437 Physical Design Jobs - Page 3

Lead and manage the DFT team responsible for delivering comprehensive DFT solutions for complex SoCs. Take end-to-end ownership of the DFT lifecycle - from architecture definition to silicon bring-up and production ramp. Collaborate cross-functionally with architecture, design, and physical design teams to ensure optimal testability integration. Define and track DFT milestones, quality metrics, and progress, ensuring alignment with program schedules and quality standards. Represent DFT in program and customer meetings, communicating status, risks, and mitigation plans. Architect and guide the implementation of DFT features, including Scan chain insertion and optimization, Test compression techniques, LBIST/MBIST (including repair logic), Boundary scan structures Lead efforts in performing DFT rule checks (DFT DRC) at RTL and netlist levels to ensure compliance with internal and industry standards. Use industry-standard EDA tools (e.g., Cadence, Siemens/Tessent) for DFT Design, DRC, Pattern Generation and work with EDA/Internal CAD team for tool/flow improvements Drive DFT pattern generation and validation, including gate-level simulations with and without SDF. Partner with the verification team to define and execute DFT verification plans. Collaborate with physical design and STA teams to implement DFT constraints and strategies for synthesis and timing closure. Analyze silicon test data, debug test failures, and work with the test engineering team to resolve bring-up and production issues. Provide technical leadership, mentorship, and career development for DFT engineers on the team. Qualifications and Experience: Proven experience in leading DFT teams through end-to-end SoC execution, from architecture to silicon bring-up. Demonstrated expertise in developing DFT architecture from scratch for complex SoC designs. Strong team management and leadership experience with a track record of mentoring and growing engineering talent. Bachelors or Master s degree in Electrical/Electronics Engineering or a closely related field. 12+ years of hands-on experience in DFT methodologies and industry-standard test techniques. Deep knowledge and hands-on experience with: Logic BIST (LBIST) Automatic Test Pattern Generation (ATPG) DFT Rule Checks (DFT DRC) Scan chain compression and stitching Low-power DFT techniques and constraints Memory BIST (MBIST) including repair mechanisms Boundary Scan (IEEE 1149.1) Analog DFT strategies JTAG architecture and TAP integration DFT-specific STA constraints Proficient in using industry-standard DFT EDA tools, including cadence, Siemens. Strong scripting and automation skills using Perl, Tcl, and/or Python. Solid understanding of digital design fundamentals, including RTL design, Lint/CDC, low power checks, and the full ASIC design flow. Excellent problem-solving skills, with the ability to troubleshoot and resolve complex DFT issues efficiently. Strong communication and interpersonal skills, capable of working effectively in cross-functional and team-oriented environments.

Provide technical and managerial Leadership to a PD team for a SoC Chip development owning partitions and full-chip from synthesis to place and route through all sign-off including timing signoff, physical verification, EMIR signoff, and formal verification. Influence tools, flows, and overall design methodology in design construction, signoff, and optimization. Work closely with architecture/RTL/DFT/DV/Package development teams. Be a technology expert in the area of Physical Design with in the team and business Unit. Minimum Qualifications 10 to 15 years of experience in Physical Design. Proven experience in implementing designs through synthesis, Floorplanning, place and route, extraction, timing, and physical verification. Technically lead a team of PD engineers on the Physical Design activities of complex SoCs. Strong understanding of constraints generation, timing optimization, and timing closure and STA. Strong technical problem solving and debugging ability Experience in EDA tools related to Place and route, Synthesis, Physical Verification , STA etc. Proficient understanding of CTS and different clock building techniques Experience with multi-clock, multi-power-domain design, UPF etc Experience in IP integration (memories, IO s, embedded processors, hard macros, Analog IP) Knowledge of Microelectronics concepts Scripting skills in Python, Tcl, C etc Ability to collaborate and work directly with the tool vendors to resolve tools bugs, as well as implement the required improvements Great communication and teamwork skills

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Physical Implementation activities for Sub systems which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Knowledge in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Knowledge in Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Good knowledge of Tcl/Perl Scripting Strong problem-solving skills and good communication skills. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 1-3 yrs years of experience in Physical Design/Implementation

