57 Hfss Jobs

Designs a complete and complex Simulation framework, system, or product. Define simulationprocesses for technical platforms, system specifications, input/output and working parameters for hardware and/or software compatibility. Conceives system interfaces and business application prototypes. Identifies, analyzes and resolves system design weaknesses. Influences the shaping of future products by contributing to the framework (architecture) used across multiple products or systems. Responsibilities Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy FEA Techniques – implicit and explicit approach, using Software tools like Ansys Work Bench, LSdyna, Hypermesh, Simufact, Digimat etc. Translate actual problem to Finite Element Analysis (FEA) model, interpret analysis results and select best solution which includes linear & non-linear analysis under different physics. Monitor and evaluate simulation software capabilities and industry trends. Deploy standardized process and work methodology. Train and develop capability of the team to be a multi-skilled resource pool. Benchmark implement productivity improvement methods. Track monitor metrics for sustained performance covering quality & delivery. Collaborate with design & validation teams to enhance the design optimization. Drive simulation automation, ROM (Reduced Order Modeling), Multiphysics simulations, and system-level simulations. Apply AI/ML techniques for design optimization and decision making. Desired Candidate Profile BE/ B.Tech (Mechanical/Electrical) M Tech (Mechanical/Electrical) (preferred) 5-7 years of industry experience Expertise in Ansys Workbench. Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Knowledge of product, design processes and methodology. Expertise on CAE tools, Optimization techniques, and testing methods Understanding of LEAN / 6 Sigma / Kaizen techniques. Proficiency in state-of-the-art o FEA- ANSYS WORKBENCH, LS-DYNA, HYPERMESH, SIMUFACT, MOLDEX3D, OPTISLANG, ICEPAK MAXWELL, Ansys HFSS, CELCIUS EC (SIX SIGMA ET), System simulations such as MATLAB & SIMULINK. o CAD tools- PTC Creo, Space Claim. o Programming language - Python, Microsoft VB-script, Power BI. Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Experience on connector products (Plastic and Sheet Metal parts) is an added advantage. Exposure to AI/ML-based simulation optimization workflows and digital twin development. Experience with simulation process integration and automation tools (e.g., Ansys ACT, Workbench Scripting, PyAnsys). Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork ABOUT TE CONNECTIVITY TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events Employee Resource Group IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site.

Company Qualcomm India Private Limited Job Area Engineering Group, Engineering Group > Hardware Systems Engineering General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital and RF transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Systems Engineer, you will design a complete framework or system that influences the shaping of state-of-the-art mobile, edge, auto, AR/VR, compute, IOT, wearable products. Qualcomm Engineers collaborate with cross-functional teams (e.g., design, software, testing teams, etc.) to identify hardware testing needs and integrate components into products or systems. Minimum Qualifications Bachelor's degree in Engineering or related field. Successful candidate for this position will join a hardware design team in Hyderabad developing digital platforms and mixed-mode wireless devices utilizing Qualcomm MSMs, RFICs, and power management ASICs for in-house design verification, software/firmware development, and customer reference designs. Candidates should have knowledge on high speed board design concepts, Solid electrical engineering, digital & analog circuit fundamentals, and should have lab skills. knowledge of transmission lines, cross talk, decoupling, low-power supply design, and layout of high performance PWBs is desired. Familiarity with modems, DSPs, microprocessors, memories, LCDs, camera sensors, batteries, and other consumer electronics hardware is desired. Job Description 0 - 3 years of relevant experience. High-speed board design, schematic design, layout reviews, test and integration, and maintaining hardware through the product cycle. Platforms may also incorporate ARM processors, graphics engines, digital audio, USB OTG, Bluetooth, GPS, SPI, I2C, DDR, MIPI, MDDI, and LAN functionality and candidate should have knowledge on these interfaces. Candidate must quickly assimilate onto a specified project, read/write technical specifications/requirements, develop/refine hardware designs, apply integration/lab skills, demonstrate strong problem solving abilities, and work closely with software and RF engineers to actively contribute toward the evolution of a shared platform. Candidate should support bring-up for MSMs and has to run the DVT and MTP performance testing for IPS projects. Additional Job Description Extensive knowledge of developing automation scripts based on Python Good working knowledge of EDA tools like HFSS, ADS Must be good at C , C++ programming & Matlab Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers. 3076627

Company Qualcomm India Private Limited Job Area Engineering Group, Engineering Group > Hardware Engineering General Summary WLAN RF Front-end design, validation and debug. Skills/Requirements 4-6 years of experience in RF Front-end design, tuning and debug preferably in WiFi domain. Strong RF board design and debug experience. Experience in using EDA tools like ADS, HFSS , AWR for RF design and Layout simulation. Must be hands on bench level debug and testing. Experience with lab equipment’s including Spectrum analyzer, Network analyzer, Signal generator, etc Experience in using the circuit design tools(Cadence/Mentor) and Layout tools. Experience with EMI/EMC testing System level architecture design is desirable. Candidates must possess good oral and written communication skills. Minimum Qualifications Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 4-6 years of experience Bachelors/Masters in Engineering Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers. 3077244

