325 Pcb Jobs - Page 13

About Us We're building the next generation of smart calculators for modern retailers tools that go far beyond basic math. These devices integrate dynamic QR code generation, digital payments, inventory tracking, and more. Think of it as a POS terminal disguised as a calculator — but way smarter.Our mission is simple yet ambitious: to replace over 30 million traditional calculators sitting on shop counters across the world. If you're passionate about creating intuitive, impactful hardware that empowers everyday users — join us in redefining what a calculator can do. Role Overview As Lead Hardware Engineer , you’ll lead the design, prototyping, and mass production of our core product: a smart calculator that integrates embedded systems, custom PCB design, and peripherals like dynamic displays and audio feedback. You'll own the entire hardware lifecycle—from idea to shop counter. Responsibilities 1. Hardware Architecture & Design Leadership Own the architecture, design, and development of embedded hardware for retail and consumer devices. Ensure scalable, efficient, and innovative design practices aligned with business goals. 2. Embedded System & Component Strategy Drive component selection and system integration across displays, keypads, memory, power, and wireless modules (Wi-Fi/Bluetooth). Optimize for low power consumption, compact form factor, and durability in field conditions. 3. Firmware Coordination & Co-Development Collaborate closely with embedded software and firmware teams to ensure seamless hardware-software integration. Oversee design verification and validation processes for system-level functionality. 4. Vendor & Manufacturing Management Manage relationships with external vendors, manufacturers, and prototyping partners. Oversee hardware development from prototyping through to production and testing. 5. Cost Optimization & Mass Production Readiness Implement design-for-manufacturability (DFM), design-for-testability (DFT), and cost-effective strategies for high-volume production. Ensure compliance with industry and regulatory standards. 6. Quality Assurance & Field Support Define hardware quality metrics, testing protocols, and certification standards. Lead root-cause analysis and resolution of hardware issues encountered in production or field deployments. 7. Cross-Functional Product Collaboration Partner with product management, software, and UX teams to align hardware capabilities with user and business requirements. Contribute to roadmap planning and feature prioritization from a hardware perspective. 8. Team Building & Leadership Build, mentor, and lead a high-caliber hardware engineering team. Foster a culture of technical excellence, accountability, and continuous improvement. Background B.Tech/M.Tech in Electronics, Electrical, Embedded Systems, or Mechatronics. 5+ years of experience in embedded product development , IoT hardware , or consumer electronics . Proven experience designing and shipping custom hardware products at scale. Strong grasp of microcontrollers (e.g., STM32, ESP32, RP2040), peripheral interfacing , and embedded programming . Experience in PCB design tools (Altium, KiCAD, Eagle, etc.). Familiar with dynamic QR code generation , audio output integration , and display interfaces . Bonus: Hands-on with 3D CAD for enclosures , thermal/power analysis , and compliance certifications . You're a Great Fit If You: Can bridge hands-on prototyping with strategic leadership. Love building hardware that just works in the hands of real people. Are excited by the impact of solving real-world problems for millions of shopkeepers . Know how to scale from garage-level testing to production-level stability. Why Join Us? Be part of a startup solving real problems in India’s retail ecosystem. Lead the hardware vision of a first-of-its-kind product . Influence product direction from the ground up. Build tech that makes an actual difference in people’s lives. Location: Bangalore (or Hybrid) Experience: 5–10 years Industry: Consumer Electronics / Embedded Systems / IoT Devices Key Criteria – To Apply 10,000+ Units Shipped – You must have designed, manufactured, and successfully delivered hardware at this scale. Real-World Impact – Share tangible examples of products you have built, shipped, and serviced. Compensation: 20-25 LPA + ESOPs (Negotiable) If you're the right fit, we’ll ensure money is never a concern—in the short or long run. This is more than a job; it’s a generational wealth-building opportunity. If you have built and delivered at scale, we would love to see your work. Send an email to, hr@tohands.Role & responsibilities Preferred candidate profile