Job Area: Engineering Services Group, Engineering Services Group > Layout Engineer General Summary: Develops block, macro, or chip level layouts and floorplans according to project requirements, specifications, and design schematics. Applies understanding of design manuals, established processes, layout elements, and basic electronic principles to create accurate designs that meet project needs. Conducts analyses, tests, and verifies designs using different tools and techniques to identify and troubleshoot issues, and stays abreast of new verification methods. Works with multiple internal and external stakeholders to align on projects, provide updates, and resolve issues. Minimum Qualifications: Bachelor's degree in Electrical Engineering, Computer Science, Mathematics, Electronic Engineering, or related field and 2+ years of experience designing custom layouts in relevant domain (e.g., analog, mixed signal, RF, digital design), or related work experience. OR Associate's degree in Computer Science, Mathematics, Electrical Engineering or related field and 4+ years of experience designing custom layouts in relevant domain (e.g., analog, mixed signal, RF, digital design), or related work experience. OR High School diploma or equivalent and 6+ years of experience designing custom layouts in relevant domain (e.g., analog, mixed signal, RF, digital design), or related work experience. 2+ years of experience using layout design and verification tools (e.g., cadence, LVS, rmap). Qualcomm is a company of inventors seeking to revolutionize the CPU market in an age of new possibilities. Are you interested in joining Qualcomm’s high performance CPU team as an SRAM Mask Layout DesignerYou will have the opportunity to work with some of the most talented and passionate engineers in the world to create designs that push the envelope on performance, energy efficiency and scalability. We offer a fun, creative and flexible work environment, with a shared vision to build products to change the world. As a Mask Layout Designer, you will develop block or macro level layouts and floorplans for high performance custom memories according to project requirements, specifications, and design schematics. Minimum qualifications 5+ years of experience and a high school diploma or equivalent OR 5+ years experience and BS in Electrical Engineering OR 3+ years experience and MS in Electrical Engineering Direct experience with custom SRAM layout Experience in industry standard custom design tools and flows. Knowledge of leading-edge FinFET and/or nanosheet processes (5nm or newer). Experience in Layout design of library cells, datapaths, memories in deep sub-micron technologies. Knowledge of all aspects of Layout floorplanning and hierarchical assembly. Knowledge of Cadence Virtuoso and Calibre LVS/DRC. Preferred qualifications Good understanding of device parasitics and reliability considerations during layout. Good understanding of critical circuits and layout styles. Ability to write Skill code for layout automation. Knowledge of improving EMIR in layout. Good communication skills to work with different teams to accurately describe issues and follow them through for completion. Roles and Responsibilities Design layout for custom memories and other digital circuits based on provided schematics. Read and interpret design rule manuals to create optimal and correct layout. Own the entire layout process from initial floorplanning to memory construction to physical verification. Use industry standard verification tools to validate LVS, DRC, ERC etc. Interpret the results from the verification suite and perform layout fixes as needed. Provide layout fixes as directed by the circuit design engineers. Work independently and execute memory layout with little supervision. Provide realistic schedules for layout completion. Provide insight into strategic decisions regarding memory layout and

Job Area: Engineering Group, Engineering Group > Systems Engineering General Summary: Qualcomm is looking for an experienced Chipset Power System Engineer who is passionate in solving power challenges and develop innovative solutions for optimizing power for next generation Snapdragon chipsets of various platforms in applicator processor, modem, automotive, AR/XR, compute and machine learning. The engineer is expected to work with cross-functional engineering teams to model SOC/chipset power and come up with innovative solutions to optimize hardware and software to enhance SOC and chipset and achieve world-class chipset low power consumption. In this position, the engineer will support the existing tools and methodologies while defining the long term strategy in the areas below. Power Modeling and Methodology Drive the engineering process to gather requirements, design, prioritize and track derived tasks, test, and deliver tools and methodologies to the power community Maintain existing power modeling tools and methodology. Define and deliver API's to the power community as required. Create block-level and system-level power models as required. Integrate and port power models from IP teams into the existing framework. This involves working closely with contributing teams and aligning power modeling requirements and negotiating power model deliverables for framework integration. Drive and participate in cross-functional power modeling collaborations which includes hardware, systems, architecture, software, and post-silicon teams Track technology changes with the enhancement to the power modeling methodology by incorporating new low power techniques, algorithms, power management schemes, etc. Power Analysis Collaborate to assess use case power impact in areas such as thermal and formfactor variance, architecture changes, IP changes, low power techniques Understand and perform block & chip-level power analysis and ensure methodologies satisfies the requirements to enable these activities Enable other teams to leverage the tools and methodologies and perform technology specific power analysis. Minimum Qualifications: Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 2+ years of Systems Engineering or related work experience. OR Master's degree in Engineering, Information Systems, Computer Science, or related field and 1+ year of Systems Engineering or related work experience. OR PhD in Engineering, Information Systems, Computer Science, or related field.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. PNR implementation for Qualcomm SoC's Good hands-on experience on Floorplanning, PNR and STA flows Good knowledge on Placement/Clock Tree Synthesis (CTS), optimization, etc Good understanding on signoff domains– LEC/CLP/PDN knowledge, etc Good knowledge on Unix/Linux – Perl/TCL fundamentals/scripting Principal Duties and responsibilities Complete ownership on PNR implementation (Floorplanning, Placement, CTS, post_route,etc) on latest nodes. Signoff knowledge is mandatory (STA,Power analysis,FV, low power verification, PV,etc) Quick learner with good analytical and problem solving skills Qualifications 5+ years Hardware Engineering experience or related work experience. 5+ years experience with PNR flow in latest tech nodes (e.g., 4nm/5nm/7nm/10nm

