15 Floorplanning Jobs

You should have at least 3+ years of relevant experience leading SoC Physical design projects across multiple technology nodes, including 5nm for TSMC and other foundries. Your expertise should include hands-on Place and Route (P&R) skills with in-depth knowledge of ICC/Innovus. You must possess expert knowledge in all phases of Physical Design (PD) from Synthesis to GDSII, with a solid background in Floorplanning, Placement, Clock Tree Synthesis (CTS), Routing, P&R, Extraction, IR Drop Analysis, Timing, and Signal Integrity closure. Experience in taping out multiple chips and strong familiarity with the top level at the latest technology nodes will be beneficial. Collaboration with CAD, Methodology & IP teams is a crucial aspect of PD implementation, necessitating regular sync-ups for deliveries. You should have significant knowledge and preferably hands-on experience in SoC Static Timing Analysis (STA), Power analysis, Physical Verification, and other sign-off processes. Strong problem-solving abilities, a proactive approach, hard work ethic, and excellent interpersonal skills are essential for this role. A Bachelor's Degree in Electrical, Electronics, or Computer Engineering is required. About Company: 7Rays Semiconductor Private Ltd. provides end-to-end custom SoC design solutions, encompassing SoC Architecture, RTL design, Design verification, DFT, Physical Design, and Analog design. Our focus is on serving top semiconductor and system companies to facilitate the design of their complex SoCs. We prioritize building effective partnerships with our clients to deliver high-quality, tailored solutions. With a dedicated engineering team and a proven history of successful project execution, we are dedicated to excellence and innovation in SoC Design, Development, and deployment of customer products.,

The Sr. Staff Physical Design Engineer position at Lattice Semiconductor in Pune, India offers a dynamic opportunity to join the HW design team focused on IP design and full chip integration. As part of a worldwide community of engineers and specialists, you will have the chance to contribute, learn, innovate, and grow within this fast-paced and ambitious organization. Key responsibilities for this role include implementing and leading the RTL to GDSII flow for complex designs, working on various aspects of physical design such as place & route, CTS, routing, floorplanning, powerplanning, timing, and physical signoff. The ideal candidate will have experience in physical design signoff checks, drive efficiency and quality in physical design flow and methodology, collaborate with internal and external teams, and possess scripting knowledge to enhance design efficiency. Additionally, the successful candidate will play a vital role in FPGA design efforts, drive physical design closure of key ASIC blocks & full chip, maintain design quality through quality checks and signoff, develop strong relationships with global teams, mentor colleagues, and may require occasional travel. Requirements for this role include a BS/MS/PhD in Electronics Engineering, Electrical Engineering, Computer Science or equivalent, along with 12+ years of experience in driving physical design activities for ASIC blocks and full chips. Candidates must have multiple tapeout experience and proficiency in industry-standard physical design tools. The ideal candidate should be an independent problem solver, capable of collaborating with diverse groups across different sites and time zones. Lattice Semiconductor values its employees as the cornerstone of its success and offers a comprehensive compensation and benefits program to attract and retain top talent in the industry. As an international developer of low-cost, low-power programmable design solutions, Lattice is committed to customer success and a culture of innovation and achievement. If you thrive in a results-oriented environment, seek individual success within a team-first organization, and are ready to contribute to a collaborative and innovative atmosphere, Lattice Semiconductor may be the perfect fit for you. Feel the energy at Lattice.,