About Role The PCB Layout Design is the role that would closely work with Design Engineers on Multilayer & High- speed PCB Design, Schematic Drafting, Co-ordination activities. As an expert designer would also provide innovative & creative solutions to the team to deliver an optimized design layout. Preferred candidate profile Minimum 3 years of experience in High Speed Board Design Handling the schematic/circuit designs Designing the multilayer PCBs & generate the gerber files Ensuring quality of release of Gerber, Bill of Material, and drawings. Generate and maintain PCB specifications. Ensure PCBs are Designed for Manufacturability and Testing. Cooperate with PCB/PCBA manufacturers & get the PCBs Role & responsibilities Experienced in designing the schematic & PCBs upto 12 layers. Experienced in using any one of standard PCB design tool like Altium EDA. Experienced in designing the circuit, schematic design based on the requirement Experience in preparing the right BOM as per the requirement. Experience in handling EMD/EMI standards to meet the certifications like ROHS, FCC. Experience in designing PCBs pertaining to RF or IOT Products is an added advantage. Good Communication Skills.

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } R&D PRODUCT DVL PCB ENGINEER I- PCB Design Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB CAM engineer is scalable to contribute individually. He/she is responsible for delivering the project with zero DFM’s for manufacturing. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board DFM validation. The candidate is expected to interface with US and China based fabrication vendors and independently work on resolving vendor engineering queries while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to validate detailed manufacturing aspects of pcb using CAM350. The candidate will be responsible for ensuring the accuracy and functionality of the end design (includes IPC matching, Min/max clearance definition) and be able to take ownership of various aspects of the DFM constraint. Candidate Desired Profile: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board validation is required. Very good exposure in CAM software – CAM350 Previous work experience in high-speed board validation will be highly preferred. Able to address supplier Engineering Queries. Familiarity with the following a plus: Altium, Allegro Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork ABOUT TE CONNECTIVITY TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, renewable energy, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 8,000 engineers, working alongside customers in approximately 140 countries. TE ensures that EVERY CONNECTION COUNTS. Learn more atwww.te.com and onLinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events Employee Resource Group Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131828 Alternative Locations: Function: Engineering & Technology Job Segment R&D Engineer, Manufacturing Engineer, Design Engineer, Testing, Fabrication, Engineering, Technology, Manufacturing Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } PRINCIPAL R&D/PRODUCT DVL ENGINEER Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelor’s degree in electrical or electronicsengineering, master’s degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIR’s, CTLE’s) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131404 Alternative Locations: Function: Engineering & Technology Job Segment Six Sigma, R&D Engineer, Electrical, Electronics Engineer, Hardware Engineer, Management, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Sr Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Bachelor’s degree in Electrical Engineering or equivalent work experience 5 years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently DESIRED SKILLS: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 132207 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Electrical Engineering, Drafting, Manufacturing Engineer, Front End, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Sr Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Bachelor’s degree in Electrical Engineering. Should have total work experience of 3-5+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design(high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: 10% to 25% Requisition ID: 131811 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Drafting, Electrical Engineering, Manufacturing Engineer, Front End, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } R&D/PRODUCT DVL ENGINEER II At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profile Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competency ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more atwww.te.com and onLinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events Employee Resource Group IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131824 Alternative Locations: Function: Engineering & Technology Job Segment R&D Engineer, Manufacturing Engineer, Testing, Engineer, Electrical, Engineering, Technology Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } SR R&D/PRODUCT DVL ENGINEER At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview The Sr. R&D/Product Development Engineer will be responsible for Design & Development of RF circuits/modules for RFoF (Radio Frequency Over Fiber) products for Aerospace, Defense & Marine Market requirements. The Sr Engineer will work closely with global and local cross functional teams to develop products by translating a customer requirements into a product requirement, work through the development cycle including testing, approval and release into Production. Responsibilities Design and analysis of RF and/or Mixed Signal hardware, define RF link architecture Conduct detailed electrical design, supporting prototype and final hardware build & test Carry out component selection, schematic capture and PCB layout of parts Lead RF hardware projects from design to test to delivery through proper design methodology. Ensure on time delivery and first time right approach in all the project deliverables. Work with local and global counterpart / stake holder for ensuring quality deliverable and project execution. Interface with system, mechanical, software, and other engineers for ensuring design and task completion Work closely with third party vendor / supplier to define the technical requirements for the product and project execution. Mentor the new team members on design and development of RF product design Required Skills Education/ Knowledge: BE/BTech with specialization in Electronics & Communications Engineering Min 10 years of experience in RF Microwave board design and development Critical experience: Experience with RF Microwave design for aerospace & defense applications Handson with LNA and RF PA design and functional testing RF link loss analysis for transceivers and RADAR applications Experience with ADS or Microwave Office, Cadence, Sonnet and HFSS software applications Familiarity with standard test equipment such as oscilloscopes, power meters, logic analyzers, signal/spectrum analyzers, etc. Familiarity with EMI/EMC requirements, qualification processes and electronics documentation Knowledge of RF module applications such as RADAR, Satcom, C5ISER, EW Familiarity with optical transceivers will be an added advantage COMPETENCIES Technical capabilitiesExpert functional/domain knowledge Strong Technical Aptitude with Willingness to learn new Technologies quickly. Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 134427 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Aerospace Engineering, R&D Engineer, Electronics Engineer, Electrical, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsbilties: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Should have total work experience of 3-8+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: 10% to 25% Requisition ID: 131812 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Drafting, Manufacturing Engineer, Front End, CAD, Technology, Engineering Apply now »

