Chip Design Engineer Dynpro India Pvt. ltd

5.0 - 12.0 years

0 Lacs

karnataka

On-site

You are looking for an IC Package Design Engineer with experience in Flip Chip package design. As an IC Package Design Engineer, your responsibilities will include: - Having experience with Cadence APD IC Package Design, specifically with Flip Chip package design. - Demonstrating a good understanding of package/substrate design and package assembly rules related to flip chip designs. - Being exposed to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D, etc., which would be an added advantage. - Showcasing expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. - Having hands-on expertise with PCB designs involving High-Sp...

Posted 2 weeks ago

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Title DynPro Chip Design Careers Dynpro India Pvt. ltd

5.0 - 12.0 years

0 Lacs

karnataka

On-site

You are hiring for the position of IC Package Design Engineer with experience in Flip Chip package design. As an ideal candidate, you should have 5 to 12 years of experience in Cadence APD IC Package Design. Your responsibilities will include: - Good understanding of package/substrate design and package assembly rules related to flip chip designs. - Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., will be an added advantage. - Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. - Hands-on expertise with PCB designs involving High-Speed Parallel Bus interfaces including DDR, GDDR, and HSIO interfaces...

Posted 2 weeks ago

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Signal Integrity and Power Integrity Engineer Capgemini

7.0 - 11.0 years

0 Lacs

hyderabad, telangana

On-site

Role Overview: As an SI Simulation Engineer at Capgemini Engineering, you will be responsible for performing high-speed Signal Integrity (SI) and Power Integrity (PI) simulations and testing across advanced interfaces and platforms. You will collaborate closely with design and layout teams to ensure optimal signal performance and reliability in complex hardware systems. Key Responsibilities: - Perform pre- and post-layout SI/PI analysis for die, package, and board-level designs. - Conduct simulations using IBIS/IBIS-AMI models and analyze eye diagrams to recommend equalization settings. - Analyze S-parameters including insertion loss, return loss, crosstalk, and TDR. - Provide layout constra...

Posted 3 weeks ago

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Senior PCB Design Engineer / Technical Lead - PCB Design Engineering Sanmina Corporation

4.0 - 8.0 years

0 Lacs

chennai, tamil nadu

On-site

Role Overview: You will be responsible for analyzing technical requirements and customer input to execute Layout Engineering. Your main tasks will include converting schematics to PCB layout, stackup design, layer planning, and ensuring design considerations for EMI/EMC, thermal, and mechanical performance enhancement. Additionally, you will design complex and multi-layer PCB boards using Cadence Allegro and Altium Designer Tool. Your technical expertise will be crucial in handling projects independently, implementing DFx processes and comments, and ensuring on-time quality deliverables. You will also need to be a flexible team player who can interact effectively with other team members and ...

Posted 1 month ago

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