projects. Has good understanding on timing methodology, constraints building etc. Experience in floorplaning concepts and actual work, and integration of hierarchical design Good understanding and experience with multiple power domains designs. Have hands on experience on LV flow and clean up. Job Type: Experienced Hire Shift: Shift 1 (India) Primary Location: India, Bangalore Additional Locations: Business group: The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. *

Job Area: Engineering Group, Engineering Group > Hardware Applications Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Job Function Qualcomm is looking for candidates to support its customers in designing solutions using Qualcomm Hardware and Software. The Individual will contribute to the dynamic HW Applications engineering team for end product designs. The Individual will also be responsible for supporting Qualcomm's growing portfolio of platforms/applications and the job involves working closely with internal partners in Product definition as appropriate. The PMIC- H/W application Engineer will be responsible for supporting Qualcomms growing portfolio mobile phone platforms. The job involves working closely with partners and customers of Qualcomm to define the specifications of the mobile phone handset products, part selection, system design, design reviews, support while doing system debug, partner deliverables etc. As a member of Qualcomm customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in mobile, PC, and consumer electronics markets. Individual will be responsible to work closely with cross function teams in Qualcomm, including design engineering, systems engineering, characterization team, ATE test team, SW team, product marketing, program management and peers in customer engineering organization across multiple regions. Individual will be responsible to create chipset documentation, reference schematics, training material, application notes for worldwide customer support. Individual will be responsible to engage with customer designs, assist customers in feature definition and design reviews, provide in-depth technical responses to customer queries, do troubleshooting of customer designs and provide necessary training to customers. Past expertise in interacting with multiple teams in HW, SW domains, skills in Digital/Baseband and sound technical knowledge of Qualcomm PMICs are desirable. . Preferred Qualifications Sound understanding of LDO/SMPS - Must to have Experience on power management for portable devices will be a plus Strong understanding PCB Signal/power integrity- Should be comfortable reviewing schematic/suggest changes for improvement - Experience with Schematic entry will be a plus . Should be fluent with CAD tools like Allegro/PADs to review customer layout . Knowledge on crystals/Clocks - Must to have Knowledge on display backlighting schemes - Must to have Knowledge on LabVIEW/python- Will be a plus Experience on Analog and mixed signal bench validation- Will be a plus Knowledge on battery charging and Fuel gauge will be a plus Good communication skills Keywords Power Management, Applications, Analog, PMIC, SMPS, DC/DC Converter, Buck, Boost, LDO, charger, fuel gauge/gas gauge, LED driver, ADC, oscillator, amplifier, Educational Bachelor's or Masters in Electronics and/or Electrical Engineering with 3 -5 years of relevant industrial experience

Roles and Responsibilities Lead design of high-reliability power electronics PCBs for automotive-grade products Own schematic creation, stack-up definition, and material selection for high-current, high-voltage designs Ensure compliance with EMI/EMC, thermal, and mechanical constraints during layout Conduct architecture reviews and design validation with the hardware team Select components based on electrical, thermal, cost, and reliability trade-offs Review and maintain schematic symbols, footprints, and library standards Lead root cause analysis for validation and production-level PCB issues Release complete production documentation (Gerbers, BoM, pick-and-place, assembly drawings) Guide junior engineers and drive best practices in layout and design Coordinate with suppliers and manufacturers for DFM/DFA compliance Implement cost reduction and continuous improvement based on field feedback Support ICT and FCT processes Skills 3+ years of PCB design experience; proficiency in Altium Designer preferred Strong foundation in electrical engineering and power electronics Expertise in analog, digital, and power layout with good thermal design practices Experience in debugging and testing power electronics systems Familiar with IPC standards (IPC-2221, IPC-2152, IPC-4761) and DFM/DFT guidelines Knowledge of signal/power integrity, impedance control, and EMI/EMC compliance Understanding of mechanical constraints; experience with 3D CAD models (DXF/STEP) Strong documentation and communication skills Leadership abilities to mentor and manage junior team members.

