Posted:4 days ago|
Platform:
Work from Office
Full Time
Main tasks: Carry out multi-layer BGA substrate designs (wire-bond, Flip-chip or System-in-Package) meeting signal/power/thermal requirements and assembly design rules on package level within Infineon s product development projects Recommend packaging solutions and conduct feasibility studies to advise optimum pad layout, interconnect types and substrate parameters for a specific IC device or application Co-work with simulation engineers to verify the electrical/thermal package performance Candidate profile: A degree in electrical engineering, mechatronics, physics or a comparable education Min. 3-5 years of experience in semiconductor package design Know how in design of different package technologies (lead frame, BGA, FCIP ) preferably with focus on microcontroller applications Solid working experience with the package design tool Cadence SIP Experience in assembly engineering or production would be beneficial Self-organized and independent working style Very good English language skills Bga, Cadence, Multilayer Design
Rarr Technologies
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