212 Timing Closure Jobs

Responsible for Memory Compiler layout development and verification. Responsible for Layout design and development of Memory blocks such as Array, Row/ Column decoder, sense amplifier, pre-charge, Control blocks for SRAM. Perform layout verification like LVS/ DRC/ Latchup, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Guide junior team-members in their execution of Sub block-level layouts & review their work. Contribute to effective project-management. Effectively communicate with engineering teams in the India & Korea teams to assure the success of the layout project.

Physical Design Engineer Lead - InSemi Tech Physical Design Engineer Lead Bangalore | 8 Years Key Responsibilities Technologies Below 14nm 10nm,7nm,latest one ..3nm Block level floor planning and IR drop analysis Block level timing closure with sign off STA Proficient in physical Design methodology which include logic synthesis, placement ,clock tree synthesis, routing

Experience in Static Timing Analysis (STA) for ASIC designs Experience in developing timing constraints Experience in timing closure and optimization Proficiency in using scripting languages such as Perl and TCL Familiarity with EDA tools such as PrimeTime and Design Compiler Experience in Physical Design and/or DFT is a plus Bachelor s or Master s degree in Electrical/Electronics/Computer Science Engineering or related field

In-depth knowledge and hands-on experience on Netlist2GDSII Implementation . Must have hands-on experience on Synopsys/Cadence tools. Should have experience on PD Methodologies and submicron technology of 28nm and lower technology nodes.

Responsible for high performance microprocessor blocks RTL to GDSII implementation Perform block level synthesis, floor-planning, placement and routing. Close the design to meet timing, power budget and area. Implement ECO's to address functional bugs and timing violations. Team player, with good problem solving and communication skills. Required education Bachelor's Degree Preferred education Master's Degree Required technical and professional expertise 4-7 years industry experience in physical design methodology. Good knowledge and hands on experience in physical design methodology which include logic synthesis,placement, clock tree synthesis, routing . Should be knowledgeable in physical verification ( LVS,DRC. etc), Noise analysis, Power analysis and electro migration . Team player with good problem solving skills, communication skills and leadership skills. Preferred technical and professional experience Automation skills in PYTHON, PERL , and/or TCL

Responsible for high performance microprocessor blocks RTL to GDSII implementation Perform block level synthesis, floor-planning, placement and routing. Close the design to meet timing, power budget and area. Implement ECO's to address functional bugs and timing violations. Team player, with good problem solving and communication skills. Required education Bachelor's Degree Required technical and professional expertise 5-8 years industry experience in physical design methodology. Good knowledge andhands on experience in physical design methodology which include logic synthesis,placement, clock tree synthesis, routing . Should be knowledgeable in physical verification ( LVS,DRC. etc), Noise analysis, Power analysis and electro migration . Team player with good problem solving skills, communication skills and leadership skills. Preferred technical and professional experience Automation skills in PYTHON, PERL , and/or TCL

Urgent Opening for Sr Engineer- Physical Design Posted On 06th Oct 2017 11:52 AM Location Bangalore Role / Position Sr Engineer- Physical Design Experience (required) 3- 9 yrs Description : Responsible for all aspects of physical design and implementation. Responsibilities include chip floor plan, power / clock distribution, chip assembly and P&R, timing closure, power and noise analysis and back-end verification across multiple projects. High level of expertise in complete physical implementation tool chain; Good working knowledge and experience of netlist to GDSII flows Hands-on technical experience with deep sub-micron technology ASIC design, STA and physical implementation; Expertise in Synthesis, Static Timing Analysis and Timing Closure of High Performance Hard-Macros and/or Full Chip Physical Designs Should be independent, self-driven and a strong team player. Thorough understanding and knowledge of the entire Back end flow Netlist to gdsii Must be familiar with Industry standard tools like ICC / Encounter / Talus / Olympus Should have expertise in Timing analysis and closure Should have Tcl and perl scripting skills Should have work experience in the latest technology nodes like 16nm/14nm Should be familiar with low-power design and their impact on Back end flow (power switches / Level shifter / Isolation cell / retention cells / Back biasing / Forward biasing Send Resumes to girish.expertiz@gmail.com -->Upload Resume