You should possess in-depth knowledge and hands-on experience in Netlist2GDSII Implementation, including tasks such as Floorplanning, Power Grid Design, Placement, Clock Tree Synthesis (CTS), Routing, Static Timing Analysis (STA), Power Integrity Analysis, Physical Verification, and Chip finishing. It is essential to have experience with Physical Design Methodologies and sub-micron technology, particularly in 16nm and lower technology nodes. Moreover, you should have expertise in Analog and Mixed Signal Design and be familiar with handling designs with more than 5M instance count and operating at a frequency of 1.5GHz. Proficiency in programming languages such as Tcl, Tk, and Perl is required to automate the design process and enhance efficiency. Hands-on experience with PnR Suite from Cadence & Synopsys, specifically Innovus & ICC2, is a must. Additionally, you should have a strong background in Static Timing Analysis using tools like PrimeTime for SI analysis, EM/IR-Drop analysis with PT-PX and Redhawk, as well as Physical Verification using Calibre. Understanding the practical application of methodologies, Physical Design Tools, Flow Automation, and driving improvements in these areas is highly beneficial. Experience in complex SOC integration, Low Power and High-Speed Design, as well as proficiency in Advanced Physical Verification Techniques, are desirable skills for this role.,

As a Hardware Engineer at Qualcomm, you will be responsible for planning, designing, optimizing, verifying, and testing electronic systems including circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems to develop cutting-edge products. Collaboration with cross-functional teams is essential to meet performance requirements and deliver innovative solutions. To qualify for this role, you must hold a Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or a related field with a minimum of 4 years of Hardware Engineering experience. Alternatively, a Master's degree with 3+ years of experience, or a PhD with 2+ years of experience can also be considered. Additionally, candidates with a Bachelor's degree and 2+ years of experience, a Master's degree and 1+ year of experience, or a PhD with relevant experience are eligible. The ideal candidate should possess good hands-on experience in Floorplanning, PNR, and STA flows, as well as knowledge of Placement/Clock Tree Synthesis (CTS) and optimization. Familiarity with signoff domains such as LEC, CLP, and PDN is required, along with proficiency in Unix/Linux, Perl, TCL scripting. Key responsibilities include taking ownership of PNR implementation on the latest nodes, covering tasks like Floorplanning, Placement, CTS, and post-route activities. Signoff knowledge is crucial, encompassing areas like STA, Power analysis, FV, low power verification, and PV. A quick learner with strong analytical and problem-solving skills will excel in this role. Qualifications for this position include a minimum of 15 years of Hardware Engineering experience or related work experience, along with expertise in PNR flow for advanced tech nodes like 4nm, 5nm, 7nm, and beyond.,

You should have at least 3+ years of relevant experience in SoC Physical design, with a focus on multiple technology nodes including 5nm for TSMC and other foundries. Your expertise should include hands-on P&R skills, particularly in ICC/Innovus. You must possess expert knowledge in all aspects of Physical Design (PD) from Synthesis to GDSII, with a strong background in Floorplanning, Placement, CTS, Routing, P&R, Extraction, IR Drop Analysis, Timing, and Signal Integrity closure. Experience in taping out multiple chips and working at the top level in the latest technology nodes will be highly beneficial. Collaboration with CAD, Methodology & IP teams for PD implementation is critical, requiring regular sync-ups for deliveries. You should have significant knowledge, and preferably hands-on experience, in SoC STA, Power, Physical Verification, and other sign-off processes. Problem-solving capabilities, proactive attitude, hardworking nature, and strong interpersonal skills are essential for this role. A Bachelor's Degree in Electrical, Electronics, or Computer Engineering is required for this position. About Company: 7Rays Semiconductor Private Ltd. provides end-to-end custom SoC design solutions, including SoC Architecture, RTL design, Design verification, DFT, Physical Design & Analog design. The company focuses on offering services to top semiconductor and system companies to assist them in designing complex SoCs. The company believes in building effective partnerships with clients to deliver high-quality solutions tailored to their needs. With a dedicated engineering team and a successful track record in project execution, the company is committed to excellence and innovation in SoC Design, Development, and deployment of customers" products.,