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Physical Implementation activities for Sub systems which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Knowledge in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Well versed with the Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus in latest technology nodes Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Well versed with Tcl/Perl Scripting Strong problem-solving skills and good communication skills. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 3- 6yrs years of experience in Physical Design/Implementation

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. Principal Duties and Responsibilities: 5+ Years of Experience in Logic design /micro-architecture / RTL coding Must have hands on experience with SoC design, synthesis and timing analysis for complex SoCs. Experience in Verilog/System-Verilog is a must. knowledge of AMBA protocols - AXI, AHB, APB, SoC clocking/reset/debug architecture and peripherals like USB, PCIE and SDCC. Work closely with the SoC DFT, Physical Design and STA teams Hands on experience in Low power SoC design is required Hands on experience in Multi Clock designs, Asynchronous interface is a must. Experience in using the tools in ASIC development such as DesignCompiler, Genus, FusionCompiler and Primetime is required. Understanding of constraint development and timing closure is a plus. Experience in Synthesis / Understanding of timing concepts

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: NUVIA is now part of Qualcomm. Our mission is to reimagine silicon and create computing platforms that will transform the industry. You will have the opportunity to work with some of the most talented and passionate engineers in the world to create designs that push the envelope on performance, energy efficiency and scalability. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. As CPU Physical Design CAD engineer, you will build and support the world’s best implementation tools and flows. Your tools and flows will ensure our custom CPUs have industry-leading power, performance and area. Roles and Responsibilities Develop, integrate and release new features in our high-performance place-and-route CAD flow Architect and recommend methodology improvements to ensure our silicon has the best power, performance and area Maintain, support and debug implementation flows, and resolve project-specific issues Work closely with worldwide CPU physical design teams, and provide methodology guidance, tools/flows support and help achieve class-leading PPA. Work with EDA vendors to define roadmap and to resolve tool issues Preferred Qualifications: Bachelors/Masters degree in Electrical/Electronics Engineering or Computer Science Ten+ years of hands-on experience in place-and-route of high-performance chips - either in a design or CAD role High level of proficiency in Tcl as well as Python Experience with automation Experience with a wide variety of Physical Design tasks - ranging all the way from place-and-route, analysis, timing sign-off and PDV Experience with advanced technology nodes (5nm or lower) Solid understanding of digital design, timing analysis and physical verification Strong user of industry-standard place-and-route tools such as Cadence Innovus Proven track record of managing and regressing place-and-route flows

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Experience 7 to 10 years Physical design of block level with full understanding of PnR cycle. Good understanding of Physical design fundamentals Good hands-on experience on industry standard pnr tools like ICC2/Innovus Good understanding on signoff tool like Prime time , Redhawk and calibre Should be able to guide junior engineers in resolving technical issues. Tools ICC/Innovus, PT, StarRC, Redhawk, Calibre DRC/LVS ScriptingTCL, Perl