Urgent Opening for Physical Design Sr Engineer / MTS / SMTS Posted On 27th Jun 2017 01:05 PM Location Bangalore / Hyderabad Role / Position Physical Design Sr Engineer Experience (required) 2-7 Years Description Designation :Physical Design Sr Engineer / MTS / SMTS Experience: 2 to 7 Years Location :Bangalore /Hyderabad : Responsible for all aspects of physical design and implementation.Responsibilities include chip floor plan, power/clock distribution, chip assembly and P&R, timing closure, power and noise analysis and back-end verification across multiple projects. High level of expertise in complete physical implementation tool chain; Good working knowledge and experience of netlist to GDSII flows Hands-on technical experience with deep sub-micron technology ASIC design, STA and physical implementation;Expertise in Synthesis, Static Timing Analysis and Timing Closure of High Performance Hard-Macros and/or Full Chip Physical DesignsShould be independent, self-driven and a strong team player. Thorough understanding and knowledge of the entire Back end flow Netlist to gdsii Must be familiar with Industry standard tools like ICC/Encounter/Talus/Olympus Should have expertise in Timing analysis and closure Should have Tcl and perl scripting skills Should have work experience in the latest technology nodes like 16nm/14nm/10nm Should be familiar with low-power design and their impact on Back end flow (power switches/Level shifter/Isolation cell/retention cells/Back biasing/Forward biasing) Qualifications:B.Tech / M.Tech or equivalent from a reputed University Send Resumes to girish.expertiz@gmail.com -->Upload Resume

Skills Ability to lead a team size of minimum of 10 members who can handle Subsystem PNR Subsystem timing closure and Subsystem physical verification Experience 10-15years Job Location Bangalore, Hyderabad, Noida, Coimbatore Job Type Full Time

Skills SOC Physical Design Experience 3 to 15 years Job Location Bangalore, Hyderabad, Noida, and Coimbatore. Job Description: Location: Bangalore, Hyderabad, Noida, and Coimbatore. Skills: Soc level floorplanning, partitioning, timing budget generations, power planning, SOC PnR, CTS, block integration Handling timing closure of high frequency blocks. Expertise in signoff closure Timing with SI and OCV, Power, IR and physical verification at both block and chip level. Understanding constraints and fixing techniques. Experience in physical verification Understanding SI prevention, fixing methodology and implementation. Proficient in Synopsys ICC or Cadence or Mentor Olympus and Atoptech tool set. Experience in Design Automation and UNIX system. Experience in Tcl/ PERL is a plus. Primary Skills: Able to handle Soc PNR activities , SOC timing closure and SOC physical verification Secondary Skills: Able to handle SOC Synthesis, SOC IR drop, SOC Lec, SOC CLP

Job Details: Skill: SAP BODS Location: - PAN INDIA Notice Period: Immediate Joiners Employee type : C2H/FT Job Description: 1.Open to Hire/Work from any city 2.People with Total Exp of 6 + and mandatory 4 + exp in BODS will be considered 3.Notice : 2/3 weeks will be considered not more than that 4.Knowledge & Exp on SQL and PL/SQL along with BODS is required. Should have experience in Data Migration. 5.Open to Freelancers without any complications in the future (minimum 30 hrs support). 6.Work timings : 1pm to 10pm.

5 to 7 years experience in both BW and Native HANA Good skills in SQL and ABAP Well versed in Data warehousing concepts Expertise in both BW and ECC back end object development and support Extractors , experience using various SAP & other sources, ADSOs, Composite Providers, DSOs, info cubes, Multi providers, etc. Hands on and technical conceptswith focus on HANA modelling. Proficient in design & development of HANA models Calculation views, procedures, Table functions Shift timings : 2 PM to 11 PM