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description The Staff Packaging engineer will be an individual contributor and should be able to perform package design related to flash memory products As a IC packaging engineer, you will work in the Packaging R&D group on package deign, modeling and simulation across semiconductor packaging, flash memory product, and host levels. ( mainly on BGA / system in packages ) In this position, you will be responsible for influencing package and product design and advancing the technology of semiconductor packaging generally. Scope is to address all design aspects of packaging technology and associated material and process interactions. Knowledge of semiconductor assembly process is required ( back grinding , dicing , Die attach , wire bonding, molding , laser marking , laser cutting , singulation , solder ball attach , reflow , SMT, testing ) Higher Die stacking and its wire bonding / molding concept to be known Focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects and higher power. Candidate will be responsible for the modeling and simulation of mechanical responses of the IC package and flash products using analytical and computational tools. Working knowledge on AI/ML , data science must This position will interface with package & product design, electrical and physical characterization, lab testing, failure analysis, assembly R&D and other process teams. Interacting with internal engineering departments, vendors and customers to develop high performance leadership package Ability to daily multi-tasking in different projects, manage and meet tight deadlines of packaging deliverables as a part of multidisciplinary team as well as excellent communication and interpersonal skills required. Knowledge of Package signal integrity and power integrity principles would be good. Knowledge of EMI, HFSS, HSPICE is a plus. Hands-on with oscilloscopes, network analyzers and spectrum analyzers also a plus Skills in AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques are good. Qualifications B.Tech or M.Tech in mechanical / microelectronics / mechatronics / Thermal/ electronics engineering Solid knowledge through academic coursework subjects Background in applied mechanics with emphasis on both analytical and computational methods. AutoCAD must Broad knowledge of mechanical behaviours of various material types, such as ceramics and glass, polymers, and metals (e.g., solder). Strong oral and written communication skills. Demonstrated strong work ethic. Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Company Description SINAXIS ENTERPRISES PRIVATE LIMITED, based in Delhi, India, is a prominent player in the industry, known for its innovative engineering solutions. With a focus on quality and precision, the company offers a wide range of services aimed at enhancing industrial efficiency and performance. Role & responsibilities: · Good Technical knowledge on RF/ Microwave, Mixed-signal, Digital, Analog Circuits & Sub-Systems, current prototype/ production/ process technology. · Experience on design, development, testing, debugging & field trials of RF/Digital subsystems like Transmitters, Receivers, Frequency converters, Mixers, PLL Synthesizers, Amplifiers, Filters, passive components, etc. for strategic electronics requirements. · Experience/ Programming knowledge on DDS, Direct conversion, Agile Transceiver ICs, Mixers, and Synthesizers. · Experience in Board & Circuit design, simulation, testing, integration, validation, debugging and optimization of performance parameters like Power, Frequency, S parameters, Impedance matching, Modulation techniques, etc. with consideration of A&D Quality & EMI/EMC standards. · Experience in RF/ Mixed signal schematic preparation, DRC check, power budget analysis, Net-list generation and verification, PCB layout, manufacturing & assembly. · Understanding of scope of work, client inputs/requirements specifications, input analysis, architecture, component selection, ordering, preparation of Block diagram. · Hand-on testing experience using microwave test equipment’s like network analyzer, spectrum analyzer, Signal generator, Oscilloscope, Noise source, etc. · Very good skills for documentation, generation & execution skills of ATP, ATR, TDR, CMR, QMS Reports, Project management, planning & organizing. · Quick learner, efficient team member, result oriented, good communication & interpersonal skills, integrity, persistence. Key Skills: · Filters Spectrum Analyzer Analog Circuit Design RF/ Microwave RF Design EMI / EMC Amplifiers Network Analyzer Mixed Signal Design ADS HFSS Schematic PCB Layout. Preferred candidate profile: B.Tech/B.E. - Electronics/Telecommunication, Computers M.Tech - Electronics/Telecommunication, Computers Role - Design Engineer Industry Type - Defence & Aerospace Department - Research & Development

Job Overview Job Summary We are seeking a skilled and detail-oriented PCB (Printed Circuit Board) Designer to join our engineering team. The PCB Designer will be responsible for creating complex PCB layouts from schematics, ensuring manufacturability, and collaborating closely with electrical engineers and mechanical designers to deliver reliable and cost-effective designs. Required Qualifications Bachelor’s degree in Electrical Engineering, Electronics Technology, or related field. 4 to 6 years of hands-on experience in PCB layout design across various applications and technologies. Expert-level proficiency in Altium Designer; experience with schematic capture, layout, and design rule management. Solid understanding of electronic components, schematics, and PCB manufacturing processes. In-depth understanding of EMI/EMC mitigation, thermal management, and mechanical design considerations for enhanced board performance and reliability. Proven expertise in designing analog, digital, and high-speed circuits with impedance-controlled layout techniques. Experience in PCB reverse engineering and board conversions across different CAD platforms. Skilled in developing and managing ECAD component libraries, ensuring accuracy and consistency with design standards. Strong knowledge of IPC standards (such as IPC-2221, IPC-7351) and UL safety compliance requirements. Solid experience in Design for Excellence (DFx) practices, including Design for Manufacturing (DFM), Assembly (DFA), and Testing (DFT). Proficient in CAM350 for Gerber file analysis and design rule verification. Excellent verbal and written communication skills, with the ability to effectively collaborate with cross-functional teams and clients. Preferred Qualifications Experience with high-speed digital or RF/mixed-signal PCB designs. Proficiency in signal integrity (SI) and power integrity (PI) analysis and simulation. Experience with tools such as ANSYS SIwave and HFSS is a strong advantage. Certification in PCB design (e.g., IPC CID/CID+) is an added advantage. Soft Skills Strong attention to detail and quality. Excellent communication and collaboration skills. Ability to manage multiple projects and meet deadlines. Problem-solving mindset and proactive attitude. A Day In The Life Key Responsibilities Lead the design of complex multilayer PCBs, including high-power, high-voltage, high-speed digital, RF, and analog circuits. Develop schematic diagrams based on engineering inputs and system requirements. Translate electrical and mechanical design inputs into precise and manufacturable PCB layouts. Ensure PCB designs comply with electrical performance criteria, assembly requirements, and fabrication standards. Prepare and release comprehensive PCB design documentation packages, including Gerber files, fabrication drawings, assembly drawings, and panelization layouts. Work with fabrication and assembly vendors to ensure the manufacturability of designs. Conduct thorough reviews to ensure all components and design practices comply with IPC standards, manufacturer specifications, and internal guidelines. Collaborate effectively with clients and cross-functional teams to ensure timely delivery of project milestones. Develop and maintain detailed checklists to support layout and design release processes. Research and integrate advanced layout techniques and tools to optimize design quality and efficiency.