Identify and define architecture-level design blocks, and implement corresponding electronic circuits to meet required specifications and functionality. Create high-quality schematics and PCB layouts using industry-standard design tools such as Altium Designer , Mentor PADS , or equivalent. Design, develop, and test electronic circuits for a range of applications, including SMPS , PoE switches , IoT devices , and Ethernet switches (experience with Ethernet switch design is a strong advantage). Apply sound knowledge of fundamental electronic components such as MOSFETs , transistors , diodes , and logic gates in circuit design and analysis. Demonstrate hands-on experience in circuit development using microcontrollers like ESP32 , MSP430 , PIC , STM32 , and REALTEK 83 series. including circuit simulation and real-world testing. Integrate and interface various peripherals and modules such as HMI displays , temperature sensors , motion detectors , and cameras . Proficient in multiple communication protocols including UART , USART , I2C , CAN , Bluetooth , USB , Wi-Fi , and Ethernet . Possess in-depth knowledge and practical experience in EMI/EMC testing and compliance. Provide technical guidance and mentorship to J unior engineers , supporting their design, testing, and development efforts. Operate standard lab testing equipment such as DSOs (Digital Storage Oscilloscopes) , digital multi meters , function generators , and other diagnostic tools.

Were Hiring! | Technical Sales Engineer SMT / PCBA Equipment Location: Chennai / Bangalore, India Company: EWG Apply at: carrerewglobal@gmail.com Position Overview: We are looking for an experienced and results-driven Technical Sales Engineer specializing in SMT / PCBA equipment and consumables. This is a full-time, on-site position based in Chennai / Bangalore. As part of our growing sales team, you will play a key role in understanding customer requirements, providing technical consultation, and driving sales of high-performance SMT solutions. Key Responsibilities: Drive sales of SMT/PCBA equipment and consumables Provide technical support and product demonstrations to clients Develop and maintain strong customer relationships Understand customer pain points and recommend appropriate solutions Collaborate with the internal technical team to deliver exceptional customer service Qualifications: 2 to 4 years of experience in SMT / PCBA industry (mandatory) Strong technical knowledge in SMT equipment, PCB assembly processes Excellent communication and interpersonal skills Proven track record in technical sales and customer support Diploma Engineering / Bachelor's degree in Engineering or a related technical field Problem-solving mindset with a customer-first approach Why Join Us? Work with a company at the forefront of ECO-Friendly electronics manufacturing. Be part of a technically strong and supportive team Opportunity to grow with a rapidly expanding business Ready to take the next step in your career? Send your resume to carrerewglobal@gmail.com Lets build the future of electronics manufacturing together!