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 2-4 yrs experience in Physical Design and timing signoff for high speed cores. Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology. Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 7+ years of experience in IC design . Experience in leading block level or chip level Physical Design, STA and PDN activities. Work independently in the areas of RTL to GDSII implementation. Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.) Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.) Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers. Strong problem-solving skills.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. Experience Required8+ Years (A must) Strong expertise in STA timing analysis basics, AOCV/POCV concepts, CTS, defining and managing timing constraints, Latch transparency handling, 0-cycle, multi-cycle path handling Hands-on experience with STA tools - Prime-time, Tempus Have experience in driving timing convergence at Chip-level and Hard-Macro level In-depth knowledge cross-talk noise, Signal Integrity, Layout Parasitic Extraction, feed through handling, Knowledge of ASIC back-end design flows and methods and tools (ICC2, Innovus) Knowledge of Spice simulation Hspice/FineSim, Monte Carlo. Silicon to spice model correlation. Proficient is scripting languages – TCL, Perl, Awk Basic knowledge of device phy STA setup, convergence, reviews and signoff for multi-mode, multi-voltage domain designs Qualcomm Hexagon DSP IP's . Timing analysis, validation and debug across multiple PVT conditions using PT/Tempus. Run Primetime and/or Tempus for STA flow optimization and Spice to STA correlation. Evaluate multiple timing methodologies/tools on different designs and technology nodes. Work on automation scripts within STA/PD tools for methodology development. Good Technical writing and Communication skills, should be willing to work in cross-collaborative environment Experience in design automation using TCL/Perl/Python. Familiar with digital flow design implementation RTL to GDS ICC, Innovous , PT/Tempus Familiar with process technology enablementCircuit simulations using Hspice/FineSim, Monte Carlo.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Job Role * Physical Design Life cycle of chip development, especially Floorplanning and PnR * Hands on PD execution at block/SoC level along with PPA improvements * Strong understanding of the technology and PD Flow Methodology enablement. * Work with Physical design engineers to rollout robust, identify areas for flow improvement methodologies. (area/power/performance/convergence), develop plans and deploy/support them * Provide tool support and issue debugging services to physical design team engineers across various sites * Develop and maintain 3rd party tool integration and productivity enhancement routines * Understand advance tech PNR and STA concepts and methodologies and work closely with EDA vendors to deploy solutions. Skill Set * Strong programming experience & Proficiency in Python/Tcl/C++ * Understand physical design flows using Innovus/fc/icc2 tools * Knowledge of one of Encounter/Innovus or FC (or other equivalent PNR tool) is mandatory * Basic understanding of Timing/Formal verification/Physical verification/extraction are desired * Ability to ramp-up in new areas, be a good team player and excellent communication skills desired Experience 3-5 years of experience with the Place-and-route and timing closer and power analysis environment is required Niche Skills Handling support tools like Encounter/Innovus/edi/fc/Icc2 (or other equivalent PNR tool). One or more of the above is mandatory*

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.This requirement is for DDR PD team for Bangalore. Number of openings: Sr. Lead (6 to 8 years) 2 Staff (8 to 10 years) 1 Sr Staff (10 to 12 years) 1 Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. Strong expertise in STA timing analysis basics, AOCV/POCV concepts, CTS, defining and managing timing constraints, Latch transparency handling, 0-cycle, multi-cycle path handling Hands-on experience with STA tools - Prime-time, Tempus Have experience in driving timing convergence at Chip-level and Hard-Macro level In-depth knowledge cross-talk noise, Signal Integrity, Layout Parasitic Extraction, feed through handling, Knowledge of ASIC back-end design flows and methods and tools (ICC2, Innovus) Knowledge of Spice simulation Hspice/FineSim, Monte Carlo. Silicon to spice model correlation. Proficient is scripting languages – TCL, Perl, Awk Basic knowledge of device phy STA setup, convergence, reviews and signoff for multi-mode, multi-voltage domain designs Qualcomm Hexagon DSP IP's . Timing analysis, validation and debug across multiple PVT conditions using PT/Tempus. Run Primetime and/or Tempus for STA flow optimization and Spice to STA correlation. Evaluate multiple timing methodologies/tools on different designs and technology nodes. Work on automation scripts within STA/PD tools for methodology development. Good Technical writing and Communication skills, should be willing to work in cross-collaborative environment Experience in design automation using TCL/Perl/Python. Familiar with digital flow design implementation RTL to GDS ICC, Innovous , PT/Tempus Familiar with process technology enablementCircuit simulations using Hspice/FineSim, Monte Carlo.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Qualcomm's Bangalore WLAN PHY (Baseband) team is seeking VLSI Digital Design Engineers to lead IP development for the latest WiFi standards. Our WLAN PHY team, comprised of highly passionate and seasoned domain experts, prides itself on years of experience in taking WLAN PHY designs from concept to silicon independently. WLAN PHY team is responsible for delivering the end-to-end Tx/Rx DSP chains – all the way from antenna samples post ADC to raw bits for upper layers and on the reverse path from raw bits to DAC. The team specializes in working with challenges of practical high-speed wireless communication systems and finding innovative solutions to counter them. The team works extensively on typical signal processing functions like filters, matrix transformations (e.g.QR, Cholesky decomposition), channel estimation, equalization (MMSE, MRC, ML), decoders/encoders (e.g.LDPC, Viterbi) , demodulators, FFT etc. on a day-to-day basis, and contributes to the development/ enhancement/ evaluation of signal processing algorithms to cater to new requirements. We are looking for someone as passionate as us and takes pride in their work. WiFi's ubiquity in modern times is undeniable, and the IEEE 802.11 Working Group is continually developing new standards to satisfy the growing demand for high throughput and low-latency real-time applications, such as VR and AR. Qualcomm is at the forefront of the WiFi revolution, aiming to become the global leader in WiFi chip solutions. The WLAN PHY team in Bangalore is instrumental in realizing this vision. : Looking for a candidate with 1 to 3 years of hands-on experience in micro-architecting and developing complex IPs. Expertise in digital design, VLSI concepts, and experience in creating power/area-efficient IPs across multiple clock domains are essential. Proficiency in RTL coding and familiarity with RTL QA flows such as PLDRC, CDC, and CLP (optional) is expected. Candidates should be capable of proposing design alternatives to meet area/power/performance specifications and presenting these options for review. Experience in leading, guiding, or managing junior team members is advantageous. Repeated success in taking IP designs from requirements to silicon is required. While not mandatory, having developed IPs for wireless technologies (WLAN, LTE, NR, BT, UWB, etc.) or past HLS experience would be beneficial. Skills: Must have: Proficient in Verilog RTL coding, uArch, CDC check, PLDRC, Timing constraints, Python/Perl. Experience in design/debugging complex data-path/control-path IPs. Good communication, analytical & leadership skills. Good to have: System Verilog, Visio, Knowledge of signal processing concepts/algorithms and Wi-Fi standards (802.11a/b/g/n/ac/ax), experience with HLS. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Bachelor’s or Master’s degree from a top-tier institute. 6-8 years of experience in physical design from product-based companies. Experience: Proven experience in managing complex subsystems and small teams. Proficiency in complete Netlist2GDSFloorplan, place and route (PnR), and sign-off convergence, including Static Timing Analysis (STA) and sign-off optimizations. Hand on experience in lower technology nodes. Job : Expertise in meeting demanding Power, Performance, and Area (PPA) requirements for complex subsystems/System on Chips (SoCs), place and route, and IP integration. Experience in low power design implementation, including Unified Power Format (UPF), multi-voltage domains, and power gating. Familiarity with ASIC design flows and physical design methodologies. Strong understanding of circuit design, device physics, and deep sub-micron technology. Experience working on multiple technology nodes in advanced processes. Proficiency in automation to drive improvements in PPA. Managing and driving a small team for project execution and PPA targets