The ASIC Back-End Head is responsible for leading the physical design and implementation of Application-Specific Integrated Circuits (ASICs), ensuring optimal performance, power efficiency, and manufacturability. Key Responsibilities Strategic LeadershipDefine and execute the ASIC back-end design roadmap. RTL to GDSII Flow ManagementOversee synthesis, floorplanning, placement, routing, timing closure, and sign-off. Physical Design OptimizationEnsure Power, Performance, and Area (PPA) targets are met. EDA Tool ExpertiseWork with Synopsys, Cadence, Mentor Graphics tools for ASIC implementation. Cross-functional CollaborationCoordinate with design, verification, DFT, and packaging teams. Tape-Out & Manufacturing SupportEnsure smooth transition from design to fabrication. Key Skills & Qualifications Extensive experience (15yrs+) in ASIC physical design and implementation. Expertise in timing analysis, power optimization, and physical verification. Strong leadership, communication, and problem-solving skills. Bachelor's/Master's degree in Electronics, Electrical, or related Engineering discipline. Reinvent your world.We are building a modern Wipro. We are an end-to-end digital transformation partner with the boldest ambitions. To realize them, we need people inspired by reinvention. Of yourself, your career, and your skills. We want to see the constant evolution of our business and our industry. It has always been in our DNA - as the world around us changes, so do we. Join a business powered by purpose and a place that empowers you to design your own reinvention. Come to Wipro. Realize your ambitions. Applications from people with disabilities are explicitly welcome.

Shrimad Rajchandra Mission Dharampur is looking for Senior Placement Officer to join our dynamic team and embark on a rewarding career journey Career Counseling: Provide guidance and career counseling to students or job seekers, helping them identify their skills, interests, and career goals Job Placement: Facilitate job placements by matching candidates with suitable job openings based on their qualifications and preferences Employer Engagement: Build and maintain relationships with employers, businesses, and organizations to understand their hiring needs and requirements Job Postings and Recruitment: Post job vacancies and coordinate recruitment processes, including conducting interviews and coordinating selection procedures Resume and Interview Preparation: Assist candidates in preparing resumes, cover letters, and interview techniques to enhance their chances of securing a job Internship and Training Opportunities: Identify and promote internship and training opportunities for students and job seekers to gain practical experience Networking Events: Organize job fairs, networking events, and industry-specific workshops to connect candidates with potential employers

Desired Profile : You have excellent communication and presentation skills, demonstrated through technical publications, presentations, trainings, executive briefings, etc. You are highly adept at collaboration among top-thinkers and engineers alike, ready to mentor and guide, and help to elevate the knowledge and skills of the team around you. Academic Credentials : MS or BS in Computer Engineering/ Computer Science with 5+ years working experience in ASIC RTL design. Key Responsibilities : 1. Develop micro-architecture and design for high-speed IO controller blocks based on architectural requirement 2. Conduct design reviews of designs in technical presentations to peers and management. 3. Develop RTL code for high-speed IO controller blocks in Verilog HDL and make sure functional correct and reusable for different configuration. 4. Oversees Synthesis and netlist delivery that meets timing, area and power bounding box. Assist physical design team on the floor-planning and timing closure. 5. Work with Design Verification team to ensure quality for architecture definition and design implementation. 6. Provide guidance and leadership to the team members. Preferred Experience : 1. Strong knowledge in computer architecture and interconnects. 2. Strong experience in high speed IO controller design (e.g. USB, PCIe, SATA, Thunderbolt). USB and/or Thunderbolt a strong plus. 3. Experience in full ASIC design cycle: requirements definition, architectural and micro-architectural specification, RTL, design verification, floor-planning, synthesis, timing closure, post-silicon validation. 4. Expert on Verilog RTL design and has experience of large digital ASIC project. 5. Familiar with front-end EDA tools and flows. 6. Familiar with Unix/Linux and scripts (tcl, perl, ruby and etc.) 7. Preferred candidates with valid work permit (Green Card / US Citizen / H1B)

STA flow setup, convergence, reviews Timing constraint development, analysis, validation and debug Timing, Noise, DRC (transition, capacitance) signoff for multi-mode, multi-corner STA flow optimization Work ondesign automation using TCL/Perl/Python Position Requirements: BTech/MTech degree in Electrical/Electronics with 2-10 years of experience Hands on experience with the STA and Signoff of complex high speed SoC designs in cutting edge process technologies (16nm and below). Ability to develop complex timing constraints by working with designers. Should have experience in IP/subsystem/full-chip timing constraints Knowledge of timing commands and constructs supported across synthesis, STA and PD tools Analysis skills to root cause of timing violations issues and suggest solutions across various stages of design Implementation Strong expertise in Timing ECOs driven by tool and manual ECO techniques for timing closure Sound understanding of Scan/DFT modes and timing Familiar with digital flow design aspects RTL to GDS Proficiency in tcl/perl/python scripts and automation on timing analysis tools Innovate on the flows to resolve timing or DRC issues Good understanding on device/interconnect and circuit aspect of the complex UDSM technologies is an added advantage. Good communication skills in cross-collaborative environment

