Posted:1 month ago|
Platform:
Work from Office
Full Time
Job Description Our Package Design Engineering team is seeking a talented Staff Engineer with expertise in thermal management, based at our Milpitas, CA, USA site. In this role, you will be pivotal in driving innovation in thermal design for our high-performance flash products, as well as developing and maintaining advanced simulation tools. ESSENTIAL DUTIES AND RESPONSIBILITIES: Work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level. Innovate thermal management solutions for high-performance flash products Enhance and maintain our modeling and simulation infrastructure to improve efficiency and accuracy across the design and manufacturing processes. This position may interface with package & product design, electrical, thermal and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams. Qualifications REQUIRED: Ph.D. in Mechanical Engineering, or M.S. in Mechanical Engineering plus >2 years of relevant industrial experience. Solid knowledge through academic coursework or research
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