Company: Qualcomm India Private Limited Job Area: Engineering Group, Engineering Group > Hardware Systems Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital and RF transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Systems Engineer, you will design a complete framework or system that influences the shaping of state-of-the-art mobile, edge, auto, AR/VR, compute, IOT, wearable products. Qualcomm Engineers collaborate with cross-functional teams (e.g., design, software, testing teams, etc.) to identify hardware testing needs and integrate components into products or systems. Minimum Qualifications: Bachelor's degree in Engineering or related field. Successful candidate for this position will join a hardware design team in Hyderabad developing digital platforms and mixed-mode wireless devices utilizing Qualcomm MSMs, RFICs, and power management ASICs for in-house design verification, software/firmware development, and customer reference designs. Candidates should have knowledge on high speed board design concepts, Solid electrical engineering, digital & analog circuit fundamentals, and should have lab skills. knowledge of transmission lines, cross talk, decoupling, low-power supply design, and layout of high performance PWBs is desired. Familiarity with modems, DSPs, microprocessors, memories, LCDs, camera sensors, batteries, and other consumer electronics hardware is desired. Job description: 0 - 3 years of relevant experience. High-speed board design, schematic design, layout reviews, test and integration, and maintaining hardware through the product cycle. Platforms may also incorporate ARM processors, graphics engines, digital audio, USB OTG, Bluetooth, GPS, SPI, I2C, DDR, MIPI, MDDI, and LAN functionality and candidate should have knowledge on these interfaces. Candidate must quickly assimilate onto a specified project, read/write technical specifications/requirements, develop/refine hardware designs, apply integration/lab skills, demonstrate strong problem solving abilities, and work closely with software and RF engineers to actively contribute toward the evolution of a shared platform. Candidate should support bring-up for MSMs and has to run the DVT and MTP performance testing for IPS projects. Additional Job Description Extensive knowledge of developing automation scripts based on Python Good working knowledge of EDA tools like HFSS, ADS Must be good at C , C++ programming & Matlab Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Job Overview Job Summary We are seeking a skilled and detail-oriented PCB (Printed Circuit Board) Designer to join our engineering team. The PCB Designer will be responsible for creating complex PCB layouts from schematics, ensuring manufacturability, and collaborating closely with electrical engineers and mechanical designers to deliver reliable and cost-effective designs. Required Qualifications Bachelor’s degree in Electrical Engineering, Electronics Technology, or related field. 4 to 6 years of hands-on experience in PCB layout design across various applications and technologies. Expert-level proficiency in Altium Designer; experience with schematic capture, layout, and design rule management. Solid understanding of electronic components, schematics, and PCB manufacturing processes. In-depth understanding of EMI/EMC mitigation, thermal management, and mechanical design considerations for enhanced board performance and reliability. Proven expertise in designing analog, digital, and high-speed circuits with impedance-controlled layout techniques. Experience in PCB reverse engineering and board conversions across different CAD platforms. Skilled in developing and managing ECAD component libraries, ensuring accuracy and consistency with design standards. Strong knowledge of IPC standards (such as IPC-2221, IPC-7351) and UL safety compliance requirements. Solid experience in Design for Excellence (DFx) practices, including Design for Manufacturing (DFM), Assembly (DFA), and Testing (DFT). Proficient in CAM350 for Gerber file analysis and design rule verification. Excellent verbal and written communication skills, with the ability to effectively collaborate with cross-functional teams and clients. Preferred Qualifications Experience with high-speed digital or RF/mixed-signal PCB designs. Proficiency in signal integrity (SI) and power integrity (PI) analysis and simulation. Experience with tools such as ANSYS SIwave and HFSS is a strong advantage. Certification in PCB design (e.g., IPC CID/CID+) is an added advantage. Soft Skills Strong attention to detail and quality. Excellent communication and collaboration skills. Ability to manage multiple projects and meet deadlines. Problem-solving mindset and proactive attitude. A Day In The Life Key Responsibilities Lead the design of complex multilayer PCBs, including high-power, high-voltage, high-speed digital, RF, and analog circuits. Develop schematic diagrams based on engineering inputs and system requirements. Translate electrical and mechanical design inputs into precise and manufacturable PCB layouts. Ensure PCB designs comply with electrical performance criteria, assembly requirements, and fabrication standards. Prepare and release comprehensive PCB design documentation packages, including Gerber files, fabrication drawings, assembly drawings, and panelization layouts. Work with fabrication and assembly vendors to ensure the manufacturability of designs. Conduct thorough reviews to ensure all components and design practices comply with IPC standards, manufacturer specifications, and internal guidelines. Collaborate effectively with clients and cross-functional teams to ensure timely delivery of project milestones. Develop and maintain detailed checklists to support layout and design release processes. Research and integrate advanced layout techniques and tools to optimize design quality and efficiency. Competencies Initiative and Drive Leveraging Learning and Feedback Building Relationships and Networks Developing trust and inspiring others Innovation and change Coaching and developing others