Lead development efforts for AMS design collaterals generation fortop level integration, ensuring optimized performance Job Description In your new role you will: Lead development efforts for AMS design collaterals generation for top level integration, ensuring optimized performance. Enforce consistency of all required views for AMS macro integration. Ensure quality of digital design deliverables to RTL2GDS counter parts by running preliminary RTL synthesis and timing checks. Identify and apply methodologies to allow optimal timing closure of complex AMS IP (ADCs, clocking) in the context of digital-on-top integration. Collaborate with cross-functional teams, including digital design,AMS design, layout, and test engineers, to ensure successful productintegration. Interface with design system community, design flow and methodologyteams across multiple sites (Europe, US and Asia). Validate AMS views generation flow to guarantee smooth execution incase of design system and/or design package updates. Your Profile You are best equipped for this task if you have: Master s or Ph.D. in Electrical Engineering or a related field. 15+ years of experience in complex AMS & SoC integration within thesemiconductor industry Proven track record of successful product implementation in advancedCMOS and BCD technologies Deep technical knowledge of mixed-signal IC design and integrationflows Very good understanding of RTL2GDS flows and experience in runningsynthesis, timing closure, DFT insertion Ability to work in a multinational environment and connect designteams with RTL2GDS and SoC integration teams across the organization Ability to support project planning and commitment to ensure timelyexecution. Ability to report progress and issues related to SoC integration tosenior executives

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Physical Implementation activities for Sub systems which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Knowledge in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Knowledge in Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Good knowledge of Tcl/Perl Scripting Strong problem-solving skills and good communication skills. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 1-3 yrs years of experience in Physical Design/Implementation

Job Area: Engineering Group, Engineering Group > Systems Engineering General Summary: Qualcomm is looking for an experienced Chipset Power System Engineer who is passionate in solving power challenges and develop innovative solutions for optimizing power for next generation Snapdragon chipsets of various platforms in applicator processor, modem, automotive, AR/XR, compute and machine learning. The engineer is expected to work with cross-functional engineering teams to model SOC/chipset power and come up with innovative solutions to optimize hardware and software to enhance SOC and chipset and achieve world-class chipset low power consumption. In this position, the engineer will support the existing tools and methodologies while defining the long term strategy in the areas below. Power Modeling and Methodology Drive the engineering process to gather requirements, design, prioritize and track derived tasks, test, and deliver tools and methodologies to the power community Maintain existing power modeling tools and methodology. Define and deliver API's to the power community as required. Create block-level and system-level power models as required. Integrate and port power models from IP teams into the existing framework. This involves working closely with contributing teams and aligning power modeling requirements and negotiating power model deliverables for framework integration. Drive and participate in cross-functional power modeling collaborations which includes hardware, systems, architecture, software, and post-silicon teams Track technology changes with the enhancement to the power modeling methodology by incorporating new low power techniques, algorithms, power management schemes, etc. Power Analysis Collaborate to assess use case power impact in areas such as thermal and formfactor variance, architecture changes, IP changes, low power techniques Understand and perform block & chip-level power analysis and ensure methodologies satisfies the requirements to enable these activities Enable other teams to leverage the tools and methodologies and perform technology specific power analysis. Minimum Qualifications: Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 2+ years of Systems Engineering or related work experience. OR Master's degree in Engineering, Information Systems, Computer Science, or related field and 1+ year of Systems Engineering or related work experience. OR PhD in Engineering, Information Systems, Computer Science, or related field.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. PNR implementation for Qualcomm SoC's Good hands-on experience on Floorplanning, PNR and STA flows Good knowledge on Placement/Clock Tree Synthesis (CTS), optimization, etc Good understanding on signoff domains– LEC/CLP/PDN knowledge, etc Good knowledge on Unix/Linux – Perl/TCL fundamentals/scripting Principal Duties and responsibilities Complete ownership on PNR implementation (Floorplanning, Placement, CTS, post_route,etc) on latest nodes. Signoff knowledge is mandatory (STA,Power analysis,FV, low power verification, PV,etc) Quick learner with good analytical and problem solving skills Qualifications 5+ years Hardware Engineering experience or related work experience. 5+ years experience with PNR flow in latest tech nodes (e.g., 4nm/5nm/7nm/10nm

