STAFF - PCB Simulation Engineer

• Development of Solutions: develop new ideas, methods and solutions for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents. Manage workload, project allocation, and career growth for team members.
• Simulation Methods and Practices: define and implement simulation methodologies and best practices for accuracy, efficiency, optimizations and recommendations across all PCB simulation projects.
• Technical guidance: provide technical direction to simulation engineers on simulation tasks and result interpretations on signal integrity (SI) for high-speed interfaces like DDR and PCIe, power integrity (PI) for efficient power delivery, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal management. Provides training and mentorship to less-experienced employees.
• Simulation review and validation: review simulation inputs, results and analysis providing strategic recommendations to optimize PCB performance and reliability. Cross-functional collaboration:
• collaborate with colleagues/peers, global hardware, mechanical, and manufacturing teams to understands the interrelationships of different disciplines and translate product requirements into viable PCB simulations. Explain effectively to cross-functional teams, customers and suppliers on simulation results and risks.
• Continuous improvement: Drive innovation and improvement in the PCB simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.
• Quality Metrics:
• Provide direction and guidance on accuracy in simulations, design of experiments (DoE), plausibility check and sensitivity study of simulations, cross-correlation of simulation results with experimental results, and design optimizations for first time right manufacturability (prototypes and mass production).

Education:

Experience:

• Around 8-10 years of extensive hands-on experience in high-speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines. Deep functional and foundational knowledge on printed circuit board layout, libraries and schematics, routing and manufacturability.
• Technical Skills: Expertise with simulation tools for high-speed electrical and thermal analysis Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS. Deep understanding of high-speed digital design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
• Strong understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS. Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).