Company Qualcomm India Private Limited Job Area Engineering Group, Engineering Group > Hardware Engineering General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Solid understanding of Electronics engineering fundamentals, PCB manufacturing process, Mixed-signal and RF circuit analysis techniques. Knowledge of RF & Mixed Signal PCB design, test board debug and using CAD software such as Mentor Graphics DA or Cadence Allegro is mandatory Good understanding of Si-Pi for board designs and ability to use simulation tools like HFSS, ADS, Power SI is mandatory Good knowledge of RF & Digital measurement techniques like S-parameters, TDRs, Eye analysis, jitter, isolation etc. Good ASIC device level characterization skills. System level knowledge is a plus. Able to work comfortably with lab equipment like Oscilloscopes, Network Analyzer, Spectrum Analyzer, Signal Generator, Digitizer etc is a plus Good software skills for writing codes for automation using Python is a plus. Able to communicate clearly, organize effectively and document work thoroughly while working with local and global teams. Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers. 3075947

Company Qualcomm India Private Limited Job Area Engineering Group, Engineering Group > Hardware Engineering General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Solid understanding of Electronics engineering fundamentals, PCB manufacturing process, Mixed-signal and RF circuit analysis techniques. Knowledge of RF & Mixed Signal PCB design, test board debug and using CAD software such as Mentor Graphics DA or Cadence Allegro is mandatory Good understanding of Si-Pi for board designs and ability to use simulation tools like HFSS, ADS, Power SI is mandatory Good knowledge of RF & Digital measurement techniques like S-parameters, TDRs, Eye analysis, jitter, isolation etc. Good ASIC device level characterization skills. System level knowledge is a plus. Able to work comfortably with lab equipment like Oscilloscopes, Network Analyzer, Spectrum Analyzer, Signal Generator, Digitizer etc is a plus Good software skills for writing codes for automation using Python is a plus. Able to communicate clearly, organize effectively and document work thoroughly while working with local and global teams. Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers. 3076091

Job Title: RF Hardware Engineer Location: Thane, MH About the Role: Namaskaram! We are seeking a highly skilled and experienced RF Hardware Engineer to join our innovative hardware team. As an RF expert, you will be responsible for the end-to-end design, development, testing, and validation of RF systems and components for our next-generation products. You will work closely with cross-functional teams including antenna, digital, and mechanical engineers to ensure high-performance, robust RF solutions. Key Responsibilities: Design and develop RF circuits including LNA, PA, mixers, filters, baluns, and matching networks. Perform RF simulations using tools like ADS, HFSS, CST, and EMPro. Schematic capture and review PCB layout for RF modules with attention to high-frequency signal integrity and EMC. Conduct RF performance tuning, calibration, and optimization for Wi-Fi, Bluetooth, LTE/5G, GNSS, and custom wireless systems. Execute lab testing, characterization, and validation using VNA, spectrum analyzers, signal generators, and network analyzers. Collaborate with antenna and mechanical teams for RF integration, co-design, and mitigation of interference and defence issues. Ensure compliance with regulatory standards (FCC, CE, ETSI, etc.) and support certification testing. Drive root-cause analysis and resolution of RF-related issues during design, NPI, and field deployment stages. Document design specifications, test plans, reports, and design reviews. Qualifications: Bachelor’s or Master’s degree in Electrical Engineering, Electronics, or a related field. 5+ years of hands-on experience in RF hardware design and development. Strong knowledge of RF fundamentals, transmission line theory, impedance matching, and wireless communication systems. Proficient in simulation tools (e.g., Keysight ADS, Ansys HFSS/CST) and PCB design tools (e.g., Altium, Cadence Allegro). Experienced in lab instrumentation and RF measurements. Solid understanding of wireless protocols: Bluetooth, Wi-Fi, LTE, 5G, GNSS, etc. Strong debugging skills and experience with EMC/EMI mitigation. Excellent communication and documentation skills. Experience with high-volume consumer electronics is a plus. Nice to Have: Experience with WiFi, BLE, mmWave and phased array systems. Familiarity with MIMO, beamforming, and RF front-end module integration. Prior work in wearable, IoT, or AR/VR products.

Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world. Job Description Job Summary: We are seeking a highly motivated and technically proficient Systems & Applications Engineer to join our team. The ideal candidate will have hands-on experience in embedded systems, power management solutions, and customer-facing technical support. You will be responsible for system-level design, testing, and support for electronic components and applications, collaborating with cross-functional teams to deliver high-quality solutions. Key Responsibilities Provide system-level support for power management products. Collaborate with customers to recommend products, review schematics, and debug board layouts. Conduct lab testing and failure analysis to resolve device and application issues. Develop and release evaluation modules, PSpice models, and design calculators for new product launches. Create technical collateral such as application notes, videos, and design tools. Lead customer support initiatives through various platforms. Work with certification bodies (UL, IEC) to ensure compliance of devices. Mentor junior engineers and interns. Required Skills Proficiency in C, C++, Python, VHDL, MATLAB Experience with Embedded Systems, Raspberry Pi, PSpice, LTspice, HFSS, Altium Designer Strong analytical and debugging skills Excellent communication and collaboration abilities Familiarity with system-level design and testing methodologies Preferred Qualifications Published technical articles or patents in the field of electronics Experience in developing GUI applications for embedded platforms Knowledge of industry standards like UL2367, IEC62368-1/3 Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’ At Renesas, You Can Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s Shape the Future together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Job Title: LTCC/MLCC Designer Job Summary: We're seeking an experienced designer to join our team, specializing in the design and development of Low-Temperature Co-Fired Ceramic (LTCC) parts and Multi-Layer Ceramic Capacitor (MLCC) devices. The successful candidate will be responsible for designing and optimizing LTCC and MLCC components to meet customer requirements and industry standards. Key Responsibilities: 1. Design and Development: Design and develop LTCC and MLCC components, considering factors like electrical performance, thermal management, and mechanical reliability. 2. Material Selection: Select suitable materials for LTCC and MLCC design, including ceramic materials, conductors, and dielectric materials. 3. Simulation and Modeling: Use simulation tools to model and analyze LTCC and MLCC performance, including electromagnetic, thermal, and mechanical aspects. 4. Design Optimization: Optimize LTCC and MLCC designs for improved performance, reliability, and cost-effectiveness. 5. Collaboration: Work closely with cross-functional teams, including manufacturing, quality assurance, and sales, to ensure designs meet customer needs and industry requirements. 6. Documentation: Maintain accurate documentation of design processes, test results, and design specifications. Requirements: 1. Education: Bachelor's or Master's degree in Materials Science, Electrical Engineering, or a related field. 2. Experience: Proven experience in designing and developing LTCC and/or MLCC components, or similar experience in ceramic component design. 3. Technical Skills: Proficiency in simulation tools, such as finite element analysis (FEA) software, and experience with LTCC and MLCC design software. 4. Industry Knowledge: Familiarity with industry standards and knowledge of LTCC and MLCC applications in various industries. Preferred Skills: 1. Ceramic Materials: In-depth knowledge of ceramic materials and their properties. 2. LTCC and MLCC Design: Experience with LTCC and MLCC design principles, including design rules and manufacturing constraints. 3. Communication: Excellent communication and collaboration skills, with the ability to work effectively with cross-functional teams. 4. Familiarity with LTCC fabrication processes and MLCC manufacturing techniques 5. Expertise in material selection based on electrical, thermal, and mechanical performance 6. Experience in 3D modeling and simulation (thermal, electrical, and mechanical analysis) 7. Skilled in root cause analysis and design failure mode effects analysis (DFMEA) 8. Ability to optimize component performance under manufacturing and application constraints

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity Ltd. is a $16.5 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com Roles and Responsibilities: ROLE OBJECTIVE Executes complex simulations to optimize design and manufacturing. Develops complex Multiphysics simulation methods. RESPONSIBILITIES Leading the development and implementation of complex simulation models to optimize manufacturing designs or processes. Directing cross-functional teams to address and resolve intricate design and manufacturing issues. Analyzing complex simulation results to identify areas for improvement and driving design or process changes. Ensuring the maintenance and updating of simulation models to achieve optimal accuracy and relevance. Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy FEA Techniques implicit and explicit approach, using Software tools like Ansys Work Bench, LSDyna, Hypermesh, Simufact, Digimat etc Translate actual problem to Finite Element Analysis (FEA) model, interpret analysis results and select best solution which includes linear & non-linear analysis under different physics. Monitor and evaluate simulation software capabilities and industry trends. Collaborate with design & validation teams to enhance the design optimization. Understanding the influence/impact activities on financial decision. Education and Knowledge: BE/ B.Tech (Mechanical/Electrical) M Tech (Mechanical/Electrical) (preferred) Knowledge of product, design processes and methodology. Proficiency in state-of-the-art FEA- ANSYS WORKBENCH, LS-DYNA, HYPERMESH, SIMUFACT, MOLDEX3D, OPTISLANG, ICEPAK MAXWELL, Ansys HFSS System simulations such as MATLAB & SIMULINK. CAD tools- PTC Creo, Space Claim. Programming language - Python, Microsoft VB-script, Power IB. Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Knowledge about the Soldering, crimping & welding technologies. Knowledge on technical paper publications & applying for patents. Critical Experience and Competencies: 14-18 years of industry experience. Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Correlation of Test and simulation data / results. Expertise on CAE tools, Optimization techniques, and testing methods. Implementing of LEAN / 6 Sigma / Kaizen techniques to live projects. COMPETENCIES System and Product knowledgeThorough understanding of customer requirements, product and application needs, required for creating effective designs Market intelligenceA thorough understanding of market trends and technologies. Conceptual thinkingBeing able to see a broad picture, understand problems by putting the pieces together and simplify complex issues. Concern for order, quality, and accuracyAn underlying drive to reduce uncertainty by continuous risk assessments, taking accurate decisions, and continuously improve processes. Communication skillsFluent communication skills to be able to articulate well with customers and teams across different functions & locations. Internal stakeholder managementManage requests, address customer requirements and work effectively with different cross functional teams. Interpersonal skills and people managementSupervise and manage a team by ensuring compliance with rules and processes at TE and keep them motivated.