Quest Global is a leading organization known for its innovation and rapid growth in the engineering services sector. With a rich domain expertise and a strong presence in the top OEMs across seven industries, we are a company with a 25-year legacy and a vision to reach a centennial milestone. Driven by ambition, passion, and humility, we are on a journey to shape the future through engineering. We are in search of individuals who embody the spirit of humble geniuses, believing in the power of engineering to turn the impossible into reality. Our ideal candidates are innovators inspired by technology and driven to design, develop, and test solutions as trusted partners for Fortune 500 clients. As a diverse team of engineers, we understand that our work goes beyond technical solutions; we are shaping a brighter future for all. If you are eager to contribute to meaningful projects and be part of an organization that values collective success and learning from failures, we invite you to join us. We are looking for achievers and courageous challenge-crushers who possess the following skills and characteristics: Responsibilities: - Performing floor-planning and routing studies at block and full-chip level - Executing top-level floorplan and clock pushdown to Partition - IO Planning and bump planning - Collaboration with Package team to meet Die file milestones - Conducting full chip and partition level timing analysis - Exploring low power techniques and power reduction opportunities - Designing and analyzing clock distribution - Executing Physical verification activities at full-chip level - Leading technical activities of physical design throughout technology readiness, design, and execution Qualifications: - Proficiency in Netlist2GDSII Implementation, including Floorplanning, Power Grid Design, Placement, CTS, Routing, STA, Power Integrity Analysis, Physical Verification, and Chip finishing - Experience in Physical Design Methodologies and sub-micron technology of 16nm and lower nodes - Handling designs with >1M instance count and 1 GHz frequency - Programming skills in Tcl/Tk/Perl for automating design processes and enhancing efficiency - Hands-on experience with PNR Suite from Cadence & Synopsys (Innovus & ICC2) - Strong background in Static Timing Analysis (PrimeTime SI), EM/IR-Drop analysis (PT-PX, Redhawk), and Physical Verification (Calibre) Education Type: M.E/M.Tech/MS-VLSI Design & Embedded System Job Type: Full Time-Regular Experience Level: Mid Level Total Years of Experience: 5 - 8,

Position Summary Complex SOC Top Physical Implementation for next generation SoCs by means of Synthesis, Place and Route, STA, timing and physical signoffs Role and Responsibilities Hands on experience doing physical design and timing closure of complex blocks and full-chip designs Should have strong understanding of timing, power and area trade-offs and optimization of PPA Power user of industry standard tools (ICC/DC/PT/VSLP/Redhawk/Calibre/Formality) and able to understand their capabilities Should have solid understanding of scripting languages such as Perl/Tcl and implementation flows Experience with large SOC designs (>20M gates) with frequencies in excess of 1GHZ Expertise in block level and full-chip SDC cleanup, Synthesis optimization, Low Power checking and logic equivalence checking Familiar with deep sub-micron designs (8nm/5nm) and associated issues (manufacturability, power, signal integrity, scaling) Familiar with typical SoC issues such as multiple voltage and clock domains, ESD strategies, mixed signal block integration, and package interactions Familiar in hierarchical design, top-down design, budgeting, timing and physical convergence Skills and Qualifications Experience in top level floorplanning including partition shaping and sizing, pin placement, channel planning, high speed signal and clock planning and feed-through planning is a plus Good understanding of Physical Design Verification methodology to debug LVS/DRC issues at chip/block level Should have gone through 4+ recent successful SoC tape-outs Should have 8 14 years of experience in physical implementation and design

Lead and execute Analog Mixed-Signal layout design for high-speed DDR/HBM IPs Deliver robust and high-quality physical layout designs ensuring adherence to DDR/HBM specs Apply deep understanding of FinFET and CMOS technology at 28nm and below Handle high-speed digital layout verification with attention to signal integrity Implement advanced floorplanning techniques and apply submicron mitigation strategies Coordinate with remote layout teams globally for layout quality and deliverables Drive internal flow adherence for tape-out readiness and schedule compliance Collaborate with PHY designers, package engineers, and system teams to meet design objectives Oversee IO layout requirements including bondpads, ESD, IR/EM, and DFM considerations Utilize physical verification tools and support Place & Route and top-level verification flows The Impact You Will Have: Shape next-gen high-speed memory interface solutions through expert physical design Ensure quality layout execution in advanced nodes, directly impacting performance and reliability Drive project delivery across global teams with technical leadership and coordination Enable Synopsys to meet customer demand in high-speed memory IPs with quality and timeliness Reinforce design flow adherence and process discipline to ensure tape-out success Contribute to the robustness of global layout practices through review and mentorship What You'll Need: 612 years of experience in Analog Mixed-Signal layout, specifically with DDR/HBM IPs Expertise in FinFET and CMOS layout at 28nm and below Strong knowledge of signal integrity, DRC/LVS/LPE, ESD/latchup, and IO pitch/layout constraints Familiarity with ASIC physical design flows including LEF, Place & Route, and verification Hands-on experience with advanced layout tools and scripting (Perl, TCL, etc. preferred) Proven leadership in global coordination and layout delivery Excellent communication and customer interaction skills