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Work with cross-functional teams on SoC Power and architecture for mobile SoC ASICs. Skills/Experience At least 4-12 years of experience are required in the following areas: Low power intent concepts and languages (UPF or CPF) Power estimation and reduction tools (PowerArtist/PTPX,Calypto) Power dissipation and power savings techniques- Dynamic clock and voltage scaling Power analysis (Leakage and dynamic) and thermal impacts Power Software features for power optimization Voltage regulators including Buck and Low Drop out ASIC Power grids and PCB Power Distribution Networks Additional skills in the following areas are a plus: Mobile Baseband application processors chipset and power grid understanding UPF-based synthesis and implementation using Design Compiler Structural low power verification tools like CLP or MVRC Outstanding written and verbal communication skills Responsibilities Defining chip and macro level power domains System Level Power Modeling Mixed signal power analysis Power Island/Power Gating/Power Isolation Structural Low power design of level shifter and isolation cell topology and associated rules Architectural analysis and development of digital power optimization logic/circuits/SW Work with Power Management IC developers for power grid planning Creating detailed architecture and implementation documents Education Requirements RequiredBachelor's, Computer Engineering and/or Electrical Engineering PreferredMaster's, Computer Engineering and/or Electrical Engineering Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.

Job Area: Engineering Group, Engineering Group > Hardware Applications Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Job Function Qualcomm is looking for candidates to support its customers in designing solutions using Qualcomm Hardware and Software. The Individual will contribute to the dynamic HW Applications engineering team for end product designs. The Individual will also be responsible for supporting Qualcomm's growing portfolio of platforms/applications and the job involves working closely with internal partners in Product definition as appropriate. About The Role The PMIC "“ H/W application Engineer will be responsible for supporting Qualcomm"™s growing portfolio mobile phone platforms. The job involves working closely with partners and customers of Qualcomm to define the specifications of the mobile phone handset products, part selection, system design, design reviews, support while doing system debug, partner deliverables etc. As a member of Qualcomm customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in mobile, PC, and consumer electronics markets. Individual will be responsible to work closely with cross function teams in Qualcomm, including design engineering, systems engineering, characterization team, ATE test team, SW team, product marketing, program management and peers in customer engineering organization across multiple regions. Individual will be responsible to create chipset documentation, reference schematics, training material, application notes for worldwide customer support. Individual will be responsible to engage with customer designs, assist customers in feature definition and design reviews, provide in-depth technical responses to customer queries, do troubleshooting of customer designs and provide necessary training to customers. Past expertise in interacting with multiple teams in HW, SW domains, skills in Digital/Baseband and sound technical knowledge of Qualcomm PMICs are desirable. . Preferred Qualifications Sound understanding of LDO/SMPS - Must to have Experience on power management for portable devices will be a plus Strong understanding PCB Signal/power integrity "“ Should be comfortable reviewing schematic/suggest changes for improvement - Experience with Schematic entry will be a plus . Should be fluent with CAD tools like Allegro/PADs to review customer layout . Knowledge on crystals/Clocks - Must to have Knowledge on display backlighting schemes - Must to have Knowledge on LabVIEW/python "“ Will be a plus Experience on Analog and mixed signal bench validation "“ Will be a plus Knowledge on battery charging and Fuel gauge will be a plus Good communication skills Keywords Power Management, Applications, Analog, PMIC, SMPS, DC/DC Converter, Buck, Boost, LDO, charger, fuel gauge/gas gauge, LED driver, ADC, oscillator, amplifier, Educational Requirements Bachelor's or Masters in Electronics and/or Electrical Engineering with 3 -5 years of relevant industrial experience