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity Ltd. is a $16.5 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com Role Objective and Responsibilities: ROLE OBJECTIVE To perform FEA tasks and provide suitable design recommendations to validate the design virtually. RESPONSIBILITIES Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy FEA Techniques implicit and explicit approach, using Software tools like Ansys Work Bench, LSDyna, Hypermesh, Simufact, Digimat etc Translate actual problem to Finite Element Analysis (FEA) model, interpret analysis results and select best solution which includes linear & non-linear analysis under different physics. Monitor and evaluate simulation software capabilities and industry trends. Deploy standardized process and work methodology. Train and develop capability of the team to be a mutli-skilled resource pool. Benchmark implement productivity improvement methods. Track monitor metrics for sustained performance covering quality & delivery. Collaborate with design & validation teams to enhance the design optimization. Understanding the influence/impact of my activities on financial decision. Education/Knowledge: BE/ B.Tech (Mechanical/Electrical) M Tech (Mechanical/Electrical) (preferred) Knowledge of product, design processes and methodology. Proficiency in state-of-the-arto FEA- ANSYS WORKBENCH, LS-DYNA, HYPERMESH, SIMUFACT, MOLDEX3D, OPTISLANG, ICEPAK MAXWELL, Ansys HFSS System simulations such as MATLAB & SIMULINK.o CAD tools- PTC Creo, Space Claim.o Programming language - Python, Microsoft VB-script, Power IB. Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Ability to understand specification for validation as per US CAR / LV 214 / Similar Specification. Knowledge about the crimping technologies, Ultrasonic welding technologies, Laser welding technologies. Knowledge on technical paper publications & applying for patents. Critical Experience and Competencies: 8-12 years of industry experience. Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Correlation of Test and simulation data / results. Expertise on CAE tools, Optimization techniques, and testing methods. Implementing of LEAN / 6 Sigma / Kaizen techniques to live projects. COMPETENCIES System and Product knowledgeThorough understanding of customer requirements, product and application needs, required for creating effective designs Market intelligenceA thorough understanding of market trends and technologies. Conceptual thinkingBeing able to see a broad picture, understand problems by putting the pieces together and simplify complex issues. Concern for order, quality, and accuracyAn underlying drive to reduce uncertainty by continuous risk assessments, taking accurate decisions, and continuously improve processes. Communication skillsFluent communication skills to be able to articulate well with customers and teams across different functions & locations. Internal stakeholder managementManage requests, address customer requirements and work effectively with different cross functional teams. Interpersonal skills and people managementSupervise and manage a team by ensuring compliance with rules and processes at TE and keep them motivated.

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. What your background should look like: Job Overview As a Hardware Engineer for TE Connectivity you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs.You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Responsibilities: Subject matter expert in high speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelors degree in Electrical Engineering, Masters degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Experience with signal conditioning techniques (equalization, amplification, FIRs, CTLEs) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies

Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelors degree in electrical or electronicsengineering, masters degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIRs, CTLEs) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Product Dvl Engineer in the Signal Integrity team you will focus on the electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industrytargeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Responsibilities: Subject matter expert in signal integrity design, simulation and validation activities through product development cycles Establishing signal integrity design performance/functional requirements for new products Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. Performing PCB design schematic and layout reviews Creating actionable recommendations based upon design reviews and simulation results Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement. Required Skills/ Experiences: Bachelors degree in Electrical Engineering or equivalent work experience 8 years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

The Group You’ll Be A Part Of In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam’s etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry. The Impact You’ll Make Join Lam as an Electrical Engineer and you'll be at the forefront, designing and developing electronic solutions for advanced applications. Your role involves designing and analyzing equipment, conducting experimental tests, evaluating results to create reliable cutting-edge solutions. In this role, you will directly contribute to ___. What You’ll Do Design and develop electrical systems, sub-systems, and/or solutions, applying engineering methods to design. Contributes to research and development efforts by collecting and analyzing data to improve electrical system designs. Assists with development of functional specifications for electrical/ electro-mechanical systems and power distribution components. Collaborate with cross-functional engineering design teams to design and modify custom and OEM system components. Perform hands-on test and validation utilizing lab equipment to characterization of the performance of the electrical/ electro-mechanical systems. Prepare high-quality reports and technical presentations to clearly communicate design intent, analysis, and results to diverse audiences in design reviews. Minimum Qualifications Who We’re Looking For Bachelor’s degree in Electrical Engineering or related field with 2+ years of experience; or an advanced degree without previous professional experience; or equivalent work experience. Hands-on experience in electronic circuit design (analog, digital), signal and controls theory, development and associated electrical board design, troubleshooting and validation. Understanding of AC/DC Power distribution systems. System level understanding of Electrical architecture, system integration, and applications. Working knowledge in Printed Circuit Board (PCB) and low voltage circuit design for power and control applications. Knowledge in application of power and controls technologies for systems automation. Knowledgeable in CAD tools for circuit design and simulation (e.g., PCAD, ORCAD, ZUKEN, AutoCAD, Spice, ADS, HFSS). This is a graduate eligible role. Preferred Qualifications Familiar with design for serviceability, manufacturability, reliability. Skilled at troubleshooting systems with tools like network sniffers, protocol analyzers, and tool logs. Understanding of troubleshooting with problem-solving techniques such as 5-why, 8D, fishbones, etc. Excellent oral and written communication skills including technical presentations. Our Commitment We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results. Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees. Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time. Show more Show less