Hands-on development of layout for next-generation DDR/HBM/UCIe IPs. Creating floorplans, routing, and performing physical verifications to meet quality standards. Debugging and solving complex layout issues to ensure high-quality deliverables. Collaborating with design engineers to optimize layout for performance, power, and area. Implementing layout matching techniques, ESD, latch-up, EMIR, DFM, and LEF generation. Ensuring compliance with DRC, LVS, ERC, and antenna rules. The Impact You Will Have: Contribute to the development of cutting-edge technologies that drive the Era of Smart Everything. Enhance the performance and reliability of next-generation semiconductor IPs. Accelerate the time-to-market for high-performance silicon chips. Reduce risks associated with layout design by adhering to stringent verification requirements. Foster a collaborative and innovative work environment. Support Synopsys mission to lead in chip design and software security. What You'll Need: BTech/MTech in Electrical Engineering or related field. 2+ years of relevant experience in analog layout design. Proficiency in developing quality layouts and performing physical verifications. In-depth understanding of deep submicron effects and floorplan techniques. Experience with CMOS, FinFET, and GAA process technologies at 7nm and below. Knowledge of layout matching techniques, ESD, latch-up, EMIR, DFM, and LEF generation.

Hands-on development of layout for next-generation DDR/HBM/UCIe IPs. Solving complex problems and debugging issues effectively. Executing layout floorplanning, routing, and physical verifications to meet stringent quality requirements. Ensuring compliance with DRC, LVS, ERC, and antenna rules. Applying deep submicron effects, floorplan techniques in CMOS, FinFET, and GAA process technologies (7nm and below). Implementing layout matching techniques, ESD, latch-up, EMIR, DFM, and LEF generation. The Impact You Will Have: Enhancing the performance and reliability of Synopsys DDR/HBM/UCIe IPs. Accelerating the integration of advanced capabilities into SoCs. Reducing risk and improving time-to-market for differentiated products. Driving innovation in semiconductor technology and design. Contributing to the success of Synopsys Silicon IP business. Fostering a collaborative and inclusive work environment. What You'll Need: BTech/MTech degree in a relevant field. 4+ years of experience in analog layout design. Proven track record in developing high-quality layouts and meeting verification timelines. Strong understanding of deep submicron effects and floorplan techniques. Exposure to layout matching, ESD, latch-up, EMIR, DFM, and LEF generation.

Hands-on development of layout for next-generation DDR/HBM/UCIe IPs. Solving complex problems and debugging issues effectively. Executing layout floor planning, routing, and physical verifications to meet stringent quality requirements. Ensuring compliance with DRC, LVS, ERC, and antenna rules. Applying deep submicron effects, floorplan techniques in CMOS, FinFET, and GAA process technologies (7nm and below). Implementing layout matching techniques, ESD, latch-up, EMIR, DFM, and LEF generation. The Impact You Will Have: Enhancing the performance and reliability of Synopsys DDR/HBM/UCIe IPs. Accelerating the integration of advanced capabilities into SoCs. Reducing risk and improving time-to-market for differentiated products. Driving innovation in semiconductor technology and design. Contributing to the success of Synopsys Silicon IP business. Fostering a collaborative and inclusive work environment. What You'll Need: BTech/MTech degree in a relevant field. 4+ years of experience in analog layout design. Proven track record in developing high-quality layouts and meeting verification timelines. Strong understanding of deep submicron effects and floorplan techniques. Exposure to layout matching, ESD, latch-up, EMIR, DFM, and LEF generation.

