Posted:1 week ago|
Platform:
Work from Office
Full Time
Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle.
Conducting SI COE analysis, includingo Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.o Modeling the connector with the consideration of manufacture impact and application impact.o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community.Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance.Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation.Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures.Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization.Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response.Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs.Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards.Bachelors degree in Electrical Engineering.Should have total work experience of 3-5+years.Minimum of 5+ years of work experience in a signal integrity engineering role or related experienceMinimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design(high speed twinax cables, direct attach copper (DAC) cables)Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT).A solid understanding of statistical analysis and AI training.A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behaviorStrong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection.Familiar with at least one programming language, such as Matlab, python, C++, VB, etc.Excellent verbal and written communication skills.
TE Connectivity
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