We need an Electronics Engineer to work under the direction of product developers to design new ways of incorporating electronics into our product portfolio. In this role, the person will collaborate with others to offer innovative methods of product development as well as improving existing products. The person will create models and prototypes as well as handle calculations required for manufacturing specifications. The person will test electronics to ensure they function as planned. The person will also be responsible for ensuring that electronics meet the highest standards of safety for our customers. Tasks & Responsibilities: Realization of the development in accordance with the targets defined in the work package with respect to the contents, quality, deadlines and costs of the project Schematic Design Component selection meeting cost and performance Mandatory: Should have experience on Mixed Signal Design, Analog Circuit Design and Digital Circuit Design Should have experience in working on complete Product Development Life Cycle Should have a strong understanding of Signal and power Integrity phenomena and relevant tools. Should have knowledge of working on micro controllers, microprocessors and FPGAs from various industry manufacturers like TI, STM, Qualcomm, Xilinx, Lattice and others. Should have knowledge of communication protocols like SPI, I2C, USB, UART, CAN, Ethernet, Wi-Fi, RS485 a few to mention.

Should have experience on Mixed Signal Design, Analog Circuit Design and Digital Circuit Design Should have experience in working on complete Product Development Life Cycle Should have a strong understanding of Signal and power Integrity phenomena and relevant tools. Should have knowledge of working on micro controllers, microprocessors and FPGAs from various industry manufacturers like TI, STM, Qualcomm, Xilinx, Lattice and others. Should have knowledge of communication protocols like SPI, I2C, USB, UART, CAN, Ethernet, Wi-Fi, RS485 a few to mention. Should possess excellent knowledge of various power regulators like Switching and LDOs. Should have experience of Schematic Design in Altium and Orcad Should have reviewed the layout designs and guided PCB designers for an effective component placement and routing for various designs. Should have worked on Multi-layer board design with minimum 6 layers. Understanding of the layer stack-up definition and its understanding is desired. Should have knowledge of using various electronic tools and instruments like Oscilloscopes, multi meters and others. Should have excellent debugging skills with analytical reasoning. Should have experience in making the designs meet various compliance standards related to safety, ESD, EMI/EMC. Excellent interpersonal, written and verbal communications skills; flexible, self-directed and able to work in a team environment. Knowledge of Change/Configuration Management and ECN processes is a Plus Should possess excellent knowledge of various power regulators like Switching and LDOs. AC to DC Power Supply Design and debugging Should have strong knowledge in working on various motors like BLDC, stepper, etc. Should have strong knowledge of working on Encoders, motor drive........Bold are mandatory skills.

Engineering in ECE or ETC,PCB design using Altium Design Software. Experience in Multi-Layer PCB design,Experience in PCB design with Signal Integrity. Power Integrity and EMI/EMC considerations. Experience in working with Serial protocols such as RS422/485, I2C, SPI, UART etc. Experience in working with Wi-Fi, LoRa and Bluetooth related hardware and antenna selection. Experience in working with Micro controller & Computer Module. Exp in Preparing FEMCA & DFMEA analysis for hardware Design

Job Information Job Opening ID ZR_1777_JOB Date Opened 24/03/2023 Industry Technology Job Type Work Experience 6-10 years Job Title Electronics Engineer City Gurgaon Province Haryana Country India Postal Code 201303 Number of Positions 1 Should have experience on Mixed Signal Design, Analog Circuit Design and Digital Circuit Design Should have experience in working on complete Product Development Life Cycle Should have a strong understanding of Signal and power Integrity phenomena and relevant tools. Should have knowledge of working on micro controllers, microprocessors and FPGAs from various industry manufacturers like TI, STM, Qualcomm, Xilinx, Lattice and others. Should have knowledge of communication protocols like SPI, I2C, USB, UART, CAN, Ethernet, Wi-Fi, RS485 a few to mention. Should possess excellent knowledge of various power regulators like Switching and LDOs. Should have experience of Schematic Design in Altium and Orcad Should have reviewed the layout designs and guided PCB designers for an effective component placement and routing for various designs. Should have worked on Multi-layer board design with minimum 6 layers. Understanding of the layer stack-up definition and its understanding is desired. Should have knowledge of using various electronic tools and instruments like Oscilloscopes, multi meters and others. Should have excellent debugging skills with analytical reasoning. Should have experience in making the designs meet various compliance standards related to safety, ESD, EMI/EMC. Excellent interpersonal, written and verbal communications skills; flexible, self-directed and able to work in a team environment. Knowledge of Change/Configuration Management and ECN processes is a Plus Should possess excellent knowledge of various power regulators like Switching and LDOs. AC to DC Power Supply Design and debugging Should have strong knowledge in working on various motors like BLDC, stepper, etc. Should have strong knowledge of working on Encoders, motor drive........Bold are mandatory skills. check(event) ; career-website-detail-template-2 => apply(record.id,meta)" mousedown="lyte-button => check(event)" final-style="background-color:#2B39C2;border-color:#2B39C2;color:white;" final-class="lyte-button lyteBackgroundColorBtn lyteSuccess" lyte-rendered=""> I'm interested