Interfacing with customers regarding digital reference flows, including Synthesis Floorplanning Clock tree synthesis Power planning Place and route Timing closure Creating baseline flows to be used by customers as starting point for digital implementation Performing digital place and route and sign-off on small customer designs Creating documentation PPA optimization Bachelor s degree with at least 1-3 years of design/EDA experience or Master s degree. Strong knowledge of Digital Design Fundamentals, Semiconductor Fundamentals and Static Timing Analysis Prior experience with ASIC digital implementation flows and EDA tools is required; Experience with advanced nodes (7nm and below) preferred. Good programming knowledge in Unix, Shell scripting, perl and importantly TCL Strong customer-facing communication and problem solving skills Strong personal drive for continuous learning and expanding professional skill sets Excellent verbal and written communication skills Familiar with EDA tool operation, setup and debug: Digital: Genus, Innovus, Tempus, Voltus, etc

Description We are seeking a highly skilled ASIC Physical Design, Sr Staff Engineer to join our team in India. In this role, you will be responsible for the physical design and implementation of high-performance ASICs, collaborating closely with cross-functional teams to ensure successful project delivery. Responsibilities Design and implement physical layouts for ASIC designs. Conduct place and route activities to meet timing and area requirements. Perform timing analysis and optimization to ensure high-performance ASICs. Collaborate with RTL designers to ensure design feasibility and manufacturability. Utilize EDA tools for physical design tasks such as Cadence, Synopsys, or Mentor Graphics. Conduct DRC/LVS checks and ensure design compliance with specifications. Support the verification team in physical design verification activities. Participate in design reviews and provide feedback for design improvements. Skills and Qualifications Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field. 2-7 years of experience in ASIC physical design or related roles. Strong knowledge of ASIC design flow and methodologies. Proficiency in using EDA tools for physical design (e.g., Cadence, Synopsys, Mentor Graphics). Experience with place and route, timing closure, DRC/LVS checks, and physical verification. Familiarity with scripting languages (e.g., Perl, Tcl, Python) for automation of design tasks. Understanding of semiconductor manufacturing processes and design for manufacturability (DFM). Strong problem-solving skills and attention to detail.

Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.PNR implementation for Qualcomm SoC's Good hands-on experience on Floorplanning, PNR and STA flows Good knowledge on Placement/Clock Tree Synthesis (CTS), optimization, etc Good understanding on signoff domains LEC/CLP/PDN knowledge, etc Good knowledge on Unix/Linux Perl/TCL fundamentals/scripting Principal Duties and responsibilities Complete ownership on PNR implementation (Floorplanning, Placement, CTS, post_route,etc) on latest nodes. Signoff knowledge is mandatory (STA,Power analysis,FV, low power verification, PV,etc) Quick learner with good analytical and problem solving skills Qualifications 6+ years experience with PNR flow in latest tech nodes (e.g., 4nm/5nm/7nm/10nm

Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.PNR implementation for Qualcomm SoC's Good hands-on experience on Floorplanning, PNR and STA flows Good knowledge on Placement/Clock Tree Synthesis (CTS), optimization, etc Good understanding on signoff domains LEC/CLP/PDN knowledge, etc Good knowledge on Unix/Linux Perl/TCL fundamentals/scripting Principal Duties and responsibilities Complete ownership on PNR implementation (Floorplanning, Placement, CTS, post_route,etc) on latest nodes. Signoff knowledge is mandatory (STA,Power analysis,FV, low power verification, PV,etc) Quick learner with good analytical and problem solving skills Qualifications 6+ years experience with PNR flow in latest tech nodes (e.g., 4nm/5nm/7nm/10nm