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. The Power & Signal Integrity Group (PSIG) resides in the CHS (Central Hardware Systems) unit of Qualcomm Technologies, Inc., a leader in wireless communication technology. Engineers in the Power & Signal Integrity Group work with the various business units across Qualcomm to help bring leading edge mobile, AR\VR, IoT, Automotive and various others products to market. The candidate will work in a team-oriented environment with cross functional leads to provide electrical design expertise in the areas of signal integrity and power integrity for the design of wireless products and development systems. The engineer will be located in Bangalore, India and will be closely working with the Product architects, Platform HW teams, IO\PHY, IC Packaging, and other teams. The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 2+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models The following experience is a plus: DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Education Requirements: Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferred

Position: Trainee Engineer Qua: Diploma/ BE/ B. Tech - Electronics/ Electrical Location: Bhor Pune Dept: Quality, Production, SMT

The Primary role includes the development, verification, and validation of advanced lithium-ion battery systems. This also includes involvement in all the different stages of product development, from understanding hardware design, validation test cases definition, creation of test benches necessary to execute these tests, to the flawless execution of the tests, etc. Understanding hardware design and integration scenarios. Identifying and reviewing requirements. Defining hardware and system-level test cases. Taking the prototypes through testing, which also includes identifying and qualifying partners and suppliers relevant to BMS (Battery management system) standards, as per compliance. Data analysis based on real-time data. Communication with the technical team of US and China. Responsible for hardware and software level testing. Validating BMS firmware on system level and pack level.

Engineer/Sr Engineer -Mechanical Design Centum Electronics Ltd is a leading ESDM (Electronics System Design & Manufacturing) Indian Multinational Company founded in 1994 that offers, Mission Critical design, development & manufacturing of customized system/subsystem solutions for high-reliability applications for global customers in Defense, Aerospace, Space, Industrial, Medical, and Transportation domain. Centum has around 2000 plus employees and has operations across India, Europe and Canada. Centum has been recognized by World Economic Forum as a global growth company and Forbes Asia featured Centum as Asias 200 Best Companies under a Billion. The Strategic Electronics Business Unit designs, develops and manufactures customized, complex products for Defence and Space customers. Centum is a leading industry partner for Indias DRDO labs, Defence PSUs as well as the Indian Space Research Organization having delivered mission critical electronics on major missile, radar, electronic warfare & satellite applications. Centums unique microelectronics capability enables the development of lightweight, high reliability electronics for on-board applications. What You'll Do Design, development, and mechanical packaging for electronic hardware to meet mechanical, thermal, and structural requirements Hand calculation for vibration and thermal design Work with PCB design and electronic design engineer to arrive to optimum design and completion of project within the timeline Performing preliminary thermal and structural design and propose the design solution. Optimize the design based on the inputs received from various reviews and incorporate the design change to finalize the design Manufacturing drawings and documents preparation BOM creation Key values, beliefs, and attitudes Good written and verbal communication skills Good planning and organization skills Who You are BE in Mechanical with 3 to 8 years experience in Mechanical design for Electronics hardware Have strong Fundamentals in Mechanical design, thermal Design, solids of mechanics, heat transfer, and hand calculation. well conversant with engineering drawing conventions, drawing symbols, tolerancing, drafting/detailing, GD&T, assembly drawing and BOM Have good experience Using Solid works and AutoCAD