Job Information Job Opening ID ZR_1720_JOB Date Opened 14/03/2023 Industry Technology Job Type Work Experience 6-10 years Job Title Electronics Engineer City Gurgaon Province Haryana Country India Postal Code 201303 Number of Positions 1 We need an Electronics Engineer to work under the direction of product developers to design new ways of incorporating electronics into our product portfolio. In this role, the person will collaborate with others to offer innovative methods of product development as well as improving existing products. The person will create models and prototypes as well as handle calculations required for manufacturing specifications. The person will test electronics to ensure they function as planned. The person will also be responsible for ensuring that electronics meet the highest standards of safety for our customers. Tasks & Responsibilities: Realization of the development in accordance with the targets defined in the work package with respect to the contents, quality, deadlines and costs of the project Schematic Design Component selection meeting cost and performance Mandatory: Should have experience on Mixed Signal Design, Analog Circuit Design and Digital Circuit DesignShould have experience in working on complete Product Development Life CycleShould have a strong understanding of Signal and power Integrity phenomena and relevant tools.Should have knowledge of working on micro controllers, microprocessors and FPGAs from various industry manufacturers like TI, STM, Qualcomm, Xilinx, Lattice and others.Should have knowledge of communication protocols like SPI, I2C, USB, UART, CAN, Ethernet, Wi-Fi, RS485 a few to mention. check(event) ; career-website-detail-template-2 => apply(record.id,meta)" mousedown="lyte-button => check(event)" final-style="background-color:#2B39C2;border-color:#2B39C2;color:white;" final-class="lyte-button lyteBackgroundColorBtn lyteSuccess" lyte-rendered=""> I'm interested

Job Information Job Opening ID ZR_1991_JOB Date Opened 16/06/2023 Industry Technology Job Type Work Experience 6-10 years Job Title Lead Engineer- Hardware City Krishna Province Andhra Pradesh Country India Postal Code 520001 Number of Positions 1 Engineering in ECE or ETC,PCB design using Altium Design Software. Experience in Multi-Layer PCB design,Experience in PCB design with Signal Integrity. Power Integrity and EMI/EMC considerations. Experience in working with Serial protocols such as RS422/485, I2C, SPI, UART etc. Experience in working with Wi-Fi, LoRa and Bluetooth related hardware and antenna selection. Experience in working with Micro controller & Computer Module. Exp in Preparing FEMCA & DFMEA analysis for hardware Design check(event) ; career-website-detail-template-2 => apply(record.id,meta)" mousedown="lyte-button => check(event)" final-style="background-color:#2B39C2;border-color:#2B39C2;color:white;" final-class="lyte-button lyteBackgroundColorBtn lyteSuccess" lyte-rendered=""> I'm interested

PCB design principles, Software Expertise in Altium Designer for schematic capture, PCB layout, & library management High-speed PCB design Power electronics, SI/PI concepts, & EMI/EMC compliance DFM, DFA, & PCB manufacturing processes IPC standards Required Candidate profile Experience in PCB design, preferably with high-speed and/or complex multilayer boards Effective communication skills Knowledge of Flex PCB and HDI PCB design

Major skills that we need to look for -> Hardware Design, Board design, Digital circuit design, Low power design, Board debug, Board testing, x86, Documentation Detailed JD :- Hardware design engineer with x86 Board design background. Strong fundamentals and experience in Digital circuit design and low power Electronic circuits. Understanding of signal integrity, EMI/EMC concepts for Digital and Power Electronics Experience in at least one complete project starting from the high-level design to the final validation. Should be able to independently handle the schematic design, design analysis and review coordination with peer designers, Layout, SI and EMC teams. Experience in board bring-up and issue investigation & triage, in coordination with firmware and software teams. Experience in preparing and reviewing hardware design documentation and issue investigation reports. Should be able to develop the board bring-up plan, be able to identify the test equipment required and execute independently . Strong communication and interpersonal skills to collaboratively work with various cross functional teams involving post silicon IP Validation, BIOS and Driver Development/QA.

