Posted:1 day ago|
Platform:
On-site
Full Time
MaxLinear is a fabless semiconductor company providing systems-on-chip (SoC) solutions for broadband, mobile and wireline infrastructure, data center, and industrial and multi-market applications. Our engineering excellence, innovation, and execution enable customers to achieve competitive advantages such as shorter design cycles, significant design flexibility, and low system-level costs. Utilizing low-cost CMOS process technology, our solutions integrate analog and digital functionalities delivering high performance, low manufacturing cost, and reduced power consumption. Our vision is to revolutionize the way the world connects and communicates.
MaxLinear is seeking a Principal Signal & Power Integrity (SI/PI) Engineer to join our growing team. In this role, you will focus on the following:
Development of state-of-the-art packages and printed circuit boards (PCBs) for MaxLinear’s next generation products
Perform SI/PI simulations and optimization to ensure critical signals meet their required specifications
Design and simulate high-speed signal interfaces and power distribution networks (PDN) for advanced communications SoC packages and PCBs
Work on a diverse set of products and applications including RF/mm-wave modems and transceivers, 5G communication, wireless connectivity, and optical communications (PAM4 800G/1.6Tbps DSPs and TIAs) for data center connectivity and storage for AI applications.
Qualifications -
Bachelor’s or Master’s degree in EE or related fields with 14 +years of SI/PI experience or PhD in EE or related fields with 8+ years of SI/PI experience
Deep understanding of Electromagnetic fundamentals, transmission lines, and microwave theory
Experience designing and simulating signal and power integrity solutions for high-speed system components (packages, PCB, connectors)
Experience with high-speed channel simulations for SerDes and transient simulations for SI and PI
Understanding of S-parameters, Smith Chart, and frequency domain analysis
Proficiency in use of 2.5D and 3D simulation tools such as ANSYS HFSS, SIwave, Cadence Sigrity tools, or similar field solvers
Expertise in time and frequency domain analysis using simulation tools like ADS, SPECTRE, etc.
Hands-on experience with lab measurement equipment like Spectrum Analyzer, Vector Network Analyzer (VNA), Oscilloscopes, TDR, etc.
Ability to manage package development in collaboration with cross functional teams including systems, IC design, IC physical layout, package/PCB layout, and test/characterization teams
Self-motivated with ability to work effectively in both independent and team settings
Strong communication, presentation, and documentation skills
Excellent problem-solving skills; Ability to excel.
MaxLinear
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