58 Hfss Jobs - Page 2

Job Area: Engineering Group, Engineering Group > Hardware Systems Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital and RF transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Systems Engineer, you will design a complete framework or system that influences the shaping of state-of-the-art mobile, edge, auto, AR/VR, compute, IOT, wearable products. Qualcomm Engineers collaborate with cross-functional teams (e.g., design, software, testing teams, etc.) to identify hardware testing needs and integrate components into products or systems. Minimum Qualifications: Bachelor's degree in Engineering or related field. Successful candidate for this position will join a hardware design team in Hyderabad developing digital platforms and mixed-mode wireless devices utilizing Qualcomm MSMs, RFICs, and power management ASICs for in-house design verification, software/firmware development, and customer reference designs. Candidates should have knowledge on high speed board design concepts, Solid electrical engineering, digital & analog circuit fundamentals, and should have lab skills. knowledge of transmission lines, cross talk, decoupling, low-power supply design, and layout of high performance PWBs is desired. Familiarity with modems, DSPs, microprocessors, memories, LCDs, camera sensors, batteries, and other consumer electronics hardware is desired. Job description: 0 - 3 years of relevant experience. High-speed board design, schematic design, layout reviews, test and integration, and maintaining hardware through the product cycle. Platforms may also incorporate ARM processors, graphics engines, digital audio, USB OTG, Bluetooth, GPS, SPI, I2C, DDR, MIPI, MDDI, and LAN functionality and candidate should have knowledge on these interfaces. Candidate must quickly assimilate onto a specified project, read/write technical specifications/requirements, develop/refine hardware designs, apply integration/lab skills, demonstrate strong problem solving abilities, and work closely with software and RF engineers to actively contribute toward the evolution of a shared platform. Candidate should support bring-up for MSMs and has to run the DVT and MTP performance testing for IPS projects. Additional Extensive knowledge of developing automation scripts based on Python Good working knowledge of EDA tools like HFSS, ADS Must be good at C , C++ programming & Matlab

Key Responsibilities:  Develop and implement algorithms for Image Processing, Signal Processing, and Antenna Design.  Guide and mentor students and researchers on project development related to ECE.  Design and simulate antennas using tools like HFSS, CST, or MATLAB.  Work on signal and image processing projects using MATLAB, Python, OpenCV, and other relevant software.  Conduct research and provide solutions for academic project requirements in areas like radar signal processing, biomedical image analysis, wireless communication, and machine learning applications.  Document project work, develop reports, and assist in publishing research papers.  Stay updated with the latest trends and advancements in ECE-related fields. Required Skills and Qualifications:  Bachelor’s/Master’s/Ph.D. in Electronics and Communication Engineering (ECE) or a related field.  Strong knowledge of Image Processing, Signal Processing, and Antenna Design.  Proficiency in MATLAB, Python, OpenCV, HFSS, CST, ADS, or other relevant tools.  Experience in working with research-based projects and publications is a plus.  Excellent problem-solving, analytical, and communication skills.  Ability to work independently and collaborate with students and research scholars. Preferred Qualifications:  Experience in AI/ML applications in Image and Signal Processing.  Hands-on experience with software-defined radios (SDR) and RF circuit design.  Knowledge of FPGA-based implementation of signal processing algorithms Job Type: Full-time Pay: ₹13,000.00 - ₹15,000.00 per month Schedule: Day shift Ability to commute/relocate: Tirupati, Andhra Pradesh: Reliably commute or planning to relocate before starting work (Required) Work Location: In person

Key Responsibilities:  Develop and implement algorithms for Image Processing, Signal Processing, and Antenna Design.  Guide and mentor students and researchers on project development related to ECE.  Design and simulate antennas using tools like HFSS, CST, or MATLAB.  Work on signal and image processing projects using MATLAB, Python, OpenCV, and other relevant software.  Conduct research and provide solutions for academic project requirements in areas like radar signal processing, biomedical image analysis, wireless communication, and machine learning applications.  Document project work, develop reports, and assist in publishing research papers.  Stay updated with the latest trends and advancements in ECE-related fields. Required Skills and Qualifications:  Bachelor’s/Master’s/Ph.D. in Electronics and Communication Engineering (ECE) or a related field.  Strong knowledge of Image Processing, Signal Processing, and Antenna Design.  Proficiency in MATLAB, Python, OpenCV, HFSS, CST, ADS, or other relevant tools.  Experience in working with research-based projects and publications is a plus.  Excellent problem-solving, analytical, and communication skills.  Ability to work independently and collaborate with students and research scholars. Preferred Qualifications:  Experience in AI/ML applications in Image and Signal Processing.  Hands-on experience with software-defined radios (SDR) and RF circuit design.  Knowledge of FPGA-based implementation of signal processing algorithms Job Types: Full-time, Permanent, Fresher Pay: ₹15,000.00 - ₹18,000.00 per month Benefits: Provident Fund Schedule: Day shift Fixed shift Ability to commute/relocate: Tirupati, Andhra Pradesh: Reliably commute or planning to relocate before starting work (Required) Work Location: In person