1. Candidate shall have experience in handling multiple end to end product project around RF design, analysis, testing, calibration, regulatory compliances and release of products for commercial deployments 2. Relevant experience of 3+ years in RF Design. Responsibilities 1. Lead the design, simulation, and verification of complex analog and mixed-signal circuits, Signal integrity, power integrity, impedance Analysis. 2. Perform advanced simulations and analyses to ensure exceptional circuit performance and compliance with specifications. 3. Create comprehensive documentation of design methodologies, specifications, and outcomes. 4. Multi radio front end and radio optimisation. 5. Extensive knowledge on RF matching, filter design and antenna matching. 6. Conversant with lab equipment like Spectrum Analyzer, Network analyser, RF Signal generators , IQXEL, MT8852 etc. 7. Experience on EMI/EMC, Antenna design, Signal Integrity and Thermal Analysis will be a key skill. 8. Design and develop Regulatory certified BLE, ZigBee, Wi-Fi modules. 9. Work closely with cross functional teams to derive the design specification for Modules. 10. Prototype Board bring-up, Validation and Characterization. 11. Handover design to manufacturing and help to derive the production test plan. 12. Documentation of design, test plan and test results. 13. Supporting Customer support team in debugging critical customer issues. 14. Radio side design and debugging. 15. RF performance evaluation, calibration and optimisation. 16. Link budget and harmonics analysis. 17. Tuning and optimisation of RF front end. 18. Deep understanding on radio chip, physical layer customisations and its impacts on the radio performance. 19. Understanding of various physical layer standards. 20. Willingness to contribute in global standards committee of next generation wireless systems. 21. Ownership of product level EMI/EMC compliances for global requirements as well. 22. Schematic, Layout and BOM selection. Mandatory Key Skills MT8852,Signal integrity,power integrity,debugging,Spectrum Analyzer*,Network analyzer*,RF Signal generators*,IQXEL*,RF design*

Knowledge of High-Speed Board Design Experience in designing with memories like DDR3 / DDR4 / eMMC / NAND / NOR Flash etc. Experience in designing with High-speed communication protocols like PCIe / SerDes / USB3.0 / SGMII / SFP+ /10G/100G/ Hands-on experience with MII, SGMII, RGMII, HSGMII, QSGMII, XGMII and its PHY interfaces Hands-on experience with Intel or Broadcom or Marvel or MediaTek Quad/Octal port Ethernet PHYs transceivers Should have design experience in Multiport Gigabit Network Switches, Hubs and Gigabit Router Added Advantage for knowledge of PoE 802.3at , PoE+ 802.3bt Type 2 , or PoE++ 802.3bt Type 3 or 4PPoE PoE++ Type 4 Should Have Experience of different Gbit Standard such as 1000Base – SX, 1000Base-LX, 1000Base- CX, and 1000Base-T 1Gb/s SFP(INF-8074i),10Gb/s SFP+ (SFF-8431 4.1) or 25Gb/s SFP28 (SFF-8402) and QSF,QSFP+,QSFP28 would be advantage Experience with High-speed Hardware design, Complex Analog and Digital Hardware System level design, circuit analysis, SI/PI, PSPICE simulation, Boundary scan, EMC/EMI analysis and safety standards Responsibilities include Schematic Capture, Component Selection, Library Creation and Guiding Board Layout. Should Have product development understanding like Enterprise switching, Port extender, Embedded Ethernet fabric, and TSN products Hands-on experience in Telecom/Datacom product design Experience like PDH/SDH/SONET/ and fibre optic products Should Have telecom backhaul Network transmission products design Experience, Experience in working with complex ASSPs, Microprocessors/controllers and FPGAs Experience in Signal Integrity / Power Integrity Should have worked on testing equipment like high-speed Oscilloscope, Network analysers, spectrum analysers etc

