5.0 - 9.0 years

0 Lacs

karnataka

On-site

Minimum qualifications: Bachelor's degree in Computer Science, Electrical Engineering, or equivalent practical experience. 5 years of experience with thermal product design. Experience with programming/scripting with Python and MATLAB to develop in-house tools for data processing and automation. Experience working with heat transfer, SoC Design and IC Packaging. Preferred qualifications: Master's degree in Computer Science, Electrical Engineering, or a related field. Experience with optimization of thermal, power and performance. Experience in thermal/performance measurements and characterization on consumer devices. Understanding of ASIC digital design, design validation, and power optimization. Knowledge of hardware and software based thermal/power management control algorithms. About The Job Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. As a SoC Thermal Engineer, you will be responsible for thermal modeling, analysis and characterization of various aspects of SoC and IC package thermal design. In this role, you will be delivering exceptional silicon for a wide range of applications and experiences and you will be working closely with teams across multiple functions to solve power and thermal related challenges. Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology. Responsibilities Develop detailed Computational Fluid Dynamics (CFD) and compact RC models for SoC and Package thermal analysis. Place temperature sensors and optimize floor plans. Optimize thermal performance under Performance, Power, Area (PPA) and system design constraints. Simulate and prototype thermal control strategies. Validate thermal models through power/thermal measurements on hardware. ,

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