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Responsibilities: STA setup, convergence, reviews and signoff for multi-mode, multi-voltage domain designs. Timing analysis, validation and debug across multiple PVT conditions using PT/Tempus. Run Primetime and/or Tempus for STA flow optimization and Spice to STA correlation. Evaluate multiple timing methodologies/tools on different designs and technology nodes. Work on automation scripts within STA/PD tools for methodology development. Good Technical writing and Communication skills, should be willing to work in cross-collaborative environment Experience in design automation using TCL/Perl/Python. Familiar with digital flow design implementation RTL to GDS ICC, Innovous , PT/Tempus Familiar with process technology enablementCircuit simulations using Hspice/FineSim, Monte Carlo. Education B.Tech or MTech/MS in Electrical/Electronics/Microelectronics/VLSI. Preferred Qualification/Skills 5 - 10 years of experience in STA/Timing Strong expertise in STA timing analysis basics, AOCV/POCV concepts, CTS, defining and managing timing constraints, Latch transparency handling, 0-cycle, multi-cycle path handling Hands-on experience with STA tools - Prime-time, Tempus Have experience in driving timing convergence at Chip-level and Hard-Macro level In-depth knowledge cross-talk noise, Signal Integrity, Layout Parasitic Extraction, feed through handling, Knowledge of ASIC back-end design flows and methods and tools (ICC2, Innovus) Knowledge of Spice simulation Hspice/FineSim, Monte Carlo. Silicon to spice model correlation. Proficient is scripting languages – TCL, Perl, Awk Basic knowledge of device physics

Candidate should be exeprinecd in process development in R&D in API synthesis Candidate with the exeprience of handelling Photo reactor will be prefered . Experience in Vitamin synthesis will be prefered

SE NIOR SILICON DESIGN ENGINEER THE ROLE: The focus of this role is to plan, implement, and execute the Physical design and verification of processing subsystems IP, resulting in meeting the signoff criteria for tapeout. THE PERSON: You have a passion for modern, complex processor architecture, digital design, and Implementation in general. You are a team player who has excellent communication skills and experience collaborating with other engineers located in different sites/ timezones . You have strong analytical and problem-solving skills and are willing to learn and ready to take on problems. PREFERRED EXPERIENCE: 5+ Years of experience in relevant domain. Experienced with Blocklevel and Toplevel Physical implementation. Good understanding and hands-on experience in Lower node technologies. (7nm/5nm or below) Preferably working on Lowpower or processor designs. Proficient in Working with various EDA tools. Innovus, Fusion compiler/ICCompiler2, Primetime etc.., Scripting language experience: Perl, Ruby, Makefile , shell preferred. Exposure to leadership or mentorship is an asset ACADEMIC CREDENTIALS: Bachelors or Masters degree in computer engineering/Electrical Engineering #LI-SR4 Benefits offered are described: AMD benefits at a glance .