Electrical Engineer (RF) Key Responsibilities Experience in the simulation, design of RF and microwave circuits and subsystems. Experience in operating RF / MV and electronics test and measuring equipment Experience with tools such as ADS and HFSS. Experience with measurement of RF and microwave circuits using VNAs . Interfaces with internal and external customers regarding complex electrical issues for specific projects Implement concepts for wide range of complex product issues and solutions Generate product specifications with limited to no supervision Specify and/or perform engineering analysis of complex scope Define, coordinate, perform and generate engineering test reports Functional Knowledge Demonstrates expanded conceptual knowledge in High power RF domain and broadens capabilities Education: Bachelor's Degree in Electronics and Communication or Microelectronics Experience: 3-6 Years in RF components design and testing (high power preferred) Please share your resumes at anjali.sinha@ust.com with ctc, E ctc, Np details. Show more Show less

Who Are We Looking For We are seeking a skilled and motivated RF engineer with a focus on drone and anti-drone technologies. The ideal candidate will have a strong background in RF systems design, testing, and integration, specifically in applications related to unmanned aerial vehicles (UAVs) and counter-UAV solutions. This role involves working closely with cross-functional teams to design, develop, and implement cutting-edge RF solutions that address emerging challenges in drone and anti-drone systems. What You Will Be Doing Key Responsibilities RF Design & Development: Design and simulate RF circuits and subsystems, including amplifiers, filters, mixers, oscillators, and antennas for drone communication and counter-drone technologies. Signal Analysis: Analyze RF signals for detection, identification, and tracking of UAVs, ensuring optimal system performance in diverse environments. System Integration: Integrate radar and RF subsystems into larger platforms, ensuring seamless performance and interoperability. Testing & Validation: Conduct lab and field tests for RF systems, troubleshooting performance issues and implementing necessary optimizations. R&D: Research and develop new RF technologies to enhance drone communications and counter-drone capabilities. Collaboration: Work closely with software, hardware, and system engineering teams to ensure seamless integration of RF systems. Compliance & Documentation: Ensure systems meet regulatory standards and prepare technical documentation, including test reports, system designs, and user manuals. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Telecommunications, or a related field. 3-4 years of experience in RF system design, development, and testing, preferably in drone and/or anti-drone projects. Proficiency in RF simulation tools (e.g., HFSS, CST, ADS) and test equipment (e.g., spectrum analyzers, network analyzers, signal generators). Strong understanding of antenna design, propagation models, and RF circuit design. Experience with communication protocols and technologies used in UAVs, such as LoRa, Wi-Fi, GPS, or SDRs (Software-Defined Radios). Familiarity with counter-drone techniques, including RF jamming and spoofing. Knowledge of EMI/EMC compliance standards and mitigation techniques. Strong analytical and problem-solving skills with attention to detail. Bonus Points for Familiarity with What We Offer A dynamic work environment with opportunities to work on cutting-edge technologies. Collaborative and innovative team culture. Professional growth and development opportunities. Competitive compensation and benefits package. Educational Requirement Preferred Qualifications Knowledge of antenna design and characterization. Familiarity with AI/ML applications for RF signal processing. Experience in developing software for RF systems using Python, MATLAB, or similar tools. Experience with radar systems for specific applications (e.g., automotive, defense, weather monitoring). Working Days Monday - Friday Show more Show less

