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2.0 - 7.0 years

8 - 13 Lacs

Kanpur

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Job Description: Job Title: Electronics Engineer Medical Devices Location: IIT Kanpur, UP / Delhi NCR Company Name: Lenek Technologies Pvt Ltd Company Website: https://www.lenektech.com/#/ LinkedIn Website: http://www.lenektech.com/ Experience: 2+ years preferred (Exceptional freshers may also apply) Job Role: Design of Mixed Signal PCB ranging from 2 to 20 layers Circuit simulations using Matlab or LTSpice PCB simulations for thermal management, signal integrity and power integrity Circuit design and component selection Firmware programming Board level testing, system integration and product level testing Portfolio we are looking for: Bachelor's or master’s degree in Electronics, Electrical, or related disciplines Experience in PCB design and circuit simulation tools (LTSpice, PSpice, etc.) Strong foundation in embedded systems and firmware development (C/C++) Familiarity with analogue signal processing, data converters (ADC/DAC), op-amps Understanding of EMI/EMC, grounding, and safety in medical electronics (preferred) Excellent debugging and documentation skills Experience in design, development, and deployment of analogue and digital hardware electronics systems working with engineers, technicians, vendors and management stakeholders. Hands-on experience and working knowledge of ECAD packages like KiCAD/Altium Designer/PADS/OrCAD/ Hyper Lynx/ Cadence/Eagle, etc. and simulation tools like Matlab/ LTSpice/Ansys, etc. Knowledge and understanding of laboratory instruments like Oscilloscope, Spectrum Analyzer, Function Generator, etc Active participation in electronics technical communities.

Posted 1 week ago

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2.0 - 5.0 years

2 - 5 Lacs

Gurugram, Bhiwadi

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Design, simulate, test, and debug analog/digital/RF circuits Create schematics Work closely with PCB layout engineers and manage design flow Selection of components, create & optimize BOM Perform hardware testing & debugging Use Oscilloscope, Logic Analyzer, Multimeter, Function Generator Ensure RoHS, IEC, ISO, EMI/EMC compliance Perform thermal and signal integrity analysis

Posted 3 weeks ago

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2.0 - 4.0 years

6 - 10 Lacs

Bengaluru

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Role & responsibilities High-Speed PCB Design: Develop PCB layouts for high-speed systems, including DDR, PCIe, USB, Ethernet, and other high-frequency interfaces. Signal and Power Integrity: Perform signal and power integrity analysis to ensure optimal design performance. Layer Stack-up Design: Define PCB stack-ups and impedance-controlled designs for high-speed and high-density applications. Simulation and Validation: Use simulation tools to validate designs for crosstalk, impedance matching, and high-speed signals. Component Placement and Routing: Optimize placement and routing strategies to meet performance, manufacturability, and cost requirements. Design for Manufacturing (DFM) and Test (DFT): Collaborate with fabrication and assembly teams to ensure manufacturability and testability of designs. Documentation: Generate detailed design files, BOMs, and fabrication documentation. Compliance: Ensure designs adhere to industry standards (e.g., IPC-6012, ISO 9001) and regulatory requirements. Collaboration: Work closely with hardware, firmware, and system engineering teams to meet project requirements. Preferred candidate profile Bachelors degree in Electrical Engineering, Electronics, or a related field. 3+ years of experience in PCB design with a focus on high-speed digital and RF designs. Expertise in Altium for PCB Design Strong knowledge of signal integrity, power integrity, and EMI/EMC design principles. Proficiency in high-speed interfaces (DDR3/DDR4/DDR5, PCIe, SerDes, etc.). Familiarity with simulation tools like HyperLynx, Ansys, or SIwave for signal and power integrity analysis. Hands-on experience with impedance-controlled designs and differential pair routing. Solid understanding of PCB fabrication and assembly processes.

Posted 4 weeks ago

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