About Marvell . Your Team, Your Impact Built on decades of expertise and execution, Marvell s custom Processor/ASIC solution offers a differentiated approach with a best-in-class portfolio of data infrastructure intellectual property (IP) and a wide array of flexible business models. In this unique role, you ll have the opportunity to work on both the physical design and methodology for future designs of our next-generation, high-performance processor chips in a leading-edge CMOS process technology, targeted at server, 5G/6G, and networking applications. What You Can Expect This role is based in Bangalore - India. You will work with both local and global team members on the physical design of complex chips as well as the methodology to enable an efficient and robust design process. This position also provides an exciting platform to engage with diverse engineering challenges within a collaborative and innovative environment at Marvell. Key responsibilities include: Work with design teams across various disciplines such as Digital/RTL/Analog to ensure design convergence and integration in a timely manner. Implement/support designs with multi-voltage designs through all aspects of implementation (place and route, static timing, physical verification) using industry standard EDA tools. Work with RTL design teams to drive assembly and design closure. Provide technical direction, coaching, and mentoring to junior employees and colleagues when necessary to achieve successful project outcomes. Write scripts in Shell, Python, and TCL to extract data and achieve productivity enhancements through automation. What Were Looking For To be successful in this role you must: Bachelor s, Master s, or PhD degree in Electrical Engineering, Computer Engineering, or a related field. 9+ years of progressive experience in back-end physical design and verification. Expertise in full-chip & sub-hierarchy integration. Experience integrating and taping out large designs utilizing a digital design environment. Good understanding of RTL to GDS flows and methodology. Good scripting skills in Perl, tcl and Python. Good understanding of digital logic and computer architecture Knowledge of Verilog. Good communication skills and self-discipline contributing in a team environment. Experience with multi-voltage and low-power design techniques is a plus. Experience with Cadence Innovus is preferred. Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. #LI-MN1

About Marvell . Your Team, Your Impact Built on decades of expertise and execution, Marvell s custom Processor/ASIC solution offers a differentiated approach with a best-in-class portfolio of data infrastructure intellectual property (IP) and a wide array of flexible business models. In this unique role, you ll have the opportunity to work on both the physical design and methodology for future designs of our next-generation, high-performance processor chips in a leading-edge CMOS process technology, targeted at server, 5G/6G, and networking applications. What You Can Expect In this role based in Bangalore - India, you will work with a global team on both the physical design of complex chips as well as the methodology to enable an efficient and robust design process. You will be responsible for maintaining, enhancing, and supporting Marvells Place and Route Flow, leveraging industry-standard EDA tools. Your tasks will include performing synthesis, place and route, as well as timing analysis and closure on multiple intermediate and complex logic blocks. You will play a crucial role in developing and implementing timing and logic ECOs, collaborating closely with the RTL design team to drive modifications that address congestion and timing issues. Additionally, your involvement with the global timing team will include debugging and resolving any block-level timing issues encountered at the partition level. This position provides an exciting platform to engage with diverse engineering challenges within a collaborative and innovative environment at Marvell. What Were Looking For Completed a Bachelor s Degree in Electronics/Electrical Engineering or related fields and have 4-8 years of related professional experience OR a Master s degree and/or PhD in Electronics/Electrical Engineering or related fields. In your coursework, you must have completed a digital logic course and projects that involved circuit design, testing, and timing analysis. Good understanding of standard Synthesis to GDS flows and methodology. Good scripting skills in languages such as Perl, tcl, and Python. Good understanding of digital logic and computer architecture. Hands-on experience in advanced technology nodes upto 2nm. Strong hands-on experience in blocks/subsystem P&R implementation using Cadence Innovus and Synopsys FC. Strong experience in block level signoff power, timing, PV closure & debugging skills. Good top level and full-chip experience is an added advantage Knowledge of Verilog/VHDL. Good communication skills and self-discipline contributing in a team environment. Ability to independently drive subsystems/IPs P&R and signoff closure working with global teams. Ability to mentor juniors and be involved in team development activities. Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. #LI-MN1