Roles and Responsibilities: Responsible for ensuring quality Standards for EMS Manufacturing- Surface mount, Through hole and Product assembly Representing customer for quality requirements (including international clients) In depth Knowledge in all the manufacturing processes of electronic industry. Monitoring of process performance through process audits, product audits, internal audits as part of Quality management systems, ISO 9001, IATF 16949, AS9100. Knowledge in 14001, 45001, 27001 preferred. Monitoring of daily line rejection and ensuring control of rejection through suggested actions. Best Practice implementation of similar industry. Monitoring and handling of customer complaints. Preparing and monitoring of corrective & preventive action for customers. Responsible for customer audits and timely closure of the action plans Ensuring Process non-conformances are raised and actions taken timely to mitigate them. Evaluating NPI projects with CFT Team, make time plan for production launch w.r.t Quality. Cross functional interaction to meet the requirements through CFT as and when required Hands-on working in the PFMEA and Control plan. Knowledge in SPC, MSA, MSL, IPC 610, Poka Yoke, Kaizen, six sigma, PPAP Knowledge in regulatory compliance RoHS, REACH, conflict minerals and IMDS Participate in supplier qualification, on boarding, supplier audits. Skills Required Good communication skill, ability to take initiative, creativity. Quick learner, hardworking, commitment dedication Taking challenge under any circumstances & willing to work in pressure. Good knowledge in sap quality management About Company: Avalon Technologies Private Limited (ATPL), Chennai is part of US based Sienna group. The Sienna group is in the business of Electronic Manufacturing Services (EMS) and the group has strategically chosen to focus on a vertically integrated product proposition in EMS space & holds a unique position in EMS landscape in India / US. The group has design and manufacturing facilities in USA as well as in India (Chennai & Bangalore) and focuses on high-mix, complex, mission critical, integrated solutions with high engineering content. The group operates in B2B space catering to multiple large industries such as Power, Railways, Aerospace, Communication, Automotive, and Medical which is spread across sectors. The group today is a preferred supplier to worlds leading companies, viz., Alpha, Kyosan, Alstom, Robert Bosch, Continental, Tesla, Cummins etc. in the ESM and in aerospace business. The Sienna group is a USD 100 MM revenue (FY 2018-19) enterprise while ATPL along with other Indian group companies (ATS and Sienna ECAD) contributes to ~ INR 500 Cr of the annual turnover to Sienna group. The group has a well-rounded professional team across USA & India with employee strength of 2000+ (in US & India). The group has an excellent track record of 20+ years with a thorough list of customers predominantly in US and growing list in India.

Position - Technical Support Location - Pune-Hinjewadi Exp - 1+yrs Salary - 20k Immediate joiners required Diploma in (Electronics & Telecommunication/ Electrical) Job Description: 1. Required Well Knowledge about BLDC motor & PCB 2. Strong communication skills 3. Responding to customer inquiries and providing technical support via phone, email, or chat. 4. Strong follow-up for field defect part reverse 5. Well knowledge required for MS Excel & Power Points 6. Familiarity with CRM systems and support 7. Ability to prioritize and manage multiple tasks in a fast-paced environment. 8. Proven experience in technical support or a similar customer-facing role. Interested candidates can revert with updated resume in mail id given below- deepali@white-force.com