Your Job We continue to grow our Engineering Staff and are looking for a talented Signal Integrity Design Engineer to join our team. If you are looking for a way to accelerate your career and be part of a great company, this may be the opportunity for you. In this role, you will have the opportunity to perform characterization of high-speed connectors/cables and systems, using high-speed digital and electromagnetic measurements for automotive in-vehicle networks. Our Team Concept Design and Development Complete PCB Electromagnetic simulations (Ansys HFSS) Provide Signal Integrity test board layout support for high speed applications Provide recommended connector pin-out configuration for optimized signal integrity performance Design Verification & Product Validation Provide testing BOM Lead procurement activities of all components required to complete testing Develop test plans (DVP&Rs) with a cross-functional team to validate design standards (USCAR-49, GMW3191, IEEE, Open Alliance, etc.) Assist in the development and implementation of all sample preparation and testing procedures & instructions required to ensure accurate and repeatable test data Oversee signal integrity testing of shielded and unshielded automotive interconnects systems. Update product technical documentation (such as Engineering, Application and Product Specs). Approve Test lab best practices for internal and external signal integrity lab usage. Prepare presentation material for internal and customer design reviews. Perform gap analysis between high-speed standards Production Support Support product engineers with internal & customer 8D resolution activities. Duties Other Duties Some travel may be required. Performs other work-related duties as required by management. What You Will Do Experience in EM and CAD/CAE tools, such as Channel Designer, HFSS, CST, FDTD tools, MoM tools, Sigrity PowerSI, PAKSI-E, Power-grid, Agilent ADS and Mentor Hyperlynx Working knowledge of Altium, or equivalent PCB design software. Understanding of high speed data applications Working knowledge of transmission line theory, s-parameters, bit error rate testing, cross talk, characteristic impedance, eye diagrams, time domain analysis. Working Knowledge of multi-port network analyzers, BER testers, Eye pattern analyzers, digital sampling scopes and TDRs. Ability to apply signal integrity concepts to laboratory data for analysis and troubleshooting. Strong knowledge of high speed material properties and behavior during data transmission. Good analytical ability to resolve signal integrity issues and apply logical reasoning, test assumptions, observe results and make corrections. Exposure to lean/six sigma methodology and statistical data analysis. Who You Are (Basic Qualifications) Bachelor’s or Master’s degree in Electrical Engineering, with emphasis on Signal integrity or Electromagnetics Experience in high speed automotive connector testing. What Will Put You Ahead Integrity: Thinks about and does what is right, regardless of the consequences. Raises concerns or asks questions when something doesn’t seem right, even when it’s difficult Always keeps commitments. Entrepreneurship: Works on things that matter (and knows why they matter). Acts with a sense of urgency to capture opportunities or deal with problems. Envisions long-term implications of decisions. Knowledge & Change: Invites, values, and seriously considers different ideas, opinions, and points of view Disagrees (constructively) when it may lead to a better way Drives and leads change Humility & respect: Willingly admits mistakes, failures, and shortcoming Gives credit appropriately Provides timely, honest feedback even when it’s difficult At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy. Who We Are At Molex, we not only employ some of the most talented people from all over the world, we work to help cultivate tomorrow's breakthroughs. From our corporate headquarters in Lisle, IL to manufacturing floors around the world, the Molex team is dedicated to helping further the limits of technology. For more information: Visit the Molex website at www.molex.com Follow us at www.twitter.com/molexconnectors Watch our videos at www.youtube.com/molexconnectors At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company. Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results. Show more Show less

Astrome Technologies is seeking a Lead RF Engineer specializing in satellite terminals to join our innovative team. In this role, you will be responsible for leading the design and development of state-of-the-art RF systems tailored for satellite communication terminals. Your expertise will significantly contribute to enhancing the performance and efficiency of our satellite-based communication solutions, ensuring they meet the high standards required for commercial and government applications. Requirements 8+ years of experience in RF engineering with a focus on satellite communication systems Ku-band (10GHz) or higher frequency design experience is a must Strong understanding of RF design principles and satellite communication protocols Experience designing RF front-end modules including amplifiers, filters, and antennas Proficiency in analysing RF simulation result from tools such as ADS, HFSS, or similar Hands-on experience in PCB design and layout at high frequency, specifically for RF applications Knowledge of high-speed interfaces and protocols used in satellite terminals Strong debugging and troubleshooting skills with RF test equipment., Experience with phased array antennas and beamforming technology is important Ability to lead a team and manage multiple projects simultaneously Excellent communication skills and ability to work collaboratively across departments A degree in Electrical Engineering, RF Engineering, or a related field; a Master's degree is preferred Benefits We offer great career growth, ESOPs, Gratuity, PF and Health Insurance. Show more Show less

Company: Qualcomm India Private Limited Job Area: Engineering Group, Engineering Group > Hardware Systems Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital and RF transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Systems Engineer, you will design a complete framework or system that influences the shaping of state-of-the-art mobile, edge, auto, AR/VR, compute, IOT, wearable products. Qualcomm Engineers collaborate with cross-functional teams (e.g., design, software, testing teams, etc.) to identify hardware testing needs and integrate components into products or systems. Minimum Qualifications: Bachelor's degree in Engineering or related field. Successful candidate for this position will join a hardware design team in Hyderabad developing digital platforms and mixed-mode wireless devices utilizing Qualcomm MSMs, RFICs, and power management ASICs for in-house design verification, software/firmware development, and customer reference designs. Candidates should have knowledge on high speed board design concepts, Solid electrical engineering, digital & analog circuit fundamentals, and should have lab skills. knowledge of transmission lines, cross talk, decoupling, low-power supply design, and layout of high performance PWBs is desired. Familiarity with modems, DSPs, microprocessors, memories, LCDs, camera sensors, batteries, and other consumer electronics hardware is desired. Job description: 0 - 3 years of relevant experience. High-speed board design, schematic design, layout reviews, test and integration, and maintaining hardware through the product cycle. Platforms may also incorporate ARM processors, graphics engines, digital audio, USB OTG, Bluetooth, GPS, SPI, I2C, DDR, MIPI, MDDI, and LAN functionality and candidate should have knowledge on these interfaces. Candidate must quickly assimilate onto a specified project, read/write technical specifications/requirements, develop/refine hardware designs, apply integration/lab skills, demonstrate strong problem solving abilities, and work closely with software and RF engineers to actively contribute toward the evolution of a shared platform. Candidate should support bring-up for MSMs and has to run the DVT and MTP performance testing for IPS projects. Additional Job Description Extensive knowledge of developing automation scripts based on Python Good working knowledge of EDA tools like HFSS, ADS Must be good at C , C++ programming & Matlab Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Company Qualcomm India Private Limited Job Area Engineering Group, Engineering Group > Hardware Systems Engineering General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital and RF transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Systems Engineer, you will design a complete framework or system that influences the shaping of state-of-the-art mobile, edge, auto, AR/VR, compute, IOT, wearable products. Qualcomm Engineers collaborate with cross-functional teams (e.g., design, software, testing teams, etc.) to identify hardware testing needs and integrate components into products or systems. Minimum Qualifications Bachelor's degree in Engineering or related field. Successful candidate for this position will join a hardware design team in Hyderabad developing digital platforms and mixed-mode wireless devices utilizing Qualcomm MSMs, RFICs, and power management ASICs for in-house design verification, software/firmware development, and customer reference designs. Candidates should have knowledge on high speed board design concepts, Solid electrical engineering, digital & analog circuit fundamentals, and should have lab skills. knowledge of transmission lines, cross talk, decoupling, low-power supply design, and layout of high performance PWBs is desired. Familiarity with modems, DSPs, microprocessors, memories, LCDs, camera sensors, batteries, and other consumer electronics hardware is desired. Job Description 0 - 3 years of relevant experience. High-speed board design, schematic design, layout reviews, test and integration, and maintaining hardware through the product cycle. Platforms may also incorporate ARM processors, graphics engines, digital audio, USB OTG, Bluetooth, GPS, SPI, I2C, DDR, MIPI, MDDI, and LAN functionality and candidate should have knowledge on these interfaces. Candidate must quickly assimilate onto a specified project, read/write technical specifications/requirements, develop/refine hardware designs, apply integration/lab skills, demonstrate strong problem solving abilities, and work closely with software and RF engineers to actively contribute toward the evolution of a shared platform. Candidate should support bring-up for MSMs and has to run the DVT and MTP performance testing for IPS projects. Additional Job Description Extensive knowledge of developing automation scripts based on Python Good working knowledge of EDA tools like HFSS, ADS Must be good at C , C++ programming & Matlab Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers. 3076623 Show more Show less

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment - able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Individual must be highly motivated, a quick learner, and able to work independently Competencies Location

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity's Supplier Development Teams find and develop suppliers to support the strategic sourcing organization in driving incremental performance in supplier quality, delivery, price and service. They teach new suppliers on how to work with TE (portal access, e-procurement tool usage, TE procedures, etc.). They extend TE Operational Advantage into the supply base to generate continuous improvement in the extended value stream, deliver incremental improvements through supplier development lead projects and achieve improvement targets specific for supplier development. They also help drive selection and development of the best total cost supply option in the region where the commodity or service is consumed. They keep abreast of emerging market options and inform the broader procurement organization of trends and new supply options. Responsibility: Electrical circuit & PCB design and optoelectronic component selection. Prototype development and evaluation Definition and/or Development of test systems for opto-electronic products Definition and coordination of test programs for purposes of design verification and product qualification Serve as liaison between Business Development, Marketing, Sales, Procurement, Manufacturing, contract design teams, customers, suppliers, and various other Engineering functions Generation of product drawings, application specifications, and instruction sheets Implementation of design changes to enhance product quality, improve manufacturability, and/or reduce manufacturing cost Review functional/performance specifications provided by customers and ensure that product requirements have been properly defined and documented prior to production. Perform/coordinate failure analysis work and determine corrective actions Initiation of Engineering Changes to improve designs, improve manufacturing, or respond to changes requested by the customer Achieve scope, schedule, and budget requirements Report out on project status as needed Meet all established project deadlines Regularly keep management informed of problems, issues, and status of on-going projects. Work with local and global counterpart / stake holder for ensuring quality deliverable and project execution. Work closely with third party vendor / supplier to define the technical requirements for the product and project execution. Mentor the new team members on design and development of opto-electronics products Desired Candidate Profile Education/ Knowledge: BE/BTech with specialization in Electronics & Communications Engineering Min 3 years of experience in Electronics board design and development for aerospace/ automotive/industrial applications Critical experience: Electronics hardware design for industrial, defense, automotive and aerospace applications Experience with optical transceivers with associated electronics hardware design Capable of High-Speed RF and/or Mixed Signal hardware Circuit Schematic and PCB layout Design and analysis Experience with Ethernet, Fiber Channel, Infiniband, and Rapid I/O standards Familiar with the SMPTE and DVI/HDMI video standards and protocols like I2C and SPI Experience with BERT testing and eye diagram analysis of opto-electronic devices and transceivers is a plus. Experience in embedded control hardware design for power electronics applications such power distribution units (PDU), motor drivers, smart power switching will be added advantage Experience with standard test equipment such as oscilloscopes, power meters, logic analyzers, signal/spectrum analyzers, etc. Experience with EMI/EMC requirements, qualification processes and electronics documentation Familiar with RF Microwave design and use of ADS, Sonnet and HFSS software will be an added advantage Familiar with software development and tools will be an added advantage Competencies EOE, Including Disability/Vets Location

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibility: Design and analysis of RF and/or Mixed Signal hardware Conduct detailed electrical design, supporting prototype and final hardware build & test Carry out component selection, schematic capture and PCB layout of parts Lead RF hardware projects from design to test to delivery through proper design methodology. Ensure on time delivery and first time right approach in all the project deliverables. Work with local and global counterpart / stake holder for ensuring quality deliverable and project execution. Interface with system, mechanical, software, and other engineers for ensuring design and task completion Work closely with third party vendor / supplier to define the technical requirements for the product and project execution. Mentor the new team members on design and development of RF product design Desired Candidate Profile Education/ Knowledge: BE/BTech with specialization in Electronics & Communications Engineering Min 5 years of experience in RF Microwave board design and development Critical experience: Experience with RF Microwave design for aerospace & defense applications Knowledge of RF circuit design for communication applications e.g., RF amplifiers, Filters. Knowledge about transmission line theory, analysis, and design aspects Understanding Antenna theory, its interfacing, UHF signal conditioning, communications systems blocks, and waveguides. Experience with ADS or Microwave Office, Cadence, Sonnet and HFSS software applications Familiarity with standard test equipment such as oscilloscopes, power meters, logic analyzers, signal/spectrum analyzers, etc. Familiarity with EMI/EMC requirements, qualification processes and electronics documentation Familiarity with optical transceivers will be an added advantag COMPETENCIES Technical capabilitiesExpert functional/domain knowledge Strong Technical Aptitude with Willingness to learn new Technologies quickly Competencies EOE, Including Disability/Vets Location

Key Responsibilities:  Develop and implement algorithms for Image Processing, Signal Processing, and Antenna Design.  Guide and mentor students and researchers on project development related to ECE.  Design and simulate antennas using tools like HFSS, CST, or MATLAB.  Work on signal and image processing projects using MATLAB, Python, OpenCV, and other relevant software.  Conduct research and provide solutions for academic project requirements in areas like radar signal processing, biomedical image analysis, wireless communication, and machine learning applications.  Document project work, develop reports, and assist in publishing research papers.  Stay updated with the latest trends and advancements in ECE-related fields. Required Skills and Qualifications:  Bachelor’s/Master’s/Ph.D. in Electronics and Communication Engineering (ECE) or a related field.  Strong knowledge of Image Processing, Signal Processing, and Antenna Design.  Proficiency in MATLAB, Python, OpenCV, HFSS, CST, ADS, or other relevant tools.  Experience in working with research-based projects and publications is a plus.  Excellent problem-solving, analytical, and communication skills.  Ability to work independently and collaborate with students and research scholars. Preferred Qualifications:  Experience in AI/ML applications in Image and Signal Processing.  Hands-on experience with software-defined radios (SDR) and RF circuit design.  Knowledge of FPGA-based implementation of signal processing algorithms Job Type: Full-time Pay: ₹13,000.00 - ₹15,000.00 per month Schedule: Day shift Ability to commute/relocate: Tirupati, Andhra Pradesh: Reliably commute or planning to relocate before starting work (Required) Work Location: In person

Location Hinjewadi, Pune - Maharashtra, India Pacesetting. Passionate. Together. HELLA, one of the leading automotive suppliers worldwide, has shaped the industry with innovative lighting systems and vehicle electronics. In addition, the company is one of the most important partners of the aftermarket and independent workshops. What motivates us: Shaping the mobility of tomorrow and fostering the central market trends such as autonomous driving, efficiency and electrification, connectivity and digitization as well as individualization. Every day, 36,000 employees worldwide are committed to this with passion, know-how and innovative strength. YOUR TASKS We are seeking a skilled candidate with a strong background in designing and analyzing RF circuits, developing antennas, creating PCBs, and implementing algorithms, leveraging hands-on expertise with RF equipment and good coding skills. Key Responsibilities Strong knowledge of RF engineering fundamentals and electromagnetic theory. Demonstrated ability to design RF systems and components from concept to prototype Proficiency in RF circuit designing/simulation tools, analysis, and troubleshooting. Proficiency in RF simulation tools such as ADS, CST, HFSS, or similar. Proficiency in programming languages like Python, MATLAB for algorithm development and automation. Familiarity with RF measurement and testing techniques. Familiarity with hardware prototyping tools and techniques. Knowledge of emerging RF technologies (e.g., 5G, mm Wave, IoT, Radar). Excellent problem-solving and troubleshooting skills with a solid mathematical and analytical background. Strong teamwork and communication skills to collaborate with multidisciplinary teams. Qualifications Bachelor's degree BE /B. Tech/ M.E/ M. Tech in Electronics/Electronics & Communication/Industrial Electronics Proven experience in discrete and analog circuit design. Familiarity with EMC requirements and optimization of BOM costs. Proficiency in CADENCE Allegro tool for PCB design. Strong analytical and planning skills. Excellent communication and coordination abilities. Ability to work collaboratively with cross-functional teams. Knowledge of hardware development standards and guidelines. Your Qualifications Take the opportunity to reveal your potential within a global, family-run company that offers you the best possible conditions for progressing in your career. Please send us your application through our careers portal, citing reference number req16388. HELLA India Automotive Pvt Ltd. Rimsha Shaikh Show more Show less

Your Job We continue to grow our Engineering Staff and are looking for a talented Signal Integrity Design Engineer to join our team. If you are looking for a way to accelerate your career and be part of a great company, this may be the opportunity for you. In this role, you will have the opportunity to perform characterization of high-speed connectors/cables and systems, using high-speed digital and electromagnetic measurements for automotive in-vehicle networks. Our Team Concept Design and Development Complete PCB Electromagnetic simulations (Ansys HFSS) Provide Signal Integrity test board layout support for high speed applications Provide recommended connector pin-out configuration for optimized signal integrity performance Design Verification & Product Validation Provide testing BOM Lead procurement activities of all components required to complete testing Develop test plans (DVP&Rs) with a cross-functional team to validate design standards (USCAR-49, GMW3191, IEEE, Open Alliance, etc.) Assist in the development and implementation of all sample preparation and testing procedures & instructions required to ensure accurate and repeatable test data Oversee signal integrity testing of shielded and unshielded automotive interconnects systems. Update product technical documentation (such as Engineering, Application and Product Specs). Approve Test lab best practices for internal and external signal integrity lab usage. Prepare presentation material for internal and customer design reviews. Perform gap analysis between high-speed standards Production Support Support product engineers with internal & customer 8D resolution activities. Other Duties Some travel may be required. Performs other work-related duties as required by management. What You Will Do Experience in EM and CAD/CAE tools, such as Channel Designer, HFSS, CST, FDTD tools, MoM tools, Sigrity PowerSI, PAKSI-E, Power-grid, Agilent ADS and Mentor Hyperlynx Working knowledge of Altium, or equivalent PCB design software. Understanding of high speed data applications Working knowledge of transmission line theory, s-parameters, bit error rate testing, cross talk, characteristic impedance, eye diagrams, time domain analysis. Working Knowledge of multi-port network analyzers, BER testers, Eye pattern analyzers, digital sampling scopes and TDRs. Ability to apply signal integrity concepts to laboratory data for analysis and troubleshooting. Strong knowledge of high speed material properties and behavior during data transmission. Good analytical ability to resolve signal integrity issues and apply logical reasoning, test assumptions, observe results and make corrections. Exposure to lean/six sigma methodology and statistical data analysis. Who You Are (Basic Qualifications) Bachelor’s or Master’s degree in Electrical Engineering, with emphasis on Signal integrity or Electromagnetics Experience in high speed automotive connector testing. What Will Put You Ahead Integrity: Thinks about and does what is right, regardless of the consequences. Raises concerns or asks questions when something doesn’t seem right, even when it’s difficult Always keeps commitments. Entrepreneurship: Works on things that matter (and knows why they matter). Acts with a sense of urgency to capture opportunities or deal with problems. Envisions long-term implications of decisions. Knowledge & Change: Invites, values, and seriously considers different ideas, opinions, and points of view Disagrees (constructively) when it may lead to a better way Drives and leads change Humility & respect: Willingly admits mistakes, failures, and shortcoming Gives credit appropriately Provides timely, honest feedback even when it’s difficult At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy. Who We Are At Molex, we not only employ some of the most talented people from all over the world, we work to help cultivate tomorrow's breakthroughs. From our corporate headquarters in Lisle, IL to manufacturing floors around the world, the Molex team is dedicated to helping further the limits of technology. For more information: Visit the Molex website at www.molex.com Follow us at www.twitter.com/molexconnectors Watch our videos at www.youtube.com/molexconnectors At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company. Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results. Show more Show less

The Group You’ll Be A Part Of In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry. The Impact You’ll Make Join Lam as an Electrical Engineer and you'll be at the forefront, designing and developing electronic solutions for advanced applications. Your role involves designing and analyzing equipment, conducting experimental tests, evaluating results to create reliable cutting-edge solutions. In this role, you will directly contribute to ___. What You’ll Do Design and develop electrical systems, sub-systems, and/or solutions, applying engineering methods to design. Contributes to research and development efforts by collecting and analyzing data to improve electrical system designs. Assists with development of functional specifications for electrical/ electro-mechanical systems and power distribution components. Collaborate with cross-functional engineering design teams to design and modify custom and OEM system components. Perform hands-on test and validation utilizing lab equipment to characterization of the performance of the electrical/ electro-mechanical systems. Prepare high-quality reports and technical presentations to clearly communicate design intent, analysis, and results to diverse audiences in design reviews. Minimum Qualifications Who We’re Looking For Bachelor’s degree in Electrical Engineering or related field with 2+ years of experience; or an advanced degree without previous professional experience; or equivalent work experience. Hands-on experience in electronic circuit design (analog, digital), signal and controls theory, development and associated electrical board design, troubleshooting and validation. Understanding of AC/DC Power distribution systems. System level understanding of Electrical architecture, system integration, and applications. Working knowledge in Printed Circuit Board (PCB) and low voltage circuit design for power and control applications. Knowledge in application of power and controls technologies for systems automation. Knowledgeable in CAD tools for circuit design and simulation (e.g., PCAD, ORCAD, ZUKEN, AutoCAD, Spice, ADS, HFSS). This is a graduate eligible role. Preferred Qualifications Familiar with design for serviceability, manufacturability, reliability. Skilled at troubleshooting systems with tools like network sniffers, protocol analyzers, and tool logs. Understanding of troubleshooting with problem-solving techniques such as 5-why, 8D, fishbones, etc. Excellent oral and written communication skills including technical presentations. Our Commitment We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results. Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees. Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time. Show more Show less

Transaparent RFID desing, HFSS software will be used. Show more Show less

Essential Responsibilities: Sound foundation in RF circuit design in PA and other circuit building blocks in III-V technologies GaAs/GAN (GaN preferable) Support hardware bring-up and characterization Participate in implementation design/layout reviews Contribute with innovative ideas for addressing design problems Required Qualifications: MTech with 4-6 years experience or PhDs with 0-4 years experience from top tier institutes Applicant should have proficient knowledge of RF circuit design and experience with EDA (Cadence, ADS) and EM simulators like CST, HFSS and EMX Experience in layout and parasitic extraction Circuit design, Reliability analysis, Statistical analysis of circuits, Thermal and packaging aspects Must have good technical verbal and written communication skills and ability to work with cross functional teams Be able to collaborate with technical design leads on multiple concurrent projects Preferred Qualifications: Good knowledge of GaN process technology and challenges with traps and pulsing techniques Understanding and experience of designing other RF circuit building blocks like LNA, PA, RF switches and SPSTs is a plus Good publication record and patents Dedication and the ability to work within a very dynamic interdisciplinary environment Ability to communicate as well as work efficiently in an international multi-disciplinary environment. Exceptional spoken and written Proficiency in English Strong analytical and problem-solving skills.

Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world leading MCUs, SoCs, Analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world. Job Description We are looking for an experienced leader for high performance SOCs/MCUs, for board and packaging group. Essential Functions Highly experienced in board and package design from block level to final board and package delivery. Should have the ability to work independently with little supervision and drive the team to define, develop and execute the product plan from specification to release. Must be a natural team player and strive towards fostering a highly creative and productive working environment Qualifications Minimum Requirements: MTech/BTech in EC/ EE/CS with hardware engineering experience of 4 to 15 years. Experience in Microcontroller and Microprocessor based complex design Experience in latest packaging Technologies and Manufacturing process Strong domain knowledge of system clocking, system modes, power management, debug Additional Preferred Qualifications Experience in IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging. Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity. Thermal simulation experience is added advantage. Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes. Board level System architecture and design includes memory or communication interfaces. SOC specifications and board level system specifications. Development and design of SOC power supply, system power supply specifications, and PMIC specifications. Interface specifications incorporating SOC-peripheral devices Experience with high-speed interface i.e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory Board level DC/AC simulations. Schematic, Layout and BOM generation using modern CAD tools Experience with SoC Bring-up activities Familiarity with PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process Experience with tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL Additional Information Renesas Electronics Corporation empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at www.renesas.com. Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics Corporation empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at www.renesas.com. Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’ At Renesas, You Can Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s Shape the Future together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Show more Show less

Desired Knowledge: Experience with Electromagnetic Emission and other Regulatory standards. - Simulation of electromagnetic systems using standard simulation software such as Ansys (Maxwell, Q3D, Circuit designer, Simplorer , SIwave, HFSS solvers) or other tools - Comsol or CST Studio. - Hands on experience in a lab environment to prove simulation results. - Provide oral and written reports to management and customers. Expertise and skills needed: BE in Electrical / Electronics Engineering / Power Electronics with a simulation background • Minimum of 3 years of experience EMI 3D modelling, and simulations - Hands on working experience with Ansys Maxwell, ANSYS HFSS tool. Knowledge of EMC simulation tools- Ansys SIWave, Ansys Electronics Desktop , Ansys Simplorer, Hyperlynx SI/PI. • Hands on experience working with EMI/EMC Simulations and working knowledge of RE, CE, RI, CI, ESD, EFT, Surge, Electromagnetic Compatibility (EMC), Electromagnetic Environmental Effects. • Hands on experience working on filter design and filter performance analysis in PCBA level as well as in Electromechanical system level. • Hands on Experience with test equipment VNA, Signal Generator, Spectrum Analyzer, EM probes. • Basic know how of implementation and integration of Hardware (PCBA), Mechanical housing, Firmware (Functions and configurations). • Good to have knowledge in thermal simulation tools. e.g: Icepack , FlowEFD • Sound knowledge of Basic Electronics and Electromagnetics. Mandatory Soft Skills needed: Good communication ability and technical leadership skills • Good presentation skills • Shall be a good team player Shall be highly motivated and ownership taker. Shall be proactive and self confident • Good Analytical and problem-solving skills. Tools to be known: Electromagnetic and EMI/EMC Simulations: ANSYS SIWave, ANSYS Electronics Desktop with Maxwell , HFSS, Q3D, Simplorer, EMIT (OR) CST, Cadence SIG Explorer etc. Good to have - Thermal Simulations : Icepack, FlowEFD. Core Responsibilities: Simulation models of PCBs on Electromechanical systems by understanding applications and relevant physics • Verification and validation of models w.r.t to measurements. • Able to perform EMI simulations and manage large complexity projects independently. • EMC Analysis engineer with good understanding of EMC concept and standards. • Responsible for EMC analysis, includes SI,PI Analysis, PCB level Filters simulations. Responsible for debugging and providing solutions for EMC related issue. • Support Electronics Engineer, Mechanical Engineer, PCB team for layout design with EMC improvement.

Antenna & Advanced Communication Engineer – Space Division Location: Ahmedabad Company: Stdaux As an Antenna & Advanced Communication Engineer, you will own the full design lifecycle of our space communication systems. You will work on RF antennas (phased arrays, reflectors, Wi-Fi) as well as contribute to cutting-edge developments in free-space optical communication (FSO) for satellite and ground-based links. This is a hands-on role with strong collaboration across cross-functional teams—from initial concept to real-world deployment. Key Responsibilities: Design and prototype RF antenna systems (phased arrays, reflectors, Wi-Fi antennas). Perform EM simulations using CST, HFSS, or similar tools. Develop optical link components (FSO terminals, beam steering modules, etc.). Collaborate with optics, electronics, and mechanical teams to integrate optical systems. Create Python-based tools to automate RF and optical test setups. Perform link budget analysis for both RF and optical systems. Support validation, field testing, and scaling to production. Basic Qualifications: Bachelor’s degree in Electrical, Electronics, Communication, or Photonics Engineering. 1+ years of experience in RF or optical communication systems (projects/internships acceptable). Experience with test equipment (VNAs, spectrum analyzers, optical power meters, etc.). Programming experience in Python, MATLAB, or similar. Preferred Qualifications: Master’s or PhD in RF, Antenna, or Optical Communication Engineering. Knowledge of free-space optical (FSO) communication or laser communication systems. Experience with phased array antennas, mmWave, or laser beam steering. Strong fundamentals in communication theory, signal propagation, and link analysis. Familiarity with optical components like collimators, lenses, and detectors. Additional Requirements: Based in Ahmedabad or willing to relocate. Flexibility to work extended hours for mission-critical testing or launches. Willingness to travel occasionally for field tests or site integration. Important Points: Work from Home not allowed in any condition. 6 Months compulsory probation period and you will be probationary employee. Work location can be changed as per the management decision. Show more Show less

Roles and Responsibilities Should be having hing level understanding for Design, develop and test various types of antennas for various applications Conduct research and evaluate the performance of novel antenna design CST/ HFSS/ MATLAB software skills are preferred Develop and maintain technical documentation, including test plans and reports Should have knowledge related to fabrication and testing of the designed antenna. Good communication and analytical problem solving capability. Desired Candidate Profile B.E. or B.Tech with minimum one year of work experience. M.E. or M.Tech fresher. Perks and Benefits Salary, monthly grocery and medical insurance.

Company Qualcomm India Private Limited Job Area Engineering Group, Engineering Group > Hardware Engineering General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. The Power & Signal Integrity Group (PSIG) resides in the CHS (Central Hardware Systems) unit of Qualcomm Technologies, Inc., a leader in wireless communication technology. Engineers in the Power & Signal Integrity Group work with the various business units across Qualcomm to help bring leading edge mobile, AR\VR, IoT, Automotive and various others products to market. The candidate will work in a team-oriented environment with cross functional leads to provide electrical design expertise in the areas of signal integrity and power integrity for the design of wireless products and development systems. The engineer will be located in Bangalore, India and will be closely working with the Product architects, Platform HW teams, IO\PHY, IC Packaging, and other teams. The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 2+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models The Following Experience Is a Plus DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Education Requirements Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferred Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers. 3074902 Show more Show less

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Signal Integrity Research and Development (SI R&D) group supports all current and future product development, including DRAM, LPDRAM, NAND, NOR, 3DXP, DIMM modules and SSDs within the consumer, server, mobile, networking, graphics, automobile and embedded businesses. The SI R&D group works on analysis of end to end systems solutions including, but not limited to circuit level IO and Power Distribution, integrated circuit (IC) packages, printed circuit boards (PCBs) and measurements to ensure good Signal Integrity (SI) and power integrity (PI) performance for Micron’s memory solutions. The group owns all steps of the signal and power integrity support process including die IO and package model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support. The group also supports future specification development within several industry standards groups including but not limited to JEDEC, ONFI, and IBIS. The group working environment is technically challenging, team-oriented, collaborative and customer-centric. Within the larger SI R&D group, as an Engineer in the Signal Integrity team at Micron, you will be responsible for Working on various aspects of SI and PI for high speed interfaces, including modeling (silicon, package and board level signal and power delivery network, as necessary for the project), time and frequency domain analysis for SI and PI electrical performance evaluation of Micron products and correlation to measurement for the various products. Ensuring that processes for various methodologies are executed effectively and accurately. Collaborating with TMs within the global SIRD group for development and continued optimization of methodologies for modeling and analysis as needed. Representing the SI R&D team in technical cross functional collaborative groups, and integrating with package design, silicon design, product engineering, and marketing departments to ensure overall product performance. Occasionally Supporting FAE, applications engineers with models for service to external customer as needed Occasionally Supporting path-finding activities through modeling support Qualifications Successful candidates for this position will have: Bachelors or Masters in Electrical/Electronics Engineering wtih 8-15 years of industry experience Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience. Strong SI/PI/EMI theory and application, modeling, analysis, simulation Signal and Power Integrity Background Experience with, and intermediate working knowledge of E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS, etc.. Deep understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single-ended interface technologies. Deep understanding of timing budgets and jitter analysis Expertise in Printed Circuit Board (PCB) layout or electrical package design techniques. Experience in design and analysis of high-speed single-ended or differential buses Familiarity with, and fundamental understanding of lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc. Familiarity with statistical analysis (DOE) and equivalent tools (example: JMP) is also beneficial Desirable Memory industry experience Ambitious candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal interpersonal skills, and have the ability to work well in a team with varied strengths. Successful Candidates For This Position Will Be Pro-active – Candidate will be expected to identify gaps and opportunities and address them with minimal supervision. Collaborator – Candidate will be expected to work with various teams globally; and support both internal as well as external customers Communicator – Candidate should be able to clearly convey necessary details of complex issues and corresponding solutions in both written and verbal formats. We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law. This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. Show more Show less

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact As a Staff Signal Integrity Engineer with Marvell, you’ll be a member of the Custom Compute & Storage - CCS BU. You’ll be part of the Signal integrity Team designing high performance hardware for the industry leading CCS-BU SoC products targeted for Datacenter, Storage and AI applications. Marvell Custom Compute & Storage - CCS BU has been at the forefront of developing and delivering leading-edge, high-performance data processing silicon platforms. By delivering a stream of technical innovations through a diverse set of fast‐growing product lines, Marvell technology is powering the next‐generation data processing and workload acceleration platforms for the Carrier, Cloud/Enterprise and Automotive Compute market segments. The team focusses on the Custom ASIC business, Cloud AI solutions & Enterprise/Career solutions including the CXL product line. What You Can Expect Engage with Hardware Engineering, Package Design and SoC Design Teams to define the SI/PI requirements and dependencies with support. Perform pre-layout simulations and generate layout guidelines and checklists. Review schematics for the hardware and analyse the feasibility of hardware. Review design and guide PCB layout team for placement and layout for first-time-right design. Perform SI/PI simulation for the hardware and deliver error free reports. Measure fabricated PCBs and perform correlation between simulation and measured results. What We're Looking For Bachelor’s degree in Electrical Engineering and 4 - 8 years of related professional experience or Master’s/PhD in Electrical Engineering with 1-3 years of experience. Strong fundamentals in EM, transmission lines and microwave theory Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity, PowerSI. Experience on any of the schematic and layout tools - Cadence Allegro, Mentor Expedition, Orcad Ability to manage hardware development involving various cross functional teams like HW Design, PCB layout, Hardware assembly, IC packaging teams, Analog and Digital designers, marketing and PCB Fab vendors. Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL. Power plane design, modeling and analysis using tools like PowerSI, Power DC, SIwave Working knowledge of circuit analysis tools: ADS, HSpice Frequency domain and time domain knowledge of high speed signaling Familiarity with PCB technologies, DFM, DFA, materials, stackup design rules and assembly rules Prior hands-on experience of reviewing Hardware Schematics and PCB layout on industry standard tools. Understanding, debugging and simulations of hardware design Experience with VNA and TDR measurements for PCB characterization would be a plus. Track record of new product introduction from concept, through development and production is a plus. Knowledge of the thermal analysis of the PCB hardware is a plus. Experience with channel simulations using MATLAB or ADS or other tools is a plus. Strong communication, presentation, and documentation skills Additional Compensation And Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. Show more Show less