Project Role : Application Lead Project Role Description : Lead the effort to design, build and configure applications, acting as the primary point of contact. Must have skills : Design for Testability (DFT) Good to have skills : NAMinimum 7.5 year(s) of experience is required Educational Qualification : 15 years full time education Summary :As an Application Lead, you will lead the effort to design, build, and configure applications, acting as the primary point of contact. Your day will involve overseeing the application development process, coordinating with team members, and ensuring project milestones are met. Roles & Responsibilities:Bachelors degree in computer science, Electronics Engineering or related fields and 6+ years of related professional experience.Thorough knowledge on various DFT/Test architecture solutions and should be involved in DFT-Architecture definition of at-least couple of DesignsCore DFT skills considered crucial for this position should include some of the following Scan compression and insertion, Memory BIST, Logic BIST, JTAG/IJTAG, at-speed test, ATPG, fault simulation, back-annotated gate-level verification, silicon debugUnderstanding of DFT Flows and Methodologies and Experience with Cadence/Mentor/Synopsys Tool set (Genus,Modus,NCSim / DC,Tessent,Spyglass/Tmax)Experience coding in Verilog RTL, and scripting language like TCL, and/or PerlProficient in Unix/Linux environmentsStrong fundamentals in Digital Circuit Design and Logic Design are required. Professional & Technical Skills: - Must To Have Skills: Proficiency in Design for Testability (DFT)- Strong understanding of software development methodologies- Experience in leading and managing software development projects- Knowledge of technologies and tools used in software development- Excellent communication and interpersonal skills Additional Information:- The candidate should have a minimum of 5 years of experience in Design for Testability (DFT)- This position is based at our Chennai office- A 15 years full time education is required Qualification 15 years full time education

About Marvell Marvell s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Built on decades of expertise and execution, Marvell s custom Processor/ASIC solution offers a differentiated approach with a best-in-class portfolio of data infrastructure intellectual property (IP) and a wide array of flexible business models. In this unique role, you ll have the opportunity to work on both the physical design and methodology for future designs of our next-generation, high-performance processor chips in a leading-edge CMOS process technology, targeted at server, 5G/6G, and networking applications. What You Can Expect As a senior leader in the central physical design team, you will: Shape the long-term vision for physical design capabilities and infrastructure in alignment with company-wide technology strategy. Lead RTL-to-GDSII implementation for multiple SoC programs, overseeing synthesis, floorplanning, power grid design, place and route, clock tree synthesis, timing closure, power/signal integrity signoff, and physical verification (DRC/LVS). Provide strategic leadership and technical direction to physical design teams, ensuring successful and timely tapeouts of complex, high-performance SoCs. Mentor and develop engineering talent, fostering a culture of innovation, collaboration, and continuous improvement. Oversee team structure, hiring, performance management, and career development to build and retain a high-performing physical design organization. Drive cross-functional collaboration with design teams to influence design decisions and ensure successful project execution. Navigate and resolve cross-functional conflicts effectively, fostering alignment and maintaining momentum across diverse teams. Drive the development and adoption of next-generation physical design methodologies, flows, and automation to improve productivity and design quality. Manage project schedules, resources, and risk, ensuring alignment with business goals and customer requirements. Represent the physical design function in cross-org and executive-level discussions, contributing to long-term technology and product strategy. Collaborate with EDA vendors and internal CAD teams to evaluate and deploy new tools and technologies. What Were Looking For Bachelor s, Master s, or PhD degree in Electrical Engineering, Computer Engineering, or a related field. 18+ years of progressive experience in back-end physical design and verification, including significant leadership roles. Proven track record of leading and scaling physical design teams, managing complex SoC projects, and delivering high-quality tapeouts under aggressive schedules. Deep expertise in hierarchical physical design strategies, methodologies, and advanced process node challenges. In-depth understanding of current design technologies used in major foundries. Strong understanding of ASIC design flow, RTL integration, synthesis, and timing closure. In-depth knowledge of modern EDA tools and flows. Proficient in automation and scripting using Makefile, Tcl, Python, or Perl to enhance design efficiency and flow robustness. Strong communication and collaboration skills, with the ability to influence cross-functional teams and executive stakeholders. Experience in developing and deploying advanced physical design methodologies and flows. Familiarity with AI/ML-driven optimization in physical design tools is a plus. Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. #LI-MN1