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JR71678 Senior Engineer, Signal Integrity Do you want to be a part of the Inclusive culture? Micron’s Signal Integrity Research and Development (SI R&D) group supports all current and future product development, including DRAM, LPDRAM, NAND, CXL, LPCAMM, DIMM modules and SSDs within the consumer, server, mobile, networking, graphics, automobile and embedded businesses. The SI R&D group works on analysis of end-to-end systems solutions including, but not limited to circuit level IO and Power Distribution, integrated circuit (IC) packages, printed circuit boards (PCBs) and measurements to ensure good Signal Integrity (SI) and power integrity (PI) performance for Micron’s memory solutions. The group owns all steps of the signal and power integrity support process including die IO and package model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support. The group also supports future specification development within several industry standards groups including but not limited to JEDEC, ONFI, and IBIS. The group working environment is technically exciting, team-oriented, collaborative and customer-centric. Within the larger SI R&D group, as an Engineer in the Signal Integrity team at Micron, you will be responsible for Working on various aspects of SI and PI for high-speed interfaces, including modeling (silicon, package and board level signal and power delivery network, as necessary for the project), time and frequency domain analysis for SI and PI electrical performance evaluation of Micron products and correlation to measurement for the various products. Ensuring that processes for various methodologies are performed optimally and accurately. Collaborating with TMs within the global SIRD group for development and continued optimization of methodologies for modeling and analysis as needed. Representing the SI R&D team in technical cross functional collaborative groups, and integrating with package design, silicon design, product engineering, and marketing departments to ensure overall product performance. Occasionally Supporting FAE, applications engineers with models for service to external customer as needed Occasionally Supporting path-finding activities through modeling support. Qualifications Successful candidates for this position will have: Bachelors or Masters in Electrical/Electronics Engineering with 4-8 years of proven experience Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience. Strong SI/PI/EMI theory and application, modeling, analysis, simulation Signal and Power Integrity Background Experience with, and intermediate solid understanding of E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS, etc.. Deep understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single-ended interface technologies. Deep understanding of timing budgets and jitter analysis Expertise in Printed Circuit Board (PCB) layout or electrical package design techniques. Experience in design and analysis of high-speed single-ended or differential buses. Familiarity with, and fundamental understanding of lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc. Familiarity with statistical analysis (DOE) and equivalent tools (example: JMP) is also beneficial. Ambitious candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal interpersonal skills, and have the ability to work well in a team with varied strengths. Experience with PCIe Gen5/6, UFS 5, NAND, LPDDR5/6, DDR5/6 interfaces. Experience in system and package level optimization and analysis. Strong problem-solving skill to debug the signal integrity related issues. Successful candidates for this position will be: Pro-active – Candidate will be expected to identify gaps and opportunities and address them with minimal direction. Collaborator – Candidate will be expected to work with various teams globally, and support both internal as well as external customers. Communicator – Candidate should be able to clearly convey vital details of complex issues and corresponding solutions in both written and verbal formats. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description The Staff Packaging engineer will be an individual contributor and should be able to perform package design related to flash memory products As a IC packaging engineer, you will work in the Packaging R&D group on package deign, modeling and simulation across semiconductor packaging, flash memory product, and host levels. ( mainly on BGA / system in packages ) In this position, you will be responsible for influencing package and product design and advancing the technology of semiconductor packaging generally. Scope is to address all design aspects of packaging technology and associated material and process interactions. Knowledge of semiconductor assembly process is required ( back grinding , dicing , Die attach , wire bonding, molding , laser marking , laser cutting , singulation , solder ball attach , reflow , SMT, testing ) Higher Die stacking and its wire bonding / molding concept to be known Focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects and higher power. Candidate will be responsible for the modeling and simulation of mechanical responses of the IC package and flash products using analytical and computational tools. Working knowledge on AI/ML , data science must This position will interface with package & product design, electrical and physical characterization, lab testing, failure analysis, assembly R&D and other process teams. Interacting with internal engineering departments, vendors and customers to develop high performance leadership package Ability to daily multi-tasking in different projects, manage and meet tight deadlines of packaging deliverables as a part of multidisciplinary team as well as excellent communication and interpersonal skills required. Knowledge of Package signal integrity and power integrity principles would be good. Knowledge of EMI, HFSS, HSPICE is a plus. Hands-on with oscilloscopes, network analyzers and spectrum analyzers also a plus Skills in AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques are good. Qualifications B.Tech or M.Tech in mechanical / microelectronics / mechatronics / Thermal/ electronics engineering Solid knowledge through academic coursework subjects Background in applied mechanics with emphasis on both analytical and computational methods. AutoCAD must Broad knowledge of mechanical behaviours of various material types, such as ceramics and glass, polymers, and metals (e.g., solder). Strong oral and written communication skills. Demonstrated strong work ethic. Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. Show more Show less

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Solid understanding of Electronics engineering fundamentals, PCB manufacturing process, Mixed-signal and RF circuit analysis techniques. Knowledge of RF & Mixed Signal PCB design, test board debug and using CAD software such as Mentor Graphics DA or Cadence Allegro is mandatory Good understanding of Si-Pi for board designs and ability to use simulation tools like HFSS, ADS, Power SI is mandatory Good knowledge of RF & Digital measurement techniques like S-parameters, TDRs, Eye analysis, jitter, isolation etc. Good ASIC device level characterization skills. System level knowledge is a plus. Able to work comfortably with lab equipment like Oscilloscopes, Network Analyzer, Spectrum Analyzer, Signal Generator, Digitizer etc is a plus Good software skills for writing codes for automation using Python is a plus. Able to communicate clearly, organize effectively and document work thoroughly while working with local and global teams.

Job Area: Engineering Group, Engineering Group > Hardware Systems Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital and RF transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Systems Engineer, you will design a complete framework or system that influences the shaping of state-of-the-art mobile, edge, auto, AR/VR, compute, IOT, wearable products. Qualcomm Engineers collaborate with cross-functional teams (e.g., design, software, testing teams, etc.) to identify hardware testing needs and integrate components into products or systems. Minimum Qualifications: Bachelor's degree in Engineering or related field. Successful candidate for this position will join a hardware design team in Hyderabad developing digital platforms and mixed-mode wireless devices utilizing Qualcomm MSMs, RFICs, and power management ASICs for in-house design verification, software/firmware development, and customer reference designs. Candidates should have knowledge on high speed board design concepts, Solid electrical engineering, digital & analog circuit fundamentals, and should have lab skills. knowledge of transmission lines, cross talk, decoupling, low-power supply design, and layout of high performance PWBs is desired. Familiarity with modems, DSPs, microprocessors, memories, LCDs, camera sensors, batteries, and other consumer electronics hardware is desired. Job description: 0 - 3 years of relevant experience. High-speed board design, schematic design, layout reviews, test and integration, and maintaining hardware through the product cycle. Platforms may also incorporate ARM processors, graphics engines, digital audio, USB OTG, Bluetooth, GPS, SPI, I2C, DDR, MIPI, MDDI, and LAN functionality and candidate should have knowledge on these interfaces. Candidate must quickly assimilate onto a specified project, read/write technical specifications/requirements, develop/refine hardware designs, apply integration/lab skills, demonstrate strong problem solving abilities, and work closely with software and RF engineers to actively contribute toward the evolution of a shared platform. Candidate should support bring-up for MSMs and has to run the DVT and MTP performance testing for IPS projects. Additional Extensive knowledge of developing automation scripts based on Python Good working knowledge of EDA tools like HFSS, ADS Must be good at C , C++ programming & Matlab