502 Rf Jobs - Page 21

Job Overview Responsbilties: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc. ) and contribute to next-gen SI standards. Should have total work experience of 3-8+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector /or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment - able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork Location:

Job Overview TE Connectivity s RD/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. RD engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profile: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork ABOUT TE CONNECTIVITY TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, renewable energy, automated factories, data centers, medical technology and more. With more than 85, 000 employees, including 8, 000 engineers, working alongside customers in approximately 140 countries. TE ensures that EVERY CONNECTION COUNTS. Learn more at www. te. com and on LinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events Employee Resource Group Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. Location: