Photonics Die Attach Engineer

Joining our team would be beneficial for you if you have previous expertise working in silicon photonics die attachment engineering. As a Photonics Die Attach Engineer, you will be responsible for creating and executing die attach methods for photonics devices such as silicon dies, laser diodes, optical modulators, lens, and photodiodes. Working closely with the global SME team and research and development team, you will contribute to the creation and development of new products. Your role will involve optimizing the die attach process to achieve high yields and high reliability, along with supporting the process development independently all the way to mass production. Your key responsibilities will include developing die attachment methods for silicon photonics devices using diverse methodologies such as eutectic bonding, epoxy dispensing, silver sintering, and soldering. It will be crucial to improve die attachment techniques to ensure high yields and dependability. Collaborating with the SME team and customers, you will support the development of new products. Additionally, you will work with manufacturing teams to establish and scale up die attachment techniques in a production setting, ensuring mass production process capabilities are optimized. You will be responsible for creating and maintaining documentation for die attachment processes, conducting Design of Experiment (DOE), and optimizing process parameters and materials. Monitoring and enhancing die attachment methods to maintain quality and performance consistency will be essential. Evaluating process data, conducting corrective steps, and collaborating with quality and reliability teams to meet client specifications and industry standards will also be part of your role. To qualify for this role, you should have a bachelor's degree in materials science, electrical engineering, or a related field, along with at least 5 years of experience in developing and improving photonics die attach processes. A deep understanding of materials, processes, and tools used for die attach is required, as well as familiarity with automated die attach processes, flip-chip die attach, optical alignment techniques, statistical process control, and process optimization techniques. Strong problem-solving skills, communication, teamwork, and documentation abilities are essential, along with knowledge of industry standards for making photonics devices. Staying updated on the latest advancements in die attach technology and applying this knowledge to enhance processes and products will be expected in this role.,