We Are Hiring: Principal Engineers Chip Design (Back End / Front End / Analog IP/IC) Preferred Skills and Experience: Minimum 1+ years of experience in Project Management (Waterfall and Agile Hybrid methodology) Exposure to continuous improvement and cross-functional collaboration Educational Qualifications: Master's degree in VLSI Design from reputed institutes (IITs/NITs preferred) Bachelor's in Electronics and Communication or a related field 1. Job Title: Principal Engineer – Chip Design Back End Required Skills & Experience: Minimum 8+ years of strong experience in backend flows for MCU or low-power SoC designs Leadership experience with DFT, Physical Design, and Formal Verification teams Exposure to Frontend and Analog design processes Ability to collaborate effectively across functional teams Experience in product support during both pre- and post-production stages (including RMA support) 2. Job Title: Principal Engineer – Chip Design Front End Required Skills & Experience: Minimum 8+ years of experience in system architecture for ARM-based MCU product development Expertise in RTL design, RTL coding, and RTL integration Strong debugging and design capabilities Experience leading verification teams, including static and dynamic verification, test management (UPF, GLN, Test Modes) Familiarity with industry-standard EDA tools (e.g., Synopsys for LINT, CDC, SDC validation, and power analysis) Exposure to Backend and Analog design processes Cross-functional collaboration with PD, DFT, and STA teams for timing and power closure Experience in pre- and post-production product support and RMA handling 3. Job Title: Principal Engineer – Analog IP/IC Design Required Skills & Experience: Minimum 8+ years of experience in custom analog/mixed-signal IC design Proficiency in variation-aware design, verification planning, and analog layout parasitic extraction (LPE) Hands-on experience with analog/mixed-signal EDA tools (e.g., Cadence, Synopsys) Strong debugging and design validation skills Product support experience across development lifecycle, including RMA stage

Physical Deisgn Lea LocationBangalore / Hyderabad / Pune Experience - 8+ YoE In-depth knowledge and hands-on experience on Netlist2GDSII Implementation i.e. Floor planning, Placement, CTS, Routing, STA, Power Integrity Analysis, Physical Verification. Should have experienceon Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl. Must have hands-on experience on Synopsys/Cadence tools. (Innovus, ICC2, Primetime, PT-PX, Calibre). Well versed with timing constraints, STA and timing closure. Should have experience on Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl Well versed with timing constraints, STA and timing closure. Do 1. Lead end to end VLSI components & hardware systems a. Design, analyze, develop, modify and evaluate the VLSI components and hardware systems b. Determine architecture and logic design verification through software developed for component and system simulation c. Analyze designs to establish operating data, conducts experimental tests and evaluates results to enable prototype and production VLSI solutions d. Conduct system evaluations and make appropriate recommendations to modify designs or repair equipment as needed e. Allocates modules for testing and verification and reviews data and project documentation f. Provides guidance on technical escalations and review regression testing data g. Prepares documentation containing information such as test case and product scripts for IP and publishes it to the client for feedback and review h. Ensures all project documentation is complete and uploaded as per technical specifications required by the client 2. Provide customer support & governance of VLSI components & hardware systems a. Identify and recommend system improvements to improve technical performance b. Inspect VLSI components & hardware systems to ensure compliance with all applicable regulations and safety standards c. Be the first point of contact to provide technical support to client and help debug specific, difficult in-service engineering problems d. Evaluate operational systems, prototypes and proposals and recommend repair or design modifications based on factors such as environment, service, cost, and system capabilities 3. Team Management a. Resourcing i. Forecast talent requirements as per the current and future business needs ii. Hire adequate and right resources for the team iii. Train direct reportees to make right recruitment and selection decisions b. Talent Management i. Ensure 100% compliance to Wipros standards of adequate onboarding and training for team members to enhance capability & effectiveness ii. Build an internal talent pool of HiPos and ensure their career progression within the organization iii. Promote diversity in leadership positions c. Performance Management i. Set goals for direct reportees, conduct timely performance reviews and appraisals, and give constructive feedback to direct reports. ii. Incase of performance issues, take necessary action with zero tolerance for will based performance issues iii. Ensure that organizational programs like Performance Nxt are well understood and that the team is taking the opportunities presented by such programs to their and their levels below d. Employee Satisfaction and Engagement i. Lead and drive engagement initiatives for the team ii. Track team satisfaction scores and identify initiatives to build engagement within the team iii. Proactively challenge the team with larger and enriching projects/ initiatives for the organization or team iv. Exercise employee recognition and appreciation Deliver No. Performance Parameter Measure 1. Verification Timeliness, Quality and coverage of verification, Compliance to UVM standards, Customer responsiveness 2. Project documentation and MIS 100% on time MIS & report generation Complete Project documentation (including scripts and test cases) 3. Team % trained on new skills, Team attrition %, Employee satisfaction score (ESAT) Mandatory Skills: VLSI Physical Place and Route. Experience5-8 Years.