Overview Infinera DNA handson experience ( CEINA / NOKIA / ALcatel ) can also work alongwith if platform is DWDM based NOC experience for Mapping / service provisioning / migration Key Responsibilities: Perform circuit trace, validation, and cease operations in Infinera DNA. Prepare and execute precheck, cease, and postcheck workflows independently. Provide input for change requests (RFCs) and maintain cease logs. Coordinate with NOC, field, and OSS teams for safe teardown of legacy circuits. Maintain high accuracy in documentation and circuit records.Required Skills: In-depth knowledge of SDH (VC-4/VC-12) and DWDM OCH/OTU layers. Strong hands-on experience with Infinera DNA. Circuit provisioning/ceasing expertise. Excellent problem-solving and documentation skills.ResponsibilitiesInfinera DNA handson experience( CEINA / NOKIA / ALcatel ) can also work alongwith if platform is DWDM basedNOC experience for Mapping / service provisioning / migrationKey Responsibilities: Perform circuit trace, validation, and cease operations in Infinera DNA. Prepare and execute precheck, cease, and postcheck workflows independently. Provide input for change requests (RFCs) and maintain cease logs. Coordinate with NOC, field, and OSS teams for safe teardown of legacy circuits. Maintain high accuracy in documentation and circuit records.Required Skills: In-depth knowledge of SDH (VC-4/VC-12) and DWDM OCH/OTU layers. Strong hands-on experience with Infinera DNA. Circuit provisioning/ceasing expertise. Excellent problem-solving and documentation skills.RequirementsInfinera DNA handson experience( CEINA / NOKIA / ALcatel ) can also work alongwith if platform is DWDM basedNOC experience for Mapping / service provisioning / migrationKey Responsibilities: Perform circuit trace, validation, and cease operations in Infinera DNA. Prepare and execute precheck, cease, and postcheck workflows independently. Provide input for change requests (RFCs) and maintain cease logs. Coordinate with NOC, field, and OSS teams for safe teardown of legacy circuits. Maintain high accuracy in documentation and circuit records.Required Skills: In-depth knowledge of SDH (VC-4/VC-12) and DWDM OCH/OTU layers. Strong hands-on experience with Infinera DNA. Circuit provisioning/ceasing expertise. Excellent problem-solving and documentation skills.

Job Purpose: To repair and test electronics components for Wind & Solar OEM. Roles and Responsibilities: • PCB troubleshooting & repairing. • Testing of PCB & Maintained Repair Report. • Taking Site Testing feedback from sites. • Quality checking of Incoming material as per PO & datasheet. • In-house PCB test jig development. • Auditing of Stores on regular intervals and automation of stores audit process • Tracking of under warranty failed items • Tracking of tools and tackles along with its calibration log • Timely utilisation of shelf-life items • Tracking of third-party vendor stock & ensure timely return. • Preparation for external audits and loop close if any. • Timely GRN preparation and invoice submission to accounts for payment • Timely dispatch of materials to sites and closing of stock in transit. • Strictly following of processes & policies at work place. Profile & Eligible Criteria: • Must have knowledge of PCB soldering and de-soldering, usage of measuring equipment, and technical expertise in electronics. • Education: Diploma or Degree in Electronics, Instrumentation, or Electrical & Electronics Engineering. • Experience: 3 to 5 years in PCB troubleshooting and testing. • Preferred: Having experience in renewable energy and knowledge of various OEMs. Main Interfaces 1. Asset Management team Site & HO 2. IT team 3. SCM team 4. Quality team

Seeking Web Developer with WordPress, JavaScript, and HTML/CSS skills. Must know CMS, MySQL, responsive design, and SEO. Bonus: PHP, CodeIgniter, React/Vue.js, Git. Strong problem-solving, UI/UX sense, and teamwork are needed.

Role & responsibilities Developing PCBs Using computer-aided design (CAD tools) to build circuitry Developing both digital and analog designs Implementing design processes Placing components and conductors Developing the layout of printed Circuit board test hardware Managing schematic capture and editing a variety of designs Administering component generation and maintenance of component libraries Locating and resolving mechanical design issues Drafting layouts for various types of boards, including hi-speed and multilayer boards Performing revisions based on customer inputs, specifications, and engineers' feedback to ensure high-quality designs Providing engineering documents and prototype models Developing full documentation packages per work instructions and project specifications Maintaining good working rapport with PCB Suppliers Preferred candidate profile B.E ECE/EEE, B.sc Electronics only freshers 2024,2025 passed out