Role & responsibilities High-Speed PCB Design: Develop PCB layouts for high-speed systems, including DDR, PCIe, USB, Ethernet, and other high-frequency interfaces. Signal and Power Integrity: Perform signal and power integrity analysis to ensure optimal design performance. Layer Stack-up Design: Define PCB stack-ups and impedance-controlled designs for high-speed and high-density applications. Simulation and Validation: Use simulation tools to validate designs for crosstalk, impedance matching, and high-speed signals. Component Placement and Routing: Optimize placement and routing strategies to meet performance, manufacturability, and cost requirements. Design for Manufacturing (DFM) and Test (DFT): Collaborate with fabrication and assembly teams to ensure manufacturability and testability of designs. Documentation: Generate detailed design files, BOMs, and fabrication documentation. Compliance: Ensure designs adhere to industry standards (e.g., IPC-6012, ISO 9001) and regulatory requirements. Collaboration: Work closely with hardware, firmware, and system engineering teams to meet project requirements. Preferred candidate profile Bachelors degree in Electrical Engineering, Electronics, or a related field. 3+ years of experience in PCB design with a focus on high-speed digital and RF designs. Expertise in Altium for PCB Design Strong knowledge of signal integrity, power integrity, and EMI/EMC design principles. Proficiency in high-speed interfaces (DDR3/DDR4/DDR5, PCIe, SerDes, etc.). Familiarity with simulation tools like HyperLynx, Ansys, or SIwave for signal and power integrity analysis. Hands-on experience with impedance-controlled designs and differential pair routing. Solid understanding of PCB fabrication and assembly processes.

Job Area: Engineering Group, Engineering Group > Hardware Applications Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Application Engineer, you will provide technical expertise of hardware through trainings, product demonstrations, and the design, debug, test, and quality support of customer products. Qualcomm Hardware Application Engineers collaborate with cross-functional teams to assess the potential application of company products that meet and exceed customer needs. Minimum Qualifications: "¢ Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 2+ years of Hardware Applications Engineering or Hardware Design experience or related work experience. OR Master's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 1+ year of Hardware Applications Engineering or Hardware Design experience or related work experience. OR PhD in Electrical/Electronics Engineering, Computer Engineering, or related field. IOT JD Title IOT Applications Engineering "“ Senior Engineer Job Function Qualcomm is seeking candidates to assist its customers in designing IoT solutions utilizing Qualcomm hardware and software. The individual will contribute to the dynamic Customer Engineering team for product designs and will be responsible for supporting Qualcomm's expanding portfolio of platforms and applications. This role involves collaborating closely Qualcomm customers to support hardware design sign-offs, system/PCB/chip-level debugging, and ownership of design collaterals that helps customers to bring out products faster. Preferred Qualifications A strong understanding of Digital/baseband HW design and PCB design is required. Good troubleshooting skills with the ability to analyze and debug during board bring up (boot-up) are essential. An understanding of LDO/SMPS is essential, along with experience in power management for portable devices being advantageous. Solid knowledge in High-Speed digital interfaces, such as memory Bus I/F (UFS, eMMC, LPDDR, NAND), Display interfaces (parallel and serial, preferably MIPI DSI), Camera interfaces (parallel and serial, preferably MIPI CSI), High Speed peripherals (USB, SDC, PCIe, Ethernet), and Standard Peripheral interfaces (UART, SPI, I2C, JTAG, HDMI) are necessary. Experience with Digital HW/baseband systems and board-level design, as well as familiarity with Digital ASICs and system design, is important. Understanding of system-level clocking schemes, interface-level handshakes are necessary A strong understanding of mobile and consumer electronics products is needed. Hands-on experience with oscilloscopes, logic analyzers, test and measurement tools are required. Basic knowledge of ARM processors and experience with JTAG emulators, display drivers, and memory is preferable. Knowledge of multi-core system/inter-chip system design is advantageous. A strong understanding of PCB signal/power integrity is necessary Must be comfortable in reviewing schematics and suggesting improvements is required. Experience with schematic entry is a plus. Must have knowledge to review PCB layout in various CAD tools like Cadence Allegro, Siemens Mentor Graphics suite. Knowledge of multi-layer PCB designs, vias, and stack-up configuration is essential. The ability to interact with multi-geography customers and stakeholders is desired. Knowledge of prototyping platforms like Arduino and Raspberry Pi is beneficial. About The Role As a member of Qualcomm's Customer Engineering team, responsibilities include creating chip and chipset documentation, reference schematics, and training materials for global customer support. Candidate will assist with hardware design reviews, respond to technical queries, and troubleshoot designs at the system, SoC, and PCB levels. A minimum of 3 years' relevant experience is required, along with skills in hardware, digital/high speed/power management, and Silicon validation. Keywords Board Design, Board bring up, UFS, LPDDR, NAND, eMMC, MIPI, USB, UART, SPI, I2C, Logic Analyzer, PADS, Allegro, LDO, SMPS, Clocks, Crystal, ARM processor, JTAG Educational Requirements RequiredBachelor's, Electronics and/or Electrical Engineering PreferredMaster's, Electronics and/or Electrical Engineering