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Physical Implementation activities for Sub systems which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Knowledge in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Well versed with the Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus in latest technology nodes Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Well versed with Tcl/Perl Scripting Strong problem-solving skills and good communication skills. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 3- 6yrs years of experience in Physical Design/Implementation

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. Principal Duties and Responsibilities: 5+ Years of Experience in Logic design /micro-architecture / RTL coding Must have hands on experience with SoC design, synthesis and timing analysis for complex SoCs. Experience in Verilog/System-Verilog is a must. knowledge of AMBA protocols - AXI, AHB, APB, SoC clocking/reset/debug architecture and peripherals like USB, PCIE and SDCC. Work closely with the SoC DFT, Physical Design and STA teams Hands on experience in Low power SoC design is required Hands on experience in Multi Clock designs, Asynchronous interface is a must. Experience in using the tools in ASIC development such as DesignCompiler, Genus, FusionCompiler and Primetime is required. Understanding of constraint development and timing closure is a plus. Experience in Synthesis / Understanding of timing concepts

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: NUVIA is now part of Qualcomm. Our mission is to reimagine silicon and create computing platforms that will transform the industry. You will have the opportunity to work with some of the most talented and passionate engineers in the world to create designs that push the envelope on performance, energy efficiency and scalability. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. As CPU Physical Design CAD engineer, you will build and support the world’s best implementation tools and flows. Your tools and flows will ensure our custom CPUs have industry-leading power, performance and area. Roles and Responsibilities Develop, integrate and release new features in our high-performance place-and-route CAD flow Architect and recommend methodology improvements to ensure our silicon has the best power, performance and area Maintain, support and debug implementation flows, and resolve project-specific issues Work closely with worldwide CPU physical design teams, and provide methodology guidance, tools/flows support and help achieve class-leading PPA. Work with EDA vendors to define roadmap and to resolve tool issues Preferred Qualifications: Bachelors/Masters degree in Electrical/Electronics Engineering or Computer Science Ten+ years of hands-on experience in place-and-route of high-performance chips - either in a design or CAD role High level of proficiency in Tcl as well as Python Experience with automation Experience with a wide variety of Physical Design tasks - ranging all the way from place-and-route, analysis, timing sign-off and PDV Experience with advanced technology nodes (5nm or lower) Solid understanding of digital design, timing analysis and physical verification Strong user of industry-standard place-and-route tools such as Cadence Innovus Proven track record of managing and regressing place-and-route flows

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Function Camera Design Lead/Staff Candidate will be responsible for design/developing next generation SoCs sub systems for mobile phone camera . Candidate will be working on ASIC based on the latest technology nodes. This role will require the candidate to understand and work on all aspects of VLSI development cycle like architecture, micro architecture, Synthesis/PD interaction and design convergence. Skills/Experience 5-10 years with Masters (6 to 10 years with Bachelors) Solid experience in digital front end design for ASICsSolid Expertise in RTL microarchitecture and design coding in Verilog/SV for complex designs with multiple clock and power domainsExpertise with various bus protocols like AHB, AXI and NOC designs Experience in low power design methodology and clock domain crossing designsUnderstanding of full RTL to GDS flow to interact with DFT and PD teams Experience in Tools like Spyglass Lint/CDC checks and waiver creationExperience in formal verification with Cadence LEC Experience in mobile Multimedia/Camera design is a plus DSP /ISP knowledge is a plus. Working knowledge of timing closure is a plusExpertise in Perl, TCL language is a plusExpertise in post-Si debug is a plus Good documentation skillsAbility to create unit level test plan General Should possess good communication skills to ensure effective interaction with Engineering Management and mentor group members. Should be self-motivated and good team working attitude and need to function with little direct guidance or supervision Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Experience 7 to 10 years Physical design of block level with full understanding of PnR cycle. Good understanding of Physical design fundamentals Good hands-on experience on industry standard pnr tools like ICC2/Innovus Good understanding on signoff tool like Prime time , Redhawk and calibre Should be able to guide junior engineers in resolving technical issues. Tools ICC/Innovus, PT, StarRC, Redhawk, Calibre DRC/LVS ScriptingTCL, Perl