Role & responsibilities The candidate shall be enthusiastic for PCB design and working with Highspeed and RF designs for the IoT and medical electronics. The works includes Design phase study, Floor Plan, Creating footprints, Constrain Setting, Component Placement, Stackup designing, Creating Layout, EMI/EMC complied design etc. #1 Enthusiasm in working in hardware domain #2 Vision in creating new design, Electronic products, Circuit. #3 Good at High component density board design. Mandatory Skills #1 Ability to work on Allegro PCB and Altium PCB Design #2 Understanding in IPC standards in PCB designing and footprint creation. #3 Ability to do Layer stackup management. #4 Understanding in Hardware designing is an added advantage. #5 Good experience in Impedence management and Impedance calculation. #6 Experiance in working with multilayer board and diffrent Via structures. #7 Good design troubleshooting skill with the PCB tool. #8 Understanding if diffrent dielectric materials for the stackup. #9 Experience in working with HDI boards #10 Experience on DDR, PCIe, SATA, USB 3.0 routing #11 EMI/EMC complied design. #12 Experience in working in coherence with mechanical designs #13 Experience in doing designs adhering DFM/DFA rules. Ability to communicate with FAB/Assembly house #14 Good Communication skills Qualifications B.Tech ECE/ M.Tech/ Diploma Location Cochin, Kerala Experience 2-3 Years and above

About Company Founded in 2011, ReNew, is one of the largest renewable energy companies globally, with a leadership position in India. Listed on Nasdaq under the ticker RNW, ReNew develops, builds, owns, and operates utility-scale wind energy projects, utility-scale solar energy projects, utility-scale firm power projects, and distributed solar energy projects. In addition to being a major independent power producer in India, ReNew is evolving to become an end-to-end decarbonization partner providing solutions in a just and inclusive manner in the areas of clean energy, green hydrogen, value-added energy offerings through digitalisation, storage, and carbon markets that increasingly are integral to addressing climate change. With a total capacity of more than 13.4 GW (including projects in pipeline), ReNew’s solar and wind energy projects are spread across 150+ sites, with a presence spanning 18 states in India, contributing to 1.9 % of India’s power capacity. Consequently, this has helped to avoid 0.5% of India’s total carbon emissions and 1.1% India’s total power sector emissions. In the over 10 years of its operation, ReNew has generated almost 1.3 lakh jobs, directly and indirectly. ReNew has achieved market leadership in the Indian renewable energy industry against the backdrop of the Government of India’s policies to promote growth of this sector. ReNew’s current group of stockholders contains several marquee investors including CPP Investments, Abu Dhabi Investment Authority, Goldman Sachs, GEF SACEF and JERA. Its mission is to play a pivotal role in meeting India’s growing energy needs in an efficient, sustainable, and socially responsible manner. ReNew stands committed to providing clean, safe, affordable, and sustainable energy for all and has been at the forefront of leading climate action in India. Job Description Engineer (Wind – Engineering ) Job Purpose: To repair and test electronics components for Wind & Solar OEM. Roles and Responsibilities: • PCB troubleshooting & repairing. • Testing of PCB & Maintained Repair Report. • Taking Site Testing feedback from sites. • Quality checking of Incoming material as per PO & datasheet. • In-house PCB test jig development. • Auditing of Stores on regular intervals and automation of stores audit process • Tracking of under warranty failed items • Tracking of tools and tackles along with its calibration log • Timely utilisation of shelf-life items • Tracking of third-party vendor stock & ensure timely return. • Preparation for external audits and loop close if any. • Timely GRN preparation and invoice submission to accounts for payment • Timely dispatch of materials to sites and closing of stock in transit. • Strictly following of processes & policies at work place. Profile & Eligible Criteria: • Must have knowledge of PCB soldering and de-soldering, usage of measuring equipment, and technical expertise in electronics. • Education: Diploma or Degree in Electronics, Instrumentation, or Electrical & Electronics Engineering. • Experience: 3 to 5 years in PCB troubleshooting and testing. • Preferred: Having experience in renewable energy and knowledge of various OEMs. Main Interfaces 1. Asset Management team – Site & HO 2. IT team 3. SCM team 4. Quality team Location - Hubli, Karnataka