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Engineer Thermal Simulation PCB & Package

3 - 6 years

6 - 10 Lacs

Posted:1 week ago| Platform: Naukri logo

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Work from Office

Job Type

Full Time

Job Description

Main tasks:
  1. Execution of thermal simulations for the characterization and verification / design approval of semiconductor packages and systems

  2. Carry-out

    thermal system simulations

    based on customer requests
  3. Generation of

    3D package models (STEP files)

    to carry out thermal simulations at the customer
Candidate profile:
  1. A degree in electrical engineering, mechatronics, physics or a comparable education
  2. Min. 3-5 years of experience in thermal simulation of Printed Circuit Boards (PCBs) and packages

  3. Knowledge of different package technologies (lead frame, BGA, FCIP )
  4. Solid working experience

    with the simulation tool

    Ansys Icepak

  5. Self-organized

    and independent

    working style

  6. Very good English language skills
Simulation, Ansys, Thermal

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Rarr Technologies
Rarr Technologies

Information Technology

San Francisco

50-100 Employees

510 Jobs

    Key People

  • Jane Doe

    CEO
  • John Smith

    CTO

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