Senior Simulation Engineer Our Mission SPAN is enabling electrification for all We are a mission-driven company designing, building, and deploying products that electrify the built environment, reduce carbon emissions, and slow the effects of climate change. Decarbonization is the process to reduce or remove greenhouse gas emissions, especially carbon dioxide, from entering our atmosphere. Electrification is the process of replacing fossil fuel appliances that run on gas or oil with all-electric upgrades for a cleaner way to power our lives. At SPAN, we believe in: Enabling homes and vehicles powered by clean energy Making electrification upgrades possible Building more resilient homes with reliable backup Designing a flexible and distributed electrical grid The Role Join the SPAN engineering team as a Senior Simulation Engineer. In this role, you will leverage your expertise in Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) to conduct high-quality simulations that drive design decisions and enhance product performance. Familiarity with HFSS for antenna and cable harness applications is a valuable bonus. You will take ownership of simulation activities, working closely with a US-based engineering mentor for technical guidance. The ability to manage simulation tasks across different time zones, specifically between teams in India and the west coast of the USA, is critical. This role demands strong communication and coordination skills, as well as a commitment to continuous improvement. Responsibilities: Independently execute CFD and FEA simulations to provide actionable insights that inform and optimize product designs. Use engineering analysis to drive design decisions on thermal interface materials, electronics and electronic cooling systems, and passive and active cooling methods Design and build thermal experiment test setups, collect experimental data, and leverage experimental and fleet wide data analytics to improve simulation accuracy Collaborate with your engineering mentor to analyze simulation results, recommending design changes to enhance performance and reliability. Coordinate simulation tasks across teams, ensuring effective communication and timely updates between disparate time zones. Document methodologies and findings with clarity, promoting knowledge sharing and contributing to team learning. Actively participate in design reviews, providing insights from simulations to shape project directions and goals. Seek opportunities for professional development through feedback and collaboration with peers. Potential Projects: Analyzing the performance and efficiency of new energy-efficient electrical systems. Conducting simulations to evaluate antenna designs and cable harness configurations. Collaborating with cross-functional teams to integrate simulation findings into physical prototypes and testing. About You Required Qualifications You'd be a great fit for this role if you: Hold a BS or MS in Mechanical Engineering, Electrical Engineering, or a related field. Have 5+ years of hands-on experience in simulations, specifically focusing on CFD and FEA methodologies. Demonstrate a solid understanding of HFSS simulations for RF applications, particularly in antennas and cable harnesses. Exhibit excellent communication skills for coordinating simulation activities across different time zones. Show strong analytical problem-solving skills and the ability to manage multiple projects effectively, taking ownership of simulation outcomes. Advanced knowledge of heat transfer, thermodynamics, linear and non-linear structural analysis, continuum mechanics, and advanced material models Bonus Qualifications Wed love it if you also have: Experience in electro-mechanical design and analysis. Knowledge of international safety and regulatory standards such as UL, NEC, IEC, and ISO. Familiarity with renewable energy technologies and their integration into electrical systems. Life at SPAN Our Bengaluru team plays a pivotal role in SPANs continued growth and expansion. Together, were driving engineering , product development , and operational excellence to shape the future of home energy solutions. As part of our team in India, youll have the opportunity to collaborate closely with our teams in the US and across the globe. This international collaboration fosters innovation, learning, and growth, while helping us achieve our bold mission of electrifying homes and advancing clean energy solutions worldwide. Our in-office culture offers the chance for dynamic interactions and hands-on teamwork, making SPAN a truly collaborative environment where every team members contribution matters. Our climate-focused culture is driven by a team of forward-thinkers, engineers, and problem-solvers who push boundaries every day. Do mission-driven work: Every role at SPAN directly advances clean energy adoption. Bring powerful ideas to life: We encourage diverse ideas and perspectives to drive stronger products. Nurture an innovation-first mindset: We encourage big thinking and bold action. Deliver exceptional customer value: We value hard work, and the ability to deliver exceptional customer value. Benefits at SPAN India Generous paid leave Comprehensive Insurance & Health Benefits Centrally located office in Bengaluru with easy access to public transit, dining, and city amenities Interested in joining our team? Apply today and well be in touch with the next steps!

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } PRINCIPAL R&D/PRODUCT DVL ENGINEER Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelor’s degree in electrical or electronicsengineering, master’s degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIR’s, CTLE’s) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131404 Alternative Locations: Function: Engineering & Technology Job Segment Six Sigma, R&D Engineer, Electrical, Electronics Engineer, Hardware Engineer, Management